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Show floor TechARENA

Show floor TechARENA

TechARENA Event Overview 
>> DOWNLOAD PRESENTATIONS

  • Career Café
    14 Nov 2018,   16:30 - 18:00,   Show floor - TechARENA 1, Hall A4

 
  • MEMS Session
    14 Nov 2018,   12:45 - 14:50,   Show floor - TechARENA 2, Hall A4

 
 

 

TechARENA 2 is sponsored by : Risultati immagini per screen spe logo

>> DOWNLOAD PRESENTATIONS

 

 


 

Semiconductors: the driving force behind the Artificial lntelligence Evolution

 

Date   13 November 2018
    10:30 - 12:30
     
Location   Show floor - TechARENA 1, Hall A4
     
Foreword    Semiconductors are the driving force behind the Artificial Intelligence (AI) evolution and enable its adoption across various application areas ranging from connected and automated driving to smart healthcare and wearables. Given that, electronics research, design and manufacturing communities around the world are increasingly investing in specialized AI chips providing less latency, greater processing power, higher bandwidth and faster performance. AI also attracts new technology players to invest in making their own specialized AI chips, changing the electronics manufacturing landscape and moving the AI technology towards machine learning, deep learning and neural networks. According to UBS, AI chip market will boom to $35 billion by 2021, up from roughly $6 billion in 2016 and according to ASGARD VC, Europe alone has more than 400 companies focusing on various AI applications, including but not limited to semiconductors.
In addition to the new chips, AI also provides tremendous opportunities for equipment providers and fabs. AI applications indeed enable the uptake of preventive and predictive maintenance solutions that aim at optimizing yield. Tapping into AI opportunities is a multi-dimensional challenge and requires new innovations along the supply chain. For instance, a big challenge is “data”. AI needs data to mimic the human ability to learn, reason and make decisions. Yet, data is associated with 4Vs: volume, variety, velocity and veracity, and it needs to be captured, stored, processed, analyzed and converted into input for decision-making. Against this background, the sessions at SEMICON Europa TechArena will shed light on various aspects of AI and data, including manufacturing technologies, research, collaboration, education, skills 
and regulations.

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The future of Smart Computing Session 

 

Date   13 November 2018
    12:45 - 14:45
     
Location   Show floor - TechARENA 1, Hall A4
     
Foreword    The global economy is firmly becoming digital. Internet and digital technologies are transforming our daily lives, creating amazing commercial, industrial and societal impact. Technological revolutions in robotics, artificial intelligence, high performing computing (HPC) and quantum computing are generating an unprecedented advancement in wide-ranging applications such as autonomous vehicles, traffic flow management, smart manufacturing and logistics, intelligent buildings, medical devices, personalized healthcare, bio-economy, defense and homeland security, cybersecurity, energy management and financial services. Already today massive amounts of data are created that must be processed and stored. For security, privacy and safety reasons and latency issues, many time-critical applications (e.g. autonomous driving), need fast and trusty local data processing and cannot rely on the “cloud”.
This new paradigm is called “edge computing”. It brings the core building blocks of the “cloud” – computing, storage 
and networking – to the edge, reducing data storage and data transfer costs, and improving system resilience. Since energy constraints are much stricter at the edge, computer systems need to be powerful in terms of computing and efficient in terms of energy consumption. Still higher in complexity from a technological point of view is quantum computing, but this will be fundamentally different in terms of applications.
This session will give an overview of emerging technologies needed for the realization of high-performance low-power computer systems for smart & mobile applications.
Topics like neuromorphic computing, emerging memories 
and high-speed data communication will be addressed, and an outlook on quantum computing will be presented. 
 
 
 

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Metrology for Emerging Technologies Session

 

Date   13 November 2018
    15:00 - 17:00
     
Location   Show floor - TechARENA 1, Hall A4
     
Foreword    The semiconductor industry continues to innovate and provide pervasive products that become ingrained in our societies and provide essential functions and new experiences.  With the continuation of Moore’s Law, and the proliferation of heterogeneous and multi-functionality integration, new and diversifying models of computing are now emerging, as well as more and more smart and connected products that will have further impacts on our lives such as autonomous vehicles.  This all requires ever increasing levels of complexity within an already advanced manufacturing process flow, and hence the ability to control, measure and inspect more challenging objects and materials, without impact to manufacturing efficiencies and yield.

This TechARENA session will showcase some advanced metrology techniques currently being investigated and developed for both the research of new materials and device architectures, as well as potential candidates for insertion and deletion into and from a high volume manufacturing flow. 

Relevant topics include:

  • Inline/nearline/offline/virtual metrology
  • Optical, imaging, beam and x-ray metrology
  • Dimensions, morphology, electrical properties, stress, composition, doping, defects, material quality
  • Modeling aspects of metrology

Who should attend?
R&D, Manufacturing technology, process, metrology and equipment engineers and
 managers.

 
 
 

 

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Heterogeneous Integration Session

 

Date   13 November 2018
    11:00 - 13:05
     
Location   Show floor - TechARENA 2, Hall A4
     
Foreword    The advent of the internet of Things requires new semiconductor technology capabilities. 
The focus is shifting from the scaling of individual components to heterogeneous integration and system-level scaling, driven by the overall system performance and cost.
Heterogeneous integration complements conventional 2D scaling and enables designers to achieve higher levels of functional device integration by allowing multiple dies to be stacked vertically.

The benefits of 3D integration, such as increased inter-die communication bandwidth, reduced form factor and lower power consumption are proven, and the technological barriers to the stacking are steadily being eliminated. While several design and technology challenges still need to be solved, significant progress has been achieved by advanced stacking and packaging technologies, leading to successful demonstration of sensors, photonics and other IoT chips.

The session will showcase the state-of-the-art in heterogeneous functional integration.


Leaders and experts in the field will present examples of novel technologies, system-level scaling and semiconductor applications that drive multifunctional integration.

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Realizing Europe’s potential in a world redefined by the Digital Transformation

 

Date  
13 November 2018
 
 
13:15 - 15:40
 
 
 
Location
 
Show floor - TechARENA 2, Hall A4
 
 
 
Foreword 
 
Microelectronics has enabled the digital transformation that is impacting all the aspects of daily life, from manufacturing productivity through health diagnostics to consumer goods. It impacts the import/export balance and industrial capability of a country. It is a very strategic sector that shapes the economy of entire countries.  China is a very good example of this.
 
On the other hand, microelectronics itself is a sector in constant renewal.  In particular, the connectivity revolution has moved the microelectronics center of gravity from being digital-centric to hybrid architectures with RF/analog mixed signal and signal processing capability. IC development has moved away from targeting high speed at any price, instead the major focus of the IC industry has become delivering performance at the lowest possible energy consumption.
 
Europe is well positioned in the field of connectivity with RF-SOI and ultra low power consumption with the FD-SOI technology which involves key European actors as NXP, STMicroelectronics, GlobalFoundries, CEA-Leti, and Soitec, just to mention a few. FD-SOI is a technology that applies to all core verticals of Europe bringing numerous advantages. In the field of RF, European industries have achieved an important position with RF-SOI, a platform that has become the incumbent technology for the RF Front End Module for probably 100% of smart phones manufactured in the world.
 
The SOI Consortium organizes since 2013 the Shanghai 2018 FD-SOI Forum and International RF-SOI/5G Workshop in Shanghai.  It is an event that has grown to about 400 participants. It brings together decision makers of the whole China ecosystem and heads of key investment funds; in addition to decision makers from non Chinese leading companies and organizations. It has the attention of government officials from Beijing, Shanghai, Chengdu, who also attend the event.
 
To set the stage the SOI Consortium will present the key highlights from the Shanghai 2018 FD-SOI Forum and International RF-SOI/5G Workshop from 18-19 September. The presentation will be followed by 5min of Q&A.
 
Europe has numerous industrial strengths. The following panel will be centered on the industrial European ecosystem and what could be done to further amplify its strengths in RF and ultra low power microelectronics. The panel will discuss the European microelectronics FD- & RF-SOI ecosystems from the industrial robustness point of view focusing on strategic industrial pillars for Europe. FD-SOI is a game changer technology that enables ultra low power solutions, and helps solve the critical power supply issue. The central questions to be discussed will be:
 
  • Importance of robust microelectronic clusters of manufacturing, R&D, SMEs, and innovation
  • Europe contribution to the growth of a healthy microelectronics ecosystem to secure European strategic industries.

    organized by SOI Consortium

 


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Smart Manufacturing

 

Date  
14 November 2018
 
 
11:45 - 13:50
 
 
 
Location
 
Show floor - TechARENA 1, Hall A4
 
 
 
Foreword 
 
Advanced manufacturing solutions are required in order to compete successfully in the global environment. The semiconductor industry is a proactive front-runner when it comes to the implementation of all aspects of advanced manufacturing in a manufacturing infrastructure. Advanced factories are able to monitor and control all aspects of production, collecting and processing data from hundreds of tools and sensors in order to make continuous improvements in the production and establish predictability.
The advanced manufacturing sessions will address activities in cost and cycle time reduction, enhancements in productivity and yield, in efficiency improvements as well as an increase of throughput in both front and backend factories. 

Topics covered will be: 


Enhancement and optimization of existing production fabs due to:
  • Implementation of predictive process control solution            
  • Remote control and cloud-based solutions
  • Big data and use of advanced analytics
  • Logistics and optimization strategies in factories
  • Process optimization
  • EHS and sustainability
 
Who should attend?
Manufacturing technology, IT, and facility, process and equipment engineers and managers, and Risk Management. 

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Talent and Leadership in the Digital Economy

 

Date   14 November 2018
    14:00 - 16:30 
     
Location   Show floor - TechARENA 1, Hall A4
     
Foreword    The electronics industry in Europe is strategically positioned in the digital economy. With its leading design and manufacturing companies and research organizations, Europe is poised to grow. Global competition, nevertheless, is getting fiercer. Only countries with a large, diverse and dynamic electronics workforce can remain competitive and be the ones shaping the digital economy. It is paramount for electronics players to gain, train and retain its workforce aligned with emerging global trends. Under this light, the sessions at TechArena will shed light on education, skills and workforce-related issues affecting the competitiveness of electronics players in Europe.
With the participation of speakers from large and small companies, universities and political authorities, the sessions will provide a rich debate on common workforce challenges, share good HR practices, address topical issues such as school-to-work transition, workplace diversity, entrepreneurship, the future of work in manufacturing, and the role of public policy in securing talent.

The sessions will also include an interactive panel, actively involving the audience in the debate as well as a Career Café helping young talent to connect with leading employers in the electronics industry in Europe.
     
    Are you a student or postgraduate? Get your free ticket, register now!
     
   

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Career Café

Date   14 November 2018
    16:30 - 18:00 
     
Location   Show floor - TechARENA 1, Hall A4
     
Foreword    Do you study science, technology, engineering or math? Are you interested in game-changing technologies such as artificial intelligence, deep learning, autonomous driving, smart health and digital manufacturing? Do you want to meet industry leaders and work for major electronics companies across the world?
Then join us at SEMICON Europa “Talent and Leadership in the Digital Economy” Sessions and Career Café to learn more about career opportunities helping you shape the future!
Free Access to the exhibition floor will be provided by SEMI upon registration, connecting you with all the exhibiting businesses of SEMICON Europa and electronica 2018. Take part in the largest European electronics platform connecting industry leaders along the electronics value chain. 

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SCREEN – Enabling Technology Diversification in Europe

Date   14 November 2018
    10:00 - 12:30
     
Location   Show floor - TechARENA 2, Hall A4
     
Foreword  
SCREEN Semiconductor Solutions Co., Ltd. is a world class semiconductor production equipment company for advanced cleaning, lithography, annealing, measurement/inspection and packaging technology. We are supporting the European semiconductor industry more than 25 years and drive our global innovations through several long-term R&D and JDP collaboration in Europe.
In this TechARENA2 morning session, we will present the equipment solution for power devices, introduce selected R&D and JPD collaboration and present our new equipment platforms.

 


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Market Briefing Session

Date   14 November 2018
    10:00 - 11:05
     
Location   Show floor - TechARENA 1, Hall A4

 



 

 

MEMS Session
MEMS Devices from Design to Product

 

Date   14 November 2018
    12:45 - 14:50
     
Location   Show floor - TechARENA 2, Hall A4
     
Foreword   Join us in this informative TechARENA session on MEMS and learn from industry experts. We will follow 'the red line' through the MEMS product lifecycle from device design through the application in the final product with stops covering MEMS design, a foundry perspective, device testing, dicing, and applications as well as a market overview.

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Materials Technology Session

 

Date   14 November 2018
    15:00 - 17:35
     
Location   Show floor - TechARENA 2, Hall A4
     
Foreword    Materials research is a key enabler for the nanoelectronics industry that keeps on scaling down devices at the pace predicted by “Moore’s Law” in 1965.
Next to dimensional scaling, hybrid scalings with the heterogeneous integration of compound semiconductors or emerging materials based on 2D confinement of charge carriers are attracting considerable attention from the device manufacturers.
In this “Materials Technology Session”, we will address recent progress in processing of advanced materials for new device scaling concepts in the FEOL and the BEOL covering classical methods such as CVD and PVD but also novel methods for deposition and etch (ALD/ALE for 2D and 3D Nanostructuring
) or thermal treatment and associated tools and consumables.

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Secondary Equipment and Applications Session

 

Date   15 November 2018
    10:00 - 12:00
     
Location   Show floor - TechARENA 1, Hall A4
     
Foreword   
The opportunities for Europe as the global economy revolutionized by the introduction of “digital everything” are enormous and challenging. Disruptive changes will, and are, occurring across all research, development and manufacturing sectors. 

Many of these opportunities arise in the areas of “applications”, in which known technologies are repackaged into new capabilities, often complemented by some new innovation. Many of these application areas: Transport & Mobility, Health, Communications, for example, are traditional areas of European strength … creating opportunities for European Companies to profit from the digital economy.

Most importantly, as the use of devices become ubiquitous, and are used in huge numbers, the cost is of vital importance, and this is where the use of depreciated manufacturing equipment, but in new process applications, becomes a key differentiating feature.

In this area Europe has not only strength in technology, but also the ability to exploit the technology through its manufacturing and application capabilities … and a strong secondary equipment and process industry are vital in this context.

Europe’s chip manufacturers must put in place, in partnership with OEM’s and independent suppliers, a robust mechanism of extending the productive life of its manufacturing capability to ensure cost competitiveness as they look to compete in the Global market. This requires to focus on the maintenance and upgrade of the equipment itself, but also process development to meet new device needs. This must be complemented by the reliable supply of spare parts and the availability of engineering and process expertise and resources.

The Secondary Equipment & Applications session at SEMICON Europa will address these challenges and opportunities through a variety of topical presentations, together with interaction with the audience.

 

 

 

 

 

Smart Mobility Session

 

Date   15 November 2018
    10:00 - 12:00
     
Location   Show floor - TechARENA 2, Hall A4
     
Foreword    The challenges of smart mobility are manifold: it has not only to be safe and secure but also clean and affordable. Moreover, it shall serve personal mobility as well as logistics, and it shall allow interaction between humans and vehicles. Last but not least, mobility is employing millions of people in Europe, in both, manufacturing and services – making mobility an important source of prosperity in Europe.

Micro- and nano-electronics are the main driver for all kinds of innovation in the mobility sector: beneath the very exciting future of autonomous driving, societal challenges and lots of other aspects are addressed: sensors provide more safety, microcontrollers improve energy efficiency and connections to the world outside allow a seamless, however secure, integration of cars into the infrastructure.


This session is highlighting different aspects and focal points of electronics in automotive applications, such as special requirements, as well as top-down views on recent and future developments.

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Battery Session
Batteries meet SEMICONductors 

 

Date   15 November 2018
    12:15 - 13:45
     
Location   Show floor - TechARENA 2, Hall A4
     
Foreword   
With energy densities increasing 5-8% year, batteries are making their way from conventional portable device applications into automotive traction and renewable energy grids. Only 5 years ago over 60% of the lithium-ion battery market was driven by consumer applications. In the meantime, there is a totally different mix of market shares for this technology.
Consumer applications are now only representing a good 20%, automotive about 30% and the field of renewable energy roughly 40%. Thus, a more intense interaction with electronics is what we see today.

However, the technology development of battery technologies is still mainly at a research level. Compared to other high-tech industries the progress in technological advancements of batteries, Li-ion and others (such as e.g. Na-S, Li-S), requires further and continuous cooperation among research and industry to reach higher market shares.

The Battery session at SEMICON Europa 2018 will give a snapshot of

the following areas:
  • Battery Technology Market Updates
  • Battery Applications
  • Battery Materials
  • Manufacturing Methods & Challenges
Who should attend?
  • Interested parties in the field of Batteries, Energy, Automotive, IoT
  • Research Institutes
  • Equipment and Material Suppliers
  • Associations and public authorities
  • Device Makers

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The SOI Ecosystem and Supply Chain 
Organized by the SOI Industry Consortium

 

Date  
15 November 2018
 
 
12:15 - 16:00
 
 
 
Location
 
Show floor - TechARENA 1, Hall A4
 
 
 
Foreword 
 
The SOI Ecosystem is addressing fast growing segments like 4G/5G connectivity from RF-SOI through Piezo On Insulator POI for temperature insensitive SAW filters, Ultra Low Power mixed signal and embedded processing, Imagers and Sensors and Power ICs.
 
The SOI Industry Consortium organizes since 2013 workshops, symposia and forums around the world focusing on the SOI ecosystem and the adoption of the SOI technologies for IC products. The evolution towards SOI products and applications is clear. The demand from end users is visible.
 
The SOI Industry Consortium will start the session highlighting the key takeaways of the different 2018 events. The presentation will be followed by 5min of Q&A.
 
A strategic strength of Europe is its SOI technology and ecosystem. The following panel will focus on how can Europe and the respective member countries amplify and accelerate the implementation of its SOI technological strengths in industrial verticals. We will address this strategic topic through two panels composed by representatives of the industry and institutions.
 
The first panel of the afternoon is centered on
  • Ecosystem Partnerships building up synergy to develop competitive applications in a timely manner.
  • The importance of  manufacturing for European Innovation
Next, Soitec will discuss what is being done to address SOI substrate supply to support accelerated growth. The second panel will focus on the equipment supply chain in particular, on partnerships with the equipment suppliers to accelerate innovation and manufacturing.

organized by SOI Consortium

 


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Power Electronics Session

 

Date   15 November 2018
    14:00 - 17:15
     
Location   Show floor - TechARENA 2, Hall A4 
     
Foreword    Since the turn of the century, power semiconductors have become increasingly important as the enabler for state-of-the-art consumer applications, industrial systems and, increasingly so, transportation vehicles and automobiles. Several industries have shifted their development focus gradually towards power semiconductors to provide high-efficiency power conversions and variable motor drives or related systems. According to ole EV/HEV sales will achieve a 28% CAGR from 2017- 2023. Exciting new start-ups and spin-offs are crowding the emerging space created by novel power semiconductor (wide band-gap) materials and innovative packaging concepts and working diligently towards its successful introduction. Wide band-gap materials serve as the enabler to address the new requirements from industry.

The excitement in our mature and quite risk-averse industry has recently peaked, when the paradigm of the theoretical Silicon performance limit was shattered by the introduction of the CoolMos technology. Even more recently, the very reliable tram and train industry in Japan has started to integrate High-Voltage Silicon Carbide technology and, during the recent Google Little-box challenge a GaN Transistor topology revolutionized the power density of a solar inverter. 

Every year the Semicon Power semiconductor conference provides the opportunity to hand-selected experts in material, technology, marketing and application to review and present the latest progress in their related fields to their colleges and interested exhibition visitors.

 
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Lithography Session

 

Date   16 November 2018
    10:00 - 12:00
     
Location   Show floor - TechARENA 1, Hall A4 
     
Foreword  
Lithography is and will remain the strategic enabler for the development and the ramp-up of new patterning technologies. Indeed, whatever the design rules or the final application targets, the patterning strategy will define the future architecture and performance of the final device. Nevertheless, resolution, defectivity and nowadays alignment performance are the key drivers for the selection of the final lithography technology choice. In this landscape, optical lithography represents the reference lithography solution. However, when the cost of ownership starts to be taken into account, the final decision of the managers has to remain pragmatic. 
In this session of the SEMICON TechArena, some of the new trends in the lithography options and challenges will be addressed, in particular:
  • Some of the latest progress in advanced lithography: EUV, massively parallel direct write, nano-imprint lithography, …
  • The importance of process control for manufacturing.

 

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Cooperation with the Russian microelectronics market.
New opportunities for the business development.

 

Date   16 November 2018
    12:15 - 14:00
     
Location   Show floor - TechARENA 1, Hall A4 
     
Foreword  
Onsite the panel discussion, the key Russian and global experts will review of the Russian microelectronics market from today and with a forecast for the next 10 years.
The discussion will host members of the Microelectronics Industry Committee, CEO’s of the top Russian semiconductor and service companies, global industry analysts.
The main aim of the program is to organize a direct dialogue between Russian and international business community and highlight the most interesting projects on the territory of Russian Federation and CIS.
The Russian market is ready for cooperation where SEMIEXPO Russia 2019 is the most attractive b2b platform combining exhibition and fringe program.

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