Bernhard Knott
Head of the Infineon Technologies Backend Innovation Group Infineon
Bernhard Knott is the Head of the Infineon Technologies Backend Innovation group. He is responsible for new Package Concepts, Prototyping, new Materials, Simulation and Virtual Prototyping. Until 2016 he was leading the Package Development for Sensors and Waferlevel Package Development in Regensburg, Germany. Prior to joining the Backend Organization, he held several Management Positions in Frontend Technology dealing with BiCMOS Technologies, Sensors and Innovation projects. After receiving his Diploma in Physics from the University of Regensburg, he started his career in Semiconductor Industry in 1997 by developing an embedded NVM Technology. Bernhard holds several patents and patent applications in the area of FE Technology, Sensors and Packaging.