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Rozalia Beica

Rozalia Beica

Chief Sales Officer, Semiconductor Division, AT&S

Rozalia Beica is currently the CSO of Semiconductor Division, focusing on semiconductor and module activities within AT&S. Prior to AT&S she had several executive and C-level roles with various organizations across the supply chain: electronic materials (Rohm and Haas Electronic Materials, Dow & DuPont), equipment (Semitool, Applied Materials and Lam Research), device manufacturing (Maxim IC) and market research & strategy consulting firm (Yole Developpement). Rozalia is actively involved in various industry activities. Some of the current engagements include: Member of the Board of Governors for IEEE Electronics Packaging Society and Vice General Chair of 71th ECTC, Chair of the Heterogeneous Integration Roadmap WLP Technical Working Group, Chair of the Semi Strategic Materials Conference, Technical Chair of System in Package China Symposium, Advisory Board Member 3DinCites and IMPACT Taiwan. Past activities: IMAPS VP of Technology, General Chair IMAPS DPC, Program Director EMC3D Consortia, General Chair Global Semi & Electronics Forum, Technical Advisory Board Member SRC, several other memberships in industry committees. Rozalia has over 150 presentations & publications, including 3 book chapters on 3D Integration. Rozalia has a M.Sc in Chemical Engineering (Romania), a M. Sc. In Management of Technology (USA) and a Global Executive MBA from IE Business School (Spain).


Advanced Packaging Conference (APC)

Wednesday, November 11 | 9:00 am - 6:40 pm
International Congress Center (ICM)