SEMICON Europa 2016 & 2016FLEX Europe - CLOSED
Call for Papers for technical sessions and presentations for SEMICON Europa 2016, October 25–27 in Grenoble, France is now CLOSED. Technical presentation abstracts were due May 23. SEMICON Europa 2016 will feature more than 100 hours of technical sessions and presentations focused on critical industry topics that are shaping the design and manufacturing of semiconductors, MEMS, printed and flexible electronics, and other related technologies.
Abstracts for presentations were accepted for:
> Advanced Packaging Conference (APC) - “The Balancing Act Between Consumer and Harsh Environment Packaging”
Prospective presenters had been invited to submit abstracts (1,000 - 2,000 characters). Material had to be original, non-commercial, and non-published. Abstracts must had clearly detail the nature, scope, content, organization, key points, and significance of the proposed presentation.
New at SEMICON Europa 2016
2016FLEX Europe will also take place in Grenoble from October 25–26. Previously known as PE Europe, 2016FLEX Europe leverages the knowledge and know-how gathered for SEMICON Europa. The combined events attract over 5,500 attendees involved in the microelectronics supply chain, from equipment and material suppliers, IC manufacturers, system integrators to end users. Special programs this year will feature advanced and smart manufacturing (Industry 4.0), power electronics, imaging, and electronics and materials for the medical and automotive applications. SEMICON Europa is the ideal venue for meeting and exploring applications and manufacturing solutions for flexible, printed, and hybrid electronics. Submissions are now longer being accpeted.