Show floor TechARENA

Show floor TechARENA

TechARENA Event Overview 

  • Metrology
    13 Nov 2018,   15:00 - 17:00,   Show floor - TechARENA 1
  •  MEMS Session
    14 Nov 2018,   12:45 - 14:45,   Show floor - TechARENA 2
  • SEA Session
    15 Nov 2018,   10:45 - 12:00,   Show floor - TechARENA 1
  • Power Session
    15 Nov 2018,   14:00 - 17:15,   Show floor - TechARENA 2




Semiconductors: the driving force behind the Al Evolution


Date   13 November 2018
    10:30 - 12:30
Location   Show floor - TechARENA 1
Foreword    Semiconductors are the driving force driving the Artificial Intelligence (AI) evolution and enable its adoption across various application areas ranging from connected and automated driving to smart healthcare and wearables. Given that, electronics research, design and manufacturing communities around the world are increasingly investing in specialized AI chips providing less latency, greater processing power, higher bandwidth and faster performance. AI also attracts new technology players to invest in making their own specialized AI chips, changing the electronics manufacturing landscape and moving the AI technology towards machine learning, deep learning and neural networks. According to UBS, AI chip market will boom to $35 billion by 2021, up from roughly $6 billion in 2016 and according to ASGARD VC, Europe alone has more than 400 companies focusing on various AI applications, including but not limited to semiconductors.
In addition to the new chips, AI also provides tremendous opportunities for equipment providers and fabs. AI applications indeed enable the uptake of preventive and predictive maintenance solutions that aim at optimizing yield. Tapping into AI opportunities is a multi-dimensional challenge and requires new innovations along the supply chain. For instance, a big challenge is “data”. AI needs data to mimic human ability to learn, reason and make decisions. Yet, data is associated with 4Vs: volume, variety, velocity and veracity, and it needs to be captured, stored, processed, analyzed and converted into input for decision-making. Against his background, the sessions at SEMICON Europa TechArena will shed light on various aspects of AI and data, including manufacturing technologies, research, collaboration, education, skills 
and regulations.

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The future of Computing 


Date   13 November 2018
    12:45 - 14:45
Location   Show floor - TechARENA 1
Foreword    The global economy is firmly becoming digital. Internet and digital technologies are transforming our daily lives, creating amazing commercial, industrial and societal impact. Technological revolutions in robotics, artificial intelligence, high performing computing (HPC) and quantum computing are generating an unprecedented advancement in wide-ranging applications such as autonomous vehicles, traffic flow management, smart manufacturing and logistics, intelligent buildings, medical devices, personalized healthcare, bio-economy, defense and homeland security, cybersecurity, energy management and financial services. Already today massive amounts of data are created that must be processed and stored. For security, privacy and safety reasons and latency issues, many time-critical applications (e.g. autonomous driving), need fast and trusty local data processing and cannot rely on the “cloud”.
This new paradigm is called “edge computing”. It brings the core building blocks of the “cloud” – computing, storage 
and networking – to the edge, reducing data storage and data transfer costs, and improving system resilience. Since energy constraints are much stricter at the edge, computer systems need to be powerful in terms of computing and efficient in terms of energy consumption. Still higher in complexity from a technological point of view is quantum computing, but this will be fundamentally different in terms of applications.
This session will give an overview of emerging technologies needed for the realization of high-performance low-power computer systems for smart & mobile applications.
Topics like neuromorphic computing, emerging memories 
and high-speed data communication will be addressed, and an outlook on quantum computing will be presented. 

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Date   13 November 2018
    15:00 - 17:00
Location   Show floor - TechARENA 1
Foreword    The semiconductor industry continues to innovate and provide pervasive products that become ingrained in our societies and provide essential functions and new experiences.  With the continuation of Moore’s Law, and the proliferation of heterogeneous and multi-functionality integration, new and diversifying models of computing are now emerging, as well as more and more smart and connected products that will have further impacts on our lives such as autonomous vehicles.  This all requires ever increasing levels of complexity within an already advanced manufacturing process flow, and hence the ability to control, measure and inspect more challenging objects and materials, without impact to manufacturing efficiencies and yield.

This TechARENA session will showcase some advanced metrology techniques currently being investigated and developed for both the research of new materials and device architectures, as well as potential candidates for insertion and deletion into and from a high volume manufacturing flow. 

Relevant topics include:

  • Inline/nearline/offline/virtual metrology
  • Optical, imaging, beam and x-ray metrology
  • Dimensions, morphology, electrical properties, stress, composition, doping, defects, material quality
  • Modeling aspects of metrology

R&D, Manufacturing technology, process, metrology and equipment engineers 
Who should attend?

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Heterogeneous Integration Session


Date   13 November 2018
    11:00 - 13:00
Location   Show floor - TechARENA 2
Foreword    The advent of the internet of Things requires new semiconductor technology capabilities. 
The focus is shifting from the scaling of individual components to heterogeneous integration and system-level scaling, driven by the overall system performance and cost.
Heterogeneous integration complements conventional 2D scaling and enables designers to achieve higher levels of functional device integration by allowing multiple dies to be stacked vertically.

The benefits of 3D integration, such as increased inter-die communication bandwidth, reduced form factor and lower power consumption are proven, and the technology barriers to die stacking are steadily being eliminated. While several design and technology challenges still need to be solved, significant progress has been achieved by advanced stacking and packaging technologies, leading to successful demonstration of sensors, photonics and other IoT chips.

The session will showcase the state-of-the-art in heterogeneous functional integration.

Leaders and experts in the field will present examples of novel technologies, system-level scaling and semiconductor applications that drive multifunctional integration.

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Advanced Manufacturing


14 November 2018
11:45 - 13:45
Show floor - TechARENA 1
Advanced manufacturing solutions are required in order to compete successfully in the global environment.The semiconductor industry is a proactive front-runner when it comes to the implementation of all aspects of advanced manufacturing in a manufacturing infrastructure. Advanced factories are able to monitor and control all aspects of production, collecting and processing data from hundreds of tools and sensors in order to make continuous improvements in the production and establish predictability.
The advanced manufacturing sessions will address activities in cost and cycle time reduction, enhancements in productivity and yield, in efficiency improvements as well as an increase of throughput in both front and backend factories. 

Topics covered will be: 

Enhancement and optimization of existing production fabs due to:
  • Implementation of predictive process control solution            
  • Remote control and cloud-based solutions
  • Big data and use of advanced analytics
  • Logistics and optimization strategies in factories
  • Process optimization
  • EHS and sustainability
Who should attend?
Manufacturing technology, IT, and facility, process and equipment engineers and managers, and Risk Management. 


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Talent and Leadership in the Digital Economy


Date   14 November 2018
    14:00 - 16.00 
Location   Show floor - TechARENA 1
Foreword    The electronics industry in Europe is strategically positioned in the digital economy. With its leading design and manufacturing companies and research organizations, Europe is poised to grow.
Global competition, nevertheless, is getting fiercer. Only countries with a large, diverse and dynamic electronics workforce can remain competitive and be the ones shaping the digital economy.

It is paramount for electronics players to gain, train and retain its workforce aligned with emerging global trends. Under this light, the sessions at TechArena will shed light on education, skills and workforce-related issues affecting the competitiveness of electronics players in Europe.
With the participation of speakers from large and small companies, universities and political authorities, the sessions will provide a rich debate on common workforce challenges, share good HR practices, address topical issues such as school-to-work transition, workplace diversity, entrepreneurship, the future of work in manufacturing, and the role of public policy in securing talent.

The sessions will also include an interactive panel, actively involving the audience in the debate as well as a Career Café helping young talent to connect with leading employers in the electronics industry in Europe.

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MEMS Session


Date   14 November 2018
    12:45 - 14.45
Location   Show floor - TechARENA 2
Foreword   TBD



Materials Session


Date   14 November 2018
    15:00 - 17.15
Location   Show floor - TechARENA 2
Foreword    Materials research is a key enabler for the nanoelectronics industry that keeps on scaling down devices at the pace predicted by “Moore’s Law” in 1965.
Next to dimensional scaling, hybrid scalings with the heterogeneous integration of compound semiconductors or emerging materials based on 2D confinement of charge carriers are attracting considerable attention from the device manufacturers.
In this “Materials Technology Session”, we will address recent progress in processing of advanced materials for new device scaling concepts in the FEOL and the BEOL covering classical methods such as CVD and PVD but also novel methods for deposition and etch (ALD/ALE for 2D and 3D Nanostructuring
) or thermal treatment and associated tools and consumables.

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SEA Session


Date   15 November 2018
    10:00 - 12.00
Location   Show floor - TechARENA 1 
Foreword    The opportunities for Europe as the global economy revolutionized by the introduction of “digital everything” are enormous and challenging. Disruptive changes will, and are, occurring across all research, development and manufacturing sectors. 

Many of these opportunities arise in the areas of “applications”, in which known technologies are repackaged into new capabilities, often complemented by some new innovation. Many of these application areas: Transport & Mobility, Health, Communications, for example, are traditional areas of European strength … creating opportunities for European Companies to profit from the digital economy.

Most importantly, as the use of devices become ubiquitous, and are used in huge numbers, the cost is of vital importance, and this is where the use of depreciated manufacturing equipment, but in new process applications, becomes a key differentiating feature.

In this area Europe has not only strength in technology, but also the ability to exploit the technology through its manufacturing and application capabilities … and a strong secondary equipment and process industry are vital in this context.

Europe’s chip manufacturers must put in place, in partnership with OEM’s and independent suppliers, a robust mechanism of extending the productive life of its manufacturing capability to ensure cost competitiveness as they look to compete in the Global market. This requires focus on the maintenance and upgrade of the equipment itself, but also process development to meet new device needs. This must be complemented by the reliable supply of spare parts and the availability of engineering and process expertise and resources.

The Secondary Equipment & Applications session at SEMICON Europa

will address these challenges and opportunities through a variety of topical presentations, together with interaction with the audience.

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Smart Mobility Session


Date   15 November 2018
    10:00 - 12.00
Location   Show floor - TechARENA 2
Foreword    The challenges of smart mobility are manifold: it has not only to be safe and secure but also clean and affordable. Moreover, it shall serve personal mobility as well as logistics, and it shall allow interaction between humans and vehicles. Last but not least, mobility is employing millions of people in Europe, in both, manufacturing and services – making mobility an important source of prosperity in Europe.

Micro- and nano-electronics are the main driver for all kinds of innovation in the mobility sector: beneath the very exciting future of autonomous driving, societal challenges and lots of other aspects are addressed: sensors provide more safety, microcontrollers improve energy efficiency and connections to the world outside allow a seamless, however secure, integration of cars into the infrastructure.

This session is highlighting different aspects and focal points of electronics in automotive applications, such as special requirements, as well as top-down views on recent and future developments.

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Battery Session
Batteries meet SEMICONductors 


Date   15 November 2018
    12:15 - 13.45
Location   Show floor - TechARENA 2 
With energy densities increasing 5-8% year, batteries are making their way from conventional portable device applications into automotive traction and renewable energy grids. Only 5 years ago over 60% of the lithium-ion battery market was driven by consumer applications. In the meantime, there is a totally different mix of market shares for this technology.
Consumer applications are now only representing a good 20%, automotive about 30% and the field of renewable energy roughly 40%. Thus, a more intense interaction with electronics is what we see today.

However, the technology development of battery technologies is still mainly at a research level. Compared to other high-tech industries the progress in technological advancements of batteries, Li-ion and others (such as e.g. Na-S, Li-S), requires further and continuous cooperation among research and industry to reach higher market shares.

The Battery session at SEMICON Europa 2018 will give a snapshot of

the following areas:
  • Battery Technology Market Updates
  • Battery Applications
  • Battery Materials
  • Manufacturing Methods & Challenges
Who should attend?
  • Interested parties in the field of Batteries, Energy, Automotive, IoT
  • Research Institutes
  • Equipment and Material Suppliers
  • Associations and public authorities
  • Device Makers

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Power Session


Date   15 November 2018
    14:00 - 17:15
Location   Show floor - TechARENA 2 
Foreword    Since the turn of the century, power semiconductors have become increasingly important as the enabler for state-of-the-art consumer applications, industrial systems and, increasingly so, transportation vehicles and automobiles. Several industries have shifted their development focus gradually towards power semiconductors to provide high-efficiency power conversions and variable motor drives or related systems. According to yole EV/HEV sales will achieve a 28% CAGR from 2017- 2023. Exciting new start-ups and spin-offs are crowding the emerging space created by novel power semiconductor (wide band-gap) materials and innovative packaging concepts and working diligently towards its successful introduction. Wide band-gap materials serve as the enabler to address the new requirements from industry.

The excitement in our mature and quite risk-averse industry has recently peaked, when the paradigm of the theoretical Silicon performance limit was shattered by the introduction of the CoolMos technology. Even more recently, the very reliable tram and train industry in Japan has started to integrate High-Voltage Silicon Carbide technology and, during the recent Google Little-box challenge a GaN Transistor topology revolutionized the power density of a solar inverter. 

Every year the Semicon Power semiconductor conference provides the opportunity to hand-selected experts in material, technology, marketing and application to review and present the latest progress in their related fields to their colleges and interested exhibition visitors.

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Lithography Session


Date   16 November 2018
    10:00 - 12:00
Location   Show floor - TechARENA 1 
Foreword   TBD

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