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Thorsten Meyer

Thorsten Meyer

Lead Principal Engineer, Infineon Technologies

Thorsten Meyer is Lead Principal Engineer Package Concept Engineering at Infineon Technologies in Regensburg, Germany, responsible for New Package concepts. Until March 2015 he was leading the Package Technology and Innovation department at Intel Mobile Communications (IMC) in Regensburg. Prior joining IMC, he was overall project leader for the development of Wafer Level Packaging Technologies at Infineon in Regensburg and earlier in Dresden.Thorsten is author of multiple publications and holds more than 150 patents and patent applications in the area of advanced packaging.

Sessions

Advanced Packaging Conference (APC)

Wednesday, November 11 | 9:00 am - 6:40 pm
International Congress Center (ICM)