Advanced Packaging Conference (APC)

Wednesday, November 11 | 8:15 am - 5:30 pm
ICM Munich, Room 14a

 

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Power and Interconnects Innovations Enabling AI System Performance

Advanced packaging (AP) and test innovations are key to sustaining system-level performance scaling as traditional device scaling reaches its limits. In 2026, AP is central to next-generation electronics, enabling higher integration density, better power efficiency, and improved thermal and signal performance across HPC, AI, automotive, 5G/6G, and edge applications.

Through 2.5D/3D integration, chiplet architectures, heterogeneous integration, and advanced substrates and interconnects, the industry can significantly increase compute, bandwidth, and functionality while reducing power consumption. Innovations in materials, backside power delivery, fine-pitch interconnects, and chip–package–system co-design are becoming critical differentiators.

At the same time, sustainability and supply chain resilience are increasingly important, with a focus on lifecycle impact, resource efficiency, circularity, and regional manufacturing ecosystems. Advanced packaging is evolving from a back-end process into a strategic enabler of system architecture and value chain differentiation.

At this year’s Advanced Packaging Conference (APC), we bring together leading experts from academia, industry, and government to discuss the latest trends, challenges, and innovations shaping the field.

 

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SEMI Europe Advanced Packaging Conference (APC) Committee:

APC Committee

 

 

  • Steffen Kroehnert – ESPAT-Consulting (Chair)
  • Jan de Koning Gans – Cosmic Services Germany GmbH (Co-chair)
  • Frank Kuechenmeister – GlobalFoundries (Co-chair)
  • Jonathan Abdilla – Besi
  • Mark Anthony Azzopardi – JCET
  • Roberto Antonicelli – JCET
  • Tanja Braun – Fraunhofer IZM
  • Jayakrishnan Chandrappan – CSA Catapult
  • Ruud de Wit – CITC - Chip Integration Technology Center
  • Andreas Grassmann – Infineon
  • Ingo Henkel – Robert Bosch
  • Emilie Jolivet – Yole Group
  • Sylvie Joly – CEA-Leti
  • Cassandra Koenig – Advantest
  • Jerome Lopez – STMicroelectronics
  • Andy Miller – IMEC
  • Pascal Oberndorff – NXP
  • Thomas Oppert – PacTech
  • Dirk Rohde – Atotech
  • Mario Saliba – Henkel
  • Andre Schenk – Evatec
  • Ralf Wombacher – AMS-OSRAM

 

 

Engagement Opportunity – APC–FMF Expo

Exhibit at the APC–FMF Expo

Messe Munich – International Conference Center (ICM), Foyer 1st Floor 
Wednesday, 11 November 2026
Day 2 of SEMICON Europa

Secure your turnkey booth alongside the paid Advanced Packaging Conference (Room 14a) and Fab Management Forum (Room 14c).

Staggered breaks and lunch periods maximize face-to-face networking with a paid-access audience from both conferences. During concurrent APC and FMF sessions, your team has built-in time to visit the full SEMICON Europa exhibition on the main showground.
 

Targeted access. Dual opportunity. Stronger ROI.


 

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Agenda