Douglas Yu

Dr. Douglas Yu is Vice President of Pathfinding for System Integration at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to his appointment as Vice President in 2016, Dr. Yu was Senior Director of the Integrated Interconnect & Packaging Division. 

Dr. Yu joined TSMC in 1994, serving in a variety of roles throughout his career including backend R&D, and developed technologies critical to the Company’s highly successful transition to copper process at the 0.13 micron generation. Dr. Yu also pioneered TSMC’s wafer-level system integration technologies, including Chip on Wafer on Substrate (CoWoS®), Integrated Fan-Out (InFO), and TSMC System on Integrated Chips (SoIC™), as well as their derivatives. 

Prior to joining TSMC, Dr. Yu was a Member of the Technical Staff and Project Leader at AT&T Bell Labs in the USA, working on the sub-micron process, device and integration technologies R&D from 1987 to 1994. 

Dr. Yu became a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013 and received the Presidential Science Prize of Taiwan in 2017 as well as the IEEE EPS Outstanding Manufacturing Technology Award in 2018. He has received more than 1,800 worldwide patents while serving at TSMC. 

Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and his Ph.D. in Materials Engineering from Georgia Institute of Technology.