Process Control, Automation and Software - Abstracts and Biographies
Dresden University of Technology
Biography
Klaus Kabitzsch holds a Diploma and a Ph.D. (1982) in electrical Engineering and communications technology from the Ilmenau Technical University. He worked in the following years in the industry in the area of control of machines and equipment. After 1989 he worked at the universities of Leipzig and Dresden and focused his research on fieldbuses, distributed systems, real time software and automation. He became professor and head of the department of technical computer sciences in 1993 at the Dresden University of Technology. His current projects have their focus on wireless networks and their application in the automation domain, component based software design, design tools for networked automation, energy management, data analysis, advanced process control and predictive technologies. He is member or chair of various organizations (VDE, IEEE, CEN, LonMark) and co-founder of the SAP Research CEC (future factory) in 2004. Prof. Kabitzsch is author or co-author of 140+ scientific publications, 5 books and 9 patents.
Modelbased Health Monitoring of Plasma Tools
Michael Klick, CEO
Plasmetrex
Plasmetrex
Biography
Education: Ph.D. in Plasma Physics, Ernst-Moritz-Arndt-University Greifswald, 1992
Dipl.-Ing., Technology of Electronic Devices, 1987
Grants and Fellowships: Research Study at the Humboldt-University Berlin, Department of
Electronics Technology, 1988 – 1991
Patents: “Method and Apparatus for the Determination of Absolute Plasma
Parameters”
US Patents 5 705 931 and 5 861 752, European Patent EP 0 719 077 B1,
Japanese Patent 2872954
“Apparatus for industrial plasma processes”
European Patent EP 08 008 191.2-1226, South Korea 10-2008-00065552,
Taiwan, ROC 200945957
Experience in Education:
Qualification of Process and Maintenance Personnel, courses since 2003
• Plasma School for Semiconductor Manufacturing
• Plasma Technology in Solar Cell Manufacturing
• RF Technology for Plasma Applications
Lecture, Ruhr-University Bochum, since 2006
• Plasma Technology in Semiconductor and Microsystems Manufacturing
• Tutorial at 6 European AEC/APC Conference, April, 6, 2005, Dublin, Irland Advanced Process Control for Plasma Processes and Etch
• Tutorial at 11 European AEC/APC Conference, April 4-6, 2011, Dresden, Germany RF metrology for maintenance and AEC at plasma tools - Approaches, Methods, and Benefit for
Enhanced Equipment Quality Assurance (ISMI)
Dipl.-Ing., Technology of Electronic Devices, 1987
Grants and Fellowships: Research Study at the Humboldt-University Berlin, Department of
Electronics Technology, 1988 – 1991
Patents: “Method and Apparatus for the Determination of Absolute Plasma
Parameters”
US Patents 5 705 931 and 5 861 752, European Patent EP 0 719 077 B1,
Japanese Patent 2872954
“Apparatus for industrial plasma processes”
European Patent EP 08 008 191.2-1226, South Korea 10-2008-00065552,
Taiwan, ROC 200945957
Experience in Education:
Qualification of Process and Maintenance Personnel, courses since 2003
• Plasma School for Semiconductor Manufacturing
• Plasma Technology in Solar Cell Manufacturing
• RF Technology for Plasma Applications
Lecture, Ruhr-University Bochum, since 2006
• Plasma Technology in Semiconductor and Microsystems Manufacturing
• Tutorial at 6 European AEC/APC Conference, April, 6, 2005, Dublin, Irland Advanced Process Control for Plasma Processes and Etch
• Tutorial at 11 European AEC/APC Conference, April 4-6, 2011, Dresden, Germany RF metrology for maintenance and AEC at plasma tools - Approaches, Methods, and Benefit for
Enhanced Equipment Quality Assurance (ISMI)
Abstract
The real tool which processes the wafer - is the plasma. The usually
unknown boundary conditions of the plasma process are:
- chamber with its surface conditions and temperatures as well as
- real RF plasma power and cause chamber mismatching,
The pure hardware properties do not depend on the recipe (process).
The most important part of RF plasma equipment is the plasma itself,but parameters depends always on recipe and pure hardware
properties. So, Equipment health = Plasma health
unknown boundary conditions of the plasma process are:
- chamber with its surface conditions and temperatures as well as
- real RF plasma power and cause chamber mismatching,
The pure hardware properties do not depend on the recipe (process).
The most important part of RF plasma equipment is the plasma itself,but parameters depends always on recipe and pure hardware
properties. So, Equipment health = Plasma health
Deployment of Advanced Process Control in LED manufacturing
Heribert Zull, Senior Key Expert
Osram
Osram
Biography
Experience:
- Senior Key Expert for Plasma Processing
Technology & Innovation Department at OSRAM Opto Semiconductors GmbH
(Regensburg, 1999 to present)
- Senior Key Expert for Plasma Processing
Technology & Innovation Department at OSRAM Opto Semiconductors GmbH
(Regensburg, 1999 to present)
- Development Engineer at Siemens Semiconductors
(Regensburg, 1996-1999)
(Regensburg, 1996-1999)
Education:
- Ph.D degree in Technical Physics from University of Wuerzburg, Germany 1997
- Ph.D degree in Technical Physics from University of Wuerzburg, Germany 1997
- Diploma degree in Physics from University of Wuerzburg, Germany 1993
Other:
- Member of the German Physical Society (DPG)
- Member of the German Physical Society (DPG)
Abstract
High-brightness Light Emitting Diodes (LEDs) are becoming increasingly omnipresent in our
daily lives. But HB-LED technology is currently more expensive than the conventional
incandescent and fluorescent lighting sources. Thus greater adoption of HB-LED technology
depends on bringing down the cost of production and improving LED efficiency. Our present
process control methodology relies mainly on a fixed process recipe, manual run-to-run
control for batch processes as well as classical statistical process control to monitor the
production. In the near future leading-edge LED manufacturing requires higher levels of
precision and accuracy, which necessitate the use of a tighter process control. Advanced
Process Control (APC) is considered as a key enabler, as already demonstrated in the
mainstream semiconductor industry. The implementation of APC will become an essential
component to improve the performance, cycle time, yield and flexibility of the LED
manufacturing process through run-to-run, wafer-to-wafer and within wafer control.
daily lives. But HB-LED technology is currently more expensive than the conventional
incandescent and fluorescent lighting sources. Thus greater adoption of HB-LED technology
depends on bringing down the cost of production and improving LED efficiency. Our present
process control methodology relies mainly on a fixed process recipe, manual run-to-run
control for batch processes as well as classical statistical process control to monitor the
production. In the near future leading-edge LED manufacturing requires higher levels of
precision and accuracy, which necessitate the use of a tighter process control. Advanced
Process Control (APC) is considered as a key enabler, as already demonstrated in the
mainstream semiconductor industry. The implementation of APC will become an essential
component to improve the performance, cycle time, yield and flexibility of the LED
manufacturing process through run-to-run, wafer-to-wafer and within wafer control.
APC/AEC-Control Chambers by Monitoring Heating-lamp Current for Prevention of Metalcorrosion
Karsten Spinger, Process Engineer Plasma etch
Texas Instruments
Biography
1994-1999 Study of Chemical engineering at the University of Applied Science, Nuremberg
2000 Finished Diploma thesis at Infineon Technology, Erlangen
Since 2000 Working at Texas Instruments, Freising as process engineer for plasma etching
2009 Promotion to TMG Member, Technical Staff
Since 2010 APC/AEC coordinator; currently responsible for FEOL dielectric etch and metal etch
2000 Finished Diploma thesis at Infineon Technology, Erlangen
Since 2000 Working at Texas Instruments, Freising as process engineer for plasma etching
2009 Promotion to TMG Member, Technical Staff
Since 2010 APC/AEC coordinator; currently responsible for FEOL dielectric etch and metal etch
Abstract
During wafer fabrication of an aluminium based backend an insitu-ash process is used post metal etch processes. Applied Materials Metal DPS-etchers with attached ASP+-chambers for insitu-ash are state of the art tools for 6”- and 8”-wafer fabrication.
Heating lamps are used to achieve necessary process temperature but tend to fail and no tool parameter gives direct indication. As a result metal corrosion may occur due to incomplete resist removal.
TI Freising overcame this problem by introduction of a lamp current control with TI’s own AEC/APC-software “TIMS”. Implementation and results will be scope of the presentation.
Heating lamps are used to achieve necessary process temperature but tend to fail and no tool parameter gives direct indication. As a result metal corrosion may occur due to incomplete resist removal.
TI Freising overcame this problem by introduction of a lamp current control with TI’s own AEC/APC-software “TIMS”. Implementation and results will be scope of the presentation.
Predictive Process Control of Photoresist Thickness Variation
Gabriele Porri, Quality and Method Engineer, Micron
Biography
Gabriele Porri joined Micron Technology during 1998. He is working as engineer in Quality and Methods Department. He is involved in FDC and R2R modeling and development.
Currently he is developing a throughput monitor and optimization for cluster tool in photo area.
His interests span the field of artificial neural network and fuzzy logic application in semiconductor environment and vibration an image analysis for tool monitoring.
Currently he is developing a throughput monitor and optimization for cluster tool in photo area.
His interests span the field of artificial neural network and fuzzy logic application in semiconductor environment and vibration an image analysis for tool monitoring.
Abstract
In a semiconductor plant one of the most important parameter to maintain under control is the resist thickness because it impacts directly critical dimensions (CD). Barometric pressure directly modulates DUV resist thickness so a tool that compensate resist thickness variation in needed.
The innovation of this project is to implement, via software, resist thickness correction based on a three dimensions mathematical model. No additional hardware is needed on production tool.
Two goals have been achieved in same time, to increase resist film quality reducing resist thickness standard deviation and to increase machine throughput decreasing frequency of resist thickness check.
The innovation of this project is to implement, via software, resist thickness correction based on a three dimensions mathematical model. No additional hardware is needed on production tool.
Two goals have been achieved in same time, to increase resist film quality reducing resist thickness standard deviation and to increase machine throughput decreasing frequency of resist thickness check.
Improvement of Prediction Performance in Virtual Metrology
Alexander Dementjev, Research Assistant
TU Dresden
Biography
Alexander Dementjev received the diploma degree in electrical engineering at the Saint Petersburg Electrotechnical University, Russia, in 1998. He worked at the Research Institute of Precision Mechanics, Saint Petersburg (1995-1998), Triol GmbH, Saint Petersburg (1998-2000) and Business Computer Center AG, Saint Petersburg (2001). Since October 2001 he has been working at the Dresden University of Technology. His research interests are focused on process analysis, process control and virtual metrology.
Abstract
Virtual Metrology (VM) allow measurement of process parameters where direct measurement is too expensive or even not possible. For the VM system which build their internal process model after the data-driven method, e.g. by use of an artificial neural network (ANN), there is a problem of the evaluation of the prediction performance. The up to date solutions solve this problem only partially and only for few ANN types, require huge development effort and are inapplicable for the real time operation. A new approach for the improvement of the VM prediction performance based on the statistical process control (SPC) methods is suggested in this article. It is valid for a wide class of the ANN models and reduces the development effort severely. The simulation of this approach using the real process data has delivered promising results.
Optical Emission Spectroscopy (OES) for Leak Monitoring
Peter Brockhaus, Senior Manager
Infineon
Biography
2005-Today: Infineon Dresden GmbH, Head Product Engineering C9/ Technology Responsible 130nm Flash/ Today: Senior Manager Process Technology Plasma-Processes
2001–2005: Infineon AG, Berlin, Project Manager Optical Communications Modules, Head Product Engineering and Measurement Components
1999–2001: 20/10 Perfect Vision GmbH, Heidelberg, Project Manager „Wavescan“ (Auto Refractor for optimized Laser Vision Correction)
1998 - 1999: Carl Zeiss,Oberkochen, Optical System Engineer
1997 - 1998:University of Southern California, Los Angeles, Post-Doc, Physical Chemistry
1997 Doctoral Thesis in Physical Chemistry (Free University), Berlin
1994 Physics Diploma, Heidelberg
2001–2005: Infineon AG, Berlin, Project Manager Optical Communications Modules, Head Product Engineering and Measurement Components
1999–2001: 20/10 Perfect Vision GmbH, Heidelberg, Project Manager „Wavescan“ (Auto Refractor for optimized Laser Vision Correction)
1998 - 1999: Carl Zeiss,Oberkochen, Optical System Engineer
1997 - 1998:University of Southern California, Los Angeles, Post-Doc, Physical Chemistry
1997 Doctoral Thesis in Physical Chemistry (Free University), Berlin
1994 Physics Diploma, Heidelberg
Abstract
A preclean chamber is used to prepare wafers for metal sputtering. It is very harmful to sputter when atmospheric air is in the chamber. Therefore the chambers have to be monitored constantly for atmospheric leaks to prevent wafer scrap. The leak monitoring (base pressure check) integrated into the tool is not sensitive enough, therefore we developed an optical emission spectroscopy (OES) for leak monitoring.
Automation Migration: A Smooth way to Move from Legacy Applications to Fully Integrated and Modular Automation Solutions
Hans Mayer, COO
znt
Biography
Hans Mayer has 27 years experience in IT Systems for automation.
After 6 years at Siemens AG in Munich in software development for cell phones, he joined znt.
With znt he implemented many automation projects as software developer and project manager
for different industries with a main focus on Semiconductor and Solar Industry.
After 6 years at Siemens AG in Munich in software development for cell phones, he joined znt.
With znt he implemented many automation projects as software developer and project manager
for different industries with a main focus on Semiconductor and Solar Industry.
Abstract
IT Systems like MES and EES (Equipment engineering systems) are in place in every Semiconductor FAB. In many FABs legacy systems need to be functionally extended or need to be replaced, if the existing systems are out of maintenance.
It is a big challenge to rebuild or replace existing IT solutions in a running FAB. The risk of production interruption and the possible impact on the yield in the transition period is obvious. Such a project needs careful planning and elaborated concepts and tools to run it in a smooth way.
But the benefit is worth the efforts. New Systems can tremendously increase your efficiency and yields.
This presentation gives you an overview about available concepts for refactoring or replacing legacy systems with minimal impact to your production.
It is a big challenge to rebuild or replace existing IT solutions in a running FAB. The risk of production interruption and the possible impact on the yield in the transition period is obvious. Such a project needs careful planning and elaborated concepts and tools to run it in a smooth way.
But the benefit is worth the efforts. New Systems can tremendously increase your efficiency and yields.
This presentation gives you an overview about available concepts for refactoring or replacing legacy systems with minimal impact to your production.
Faster and More Efficient - SCRUM in Automation Software Projects
Bjoern Bothur, Marketing and Sales Manager
SYSTEMA
Biography
Bjoern Bothur held Projectmanagerpositions in Productdevelopment, Manufacturing Process Design and Manufacturing Process Implementation in different manufacturing industries.
Abstract
Developing high quality software solutions for complex task settings in time and budget stays on top of the agenda when it comes to Manufacturing Process Optimization, Yield Improvement and Quality Assurance in Manufacturing Operations.
The Presentation will focus on how to use Scrum for efficient and fast software development, what is to be paid attention to when introducing Scrum and what makes Scrum different from a “traditional” Project Management Approach.
The Presentation will focus on how to use Scrum for efficient and fast software development, what is to be paid attention to when introducing Scrum and what makes Scrum different from a “traditional” Project Management Approach.
UDCS - An Ultra Damping Ceramics for Nano Processing Applications
Norbert Fischer, Managing Director
noficontrol (Europe) GmbH
Biography
Since 2011 noficontrol europe GmbH, Hafenlohr, Managing Director
2010 - Today Norbert Fischer Consulting, Hafenlohr, Managing Director
2009 Bosch Rexroth AG, Lohr a. Main, Head of Project „Semiconductor market Asia“
2006 - 2008 Bosch Rexroth B.V. Eindhoven (NL), Head of Sales & Marketing for product area „Semiconductor & Medical“
2004 - 2006 Bosch Rexroth AG – Electric Drives and Controls GmbH, Lohr a. Main,
Head of Sales „drive solutions“
2000 - 2004 Bosch Rexroth AG – Indramat Refu GmbH, Metzingen, Vice President Sales and Service
1998 - 2000 REFU DRIVES (Schweiz) GmbH, Tegna (CH) - Managing Director
1993 - 1998 Schindler Electronics AG, Locarno (CH) Manager Drive solutions for elevators
1994 - 1995 HWV Luzern (CH) - Post graduate studies in general management
1990 - 1993 Schindler Aufzüge AG, Ebikon (CH), Manager drive development
1986 - 1990 Siemens AG, Nürnberg, Development engineer for electric drive systems
1986 Graduate degree: Dipl.-Ing. (FH) Elektrische Energietechnik, Nürnberg
2010 - Today Norbert Fischer Consulting, Hafenlohr, Managing Director
2009 Bosch Rexroth AG, Lohr a. Main, Head of Project „Semiconductor market Asia“
2006 - 2008 Bosch Rexroth B.V. Eindhoven (NL), Head of Sales & Marketing for product area „Semiconductor & Medical“
2004 - 2006 Bosch Rexroth AG – Electric Drives and Controls GmbH, Lohr a. Main,
Head of Sales „drive solutions“
2000 - 2004 Bosch Rexroth AG – Indramat Refu GmbH, Metzingen, Vice President Sales and Service
1998 - 2000 REFU DRIVES (Schweiz) GmbH, Tegna (CH) - Managing Director
1993 - 1998 Schindler Electronics AG, Locarno (CH) Manager Drive solutions for elevators
1994 - 1995 HWV Luzern (CH) - Post graduate studies in general management
1990 - 1993 Schindler Aufzüge AG, Ebikon (CH), Manager drive development
1986 - 1990 Siemens AG, Nürnberg, Development engineer for electric drive systems
1986 Graduate degree: Dipl.-Ing. (FH) Elektrische Energietechnik, Nürnberg
Abstract
UDCSTM Ultra Damping Ceramics, a newly invented ceramic material is effectively damping vibrations and noises in demanding motion applications, yet as its name explains, it still obtains the high rigidity property as conventional ceramics. Due to its unique characteristics UDCSTM can be easily machined, and thus designed into your mechatronics system and reduces the tuning effort for the motion systems.
UDCSTM is a break-through material in today’s semiconductor and related equipment market where one permanently pursues for more precision, higher through put and cost reduction.
UDCSTM is a break-through material in today’s semiconductor and related equipment market where one permanently pursues for more precision, higher through put and cost reduction.
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Go Green with Intelligent Tool and Facilities Control and Equipment Refurbishment for Legacy Semiconductor Manufacturing
Jochen Kinauer, Business Development/Director of Sales Semiconductor
AIS Automation
Biography
Jochen Kinauer is Director for Sales and Business Development at AIS Automation Dresden GmbH. – A worldwide operating company as part of the Roth & Rau Group, with it’s headquarter based in Dresden, Germany. AIS Automation is specialized on equipment automation and MES installation, with more than 60 MES installations and automation projects worldwide.
Previously Jochen Kinauer was working as Project Manager for several hardware and software automation projects for the semiconductor industry.
Jochen Kinauer is Leader of the Silicon Saxony RFID Cluster and holds a degree in Electrical Engineering, Controls & Automation from the Technical University of Munich.
Previously Jochen Kinauer was working as Project Manager for several hardware and software automation projects for the semiconductor industry.
Jochen Kinauer is Leader of the Silicon Saxony RFID Cluster and holds a degree in Electrical Engineering, Controls & Automation from the Technical University of Munich.
Abstract
Energy Consumption is a high cost factor for Semiconductor Manufacturing. Reducing the need of energy will reduce manufacturing cost and improve the environmental sustainability of semiconductor manufacturing.
Sources of energy consumption are:
1237 Manufacturing Equipments
1238 Manufacturing Environment
1239 Facilities Supplies
1240 IT & Office Supplies
Semiconductor equipment manufacturer have already reduced the energy consumption of their tools and IT & Office Supplies are constantly improving the energy consumption year over year. – So what can be done more?
There is high potential in reducing non productive time of manufacturing equipments and to combine manufacturing planning with facilities control to supply media as needed to manufacturing equipments. Modern 300mm semiconductor manufacturing has partially implemented similar solutions. – But this is also a chance for 200mm manufacturing to reduce cost and energy consumption with improved equipment efficiency and additional monitoring capabilities with refurbished equipments.
This presentation will outline the needs of 200mm fabs to INCREASE EFFICIENCY and CONTROL ENERGY CONSUMPTION by using AIS Automation’s FabEagle Suite.
