Advanced Packaging: From Strategic Imperative to Scalable Reality in Europe
| Powered by | |
 |
Advanced semiconductor packaging has become a key driver of performance, integration, and competitiveness as front-end scaling reaches its limits. Technologies such as heterogeneous integration, chiplets, fan-out, and panel-level packaging are driving new system-level gains across high-performance computing, AI, industrial, and automotive applications. Increasingly, advanced packaging is no longer just an enabler—it is a key differentiator.
In Europe, advanced packaging is now a priority under the EU Chips Act, supporting ambitions for resilience, performance leadership, and sustainable growth. At the same time, rising system complexity and power density create new challenges in thermal management, materials performance, and process control, making industrialization at scale a critical issue.
This session combines complementary perspectives from Porsche Consulting and Entegris, linking strategic market drivers with the materials and process innovations required for scale. It will conclude with a panel discussion bringing together industry executives to explore how Europe can bridge the gap between innovation and industrialization, and secure advanced packaging as a cornerstone of future competitiveness.