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Advanced Materials Session


Advanced Materials Session


Date: 25 Oct 2016
Time: 14:00–17:05
Location: TechARENA 2    
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Sponsored by:   


Progress in micro- and nanoelectronics in the past had been mainly controlled by lithography.  By approaching critical dimensions, countable in atomic distances, requirements for materials and associated processes become extremely challenging with the properties of ultra-thin films differ significantly from bulk values.  
Self-alignment concepts require extreme high uniformity and sub nm accuracy on 300 mm wafer size. In this session several of these new materials and process developments will be discussed by experts from their specific fields.  The focus will be on the unique properties of the materials or processes, items that make them specifically suitable for targeted applications, and how they are characterized and/or can be fabricated.





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No pre-registration required but you must register as a visitor, in order to gain access to the venue. We recommend to arrive early as seating is limited.
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