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Future Fab Day

Thursday, November 12 | 12:00 pm - 5:00 pm
TechARENA, Hall C1
SMART Manufacturing

Future Fab Day - The World of Smart Manufacturing


Semiconductor Integrated Circuits have become ubiquitous in our modern world, with all aspects of our lives being assisted and enhanced by their presence.  These positive life experiences have driven an un-ending hunger for even more applications and experiences, requiring a constant innovation to realise next generation leading-edge devices and process technologies.  Our industry is therefore responsible for the high-volume manufacturing of arguably the most complex devices known to human-kind, in an environment where safety, quality and output critical success indicators may not be compromised.

During the last years, manufacturing in general has been dramatically changing due to technology implementation, customer demands and competition, largely driven by the influence of the digital technologies evolution described above.  We are now experiencing a time in history aptly named the “4th Industrial Revolution” where a significant element of “cyber-physical systems” introduction is enabling a disruptive impact on manufacturing capabilities and efficiencies.

Industry 4.0 (the Industry program to deliver the 4th Industry revolution) can be represented by a number of key vertical technology pillars, including data analytics and Artificial Intelligence (AI), integrated sensors, autonomous robots and cobotics, Augmented Reality and Virtual Reality (AR/VR), and additive manufacturing.  Horizontal enabling programs, such as skills and competencies training, cyber security, cloud and edge computing systems integration and standards, and Circular Manufacturing, encompassing environmental and sustainability initiatives, are then necessary to fully realise the impactful benefits of the technology innovations.

This “Future Fab – The World of Smart Manufacturing” TechARENA day is designed to showcase some of the latest Industry 4.0 innovations and future trends, and their relevance to our world-class high volume semiconductor manufacturing industry and downstream industries, especially electronics manufacturing.  


Steering STC (Semiconductor Technology Committee) Members

  • Michael Arnold, PEER Group
  • Erich Biermann, Robert Bosch GmbH
  • Patrick Bressler, Fraunhofer Gesellschaft
  • Joerg Stephan, Fraunhofer Gesellschaft
  • Pietro Cantu, STMicroelectronics
  • Bernie D. Capraro, Intel
  • Johan Dekoster, imec
  • Karl Hornik, Infineon
  • Winfried Kaiser, Zeiss
  • Gabriel Kittel, X-FAB
  • Wilfried Lerch, SkyLark.Solutions
  • Didier Louis, CEA-Leti
  • Philippe Monnoyer, VTT
  • Laurent Pain, CEA-Leti


  • Thomas Passler, Applied Materials
  • Markus Pfeffer, Fraunhofer IISB
  • Ionut Radu, Soitec
  • Stephan Raithel, DAS Environmental Expert 
  • Fred Roozeboom, TU Eindhoven
  • Hessel Sprey, ASM International


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