Metrology Session - Abstracts and Biographies
Fraunhofer IISB
Biography
Markus Pfeffer received the M.S. (Dipl.-Ing.) degree in Electrical Engineering from the University of Erlangen in 2001. Since 2002 he is with FhG IISB in the department Semiconductor Manufacturing Equipment and Methods. He has been engaged in the fields of equipment control, advanced process control, manufacturing optimisation and especially discrete event simulation. He was/is involved in several national and international co-operative R&D projects, e. g. FLYING WAFER, SEA-NET, SEAL, PULLNANO and IMPROVE.
SEAL- a Joint European Project for Semiconductor Equipment Assessment Leveraging Innovation
Richard Oechsner, Deputy Head of Department
Fraunhofer IISB
Biography
Richard Öchsner received the M.S. (Dipl.-Ing.) degree in Electrical Engineering and the Dr.-Ing. degree from the University of Erlangen. Since 1991 he is with Fraunhofer IISB working in the department Semiconductor Manufacturing Equipment and Methods. He is deputy head of department and leads the group Manufacturing Control and Productivity and was/is en-gaged in the fields of semiconductor equipment assessment, contamination control in equip-ment, equipment control, integrated metrology, advanced process control, manufacturing methods, optimization, productivity and energy efficiency. He was/is involved in several Eu-ropean and national co-operative R&D projects in different functions also as coordinator. Richard Öchsner is active in SEMI standardization and a member of the Factory Integration TWG within ITRS (International Technology Roadmap for Semiconductors).
Abstract
SEAL is a project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment themes are equally spread amongst processing and metrology equipment, heading beyond the current state-of-the-art both for More Moore and More than Moore applications. The strategic objective of SEAL is to effectively combine efforts, resources and expertise in the joint assessment of novel equipment supported by cross-cut R&D dedicated to the identified needs of the assessment sub-projects.
For metrology and analysis, the main focus is on enabling innovative systems to efficiently contribute to at-line and in-line monitoring and control within semiconductor facilities. Without such equipment, it will not be possible to validate progressively advanced processes during development and manufacturing.
Cross-cut R&D activities relating to all equipment assessment sub-projects are covered including APC, model based control, equipment simulation, enhanced wafer and equipment logistics, advanced communication and man machine-interfaces, and virtual equipment engineering. A common approach for the assessment activities will be utilized with specifications that will be refined for each equipment type for the progressively emerging technology nodes.
Overall, SEAL will strengthen the European equipment manufacturing industry in an ideal and sustainable way by combining advanced R&D topics in equipment sub-projects involving a wide community of users, research institutes and equipment suppliers with many SMEs.
This project is funded by the European Commission under contract number FP7- 257379.
Multi Sensor Metrology for Wafer Measurement
Thomas Fries, Managing Director
FRT
Biography
24.07.1961 born in Neunkirchen, Germany
1981 to 1989 University of Saarbruecken, Germany, degree in physics
1989 to 1993 PhD at University of Bonn, Germany
1993 to 1995 head of department for surface analysis at Günther Systemtechnik GmbH, Königswinter, Germany
07.08.95 founding of FRT, Fries Research & Technology GmbH,
Bergisch Gladbach, Germany
since 1995 CEO FRT GmbH
1997 to 2007 board member IVAM e.V. (MEMS)
1998 founding of FRT of America, LLC, owner and president
2001 founding of FRT Suisse AG, owner and head of board
2007 founding of FRT Shanghai Co., Ltd., owner
since 2007 advisory board member IVAM e.V. (MEMS)
since 2009 advisory board member Deutsche Messe AG (MEMS)
Abstract
A surface metrology system is presented to fulfill the needs of semiconductor, PV, LED and MEMS industry from lab to production. The system investigates wafers, PCB or any other device surfaces and estimates TTV, bow or warp all automatically. Also high resolution topography, roughness or profiles for the whole surface can be performed. Additionally film thickness is measured. An outstanding innovation is the modular multi sensor technology. The various optical sensors are fast and accurate. Furthermore the system can optionally be equipped with AFM or microscope sensors. The system does automated evaluation of the following metrological data: total thickness variation TTV, bow, warp, roughness, film thickness, step height, pitch, profile, contour, edge structures, trenches, topography, geometry, coplanarity, critical dimensions und angles.
To fulfill Frontend needs, the metrology system is integrated to a fully equipped EFEM with wafer handling robot, prealignement, OCR, own fan units and FOUP or SMIF ports. Completed are these systems by a professional SECS/GEM integration. To ensure the comprehensive functionality and guarantee uptime of such a metrology system a completely new software environment has been developed and mechanical and electronical components have been optimized for repeatability and modularity in function. So, different metrology tasks, like e.g. the fully automated measurement of topography data and film thickness data on MEMS or LED wafers can be performed with up to 80 wafers per hour throughput.
