Fab Managers Forum - Abstracts and Biographies
Heinz Kundert, President
SEMI Europe
Biography
Heinz Kundert was named president of SEMI Europe in October 2005. His responsibility includes overall guidance of the SEMI activities and membership outreach all over Europe and the CIS countries and he belongs to the Global Executive Team of SEMI International.
As part of the SEMI mission Heinz Kundert is focusing on providing higher level of services for SEMI members/customers and to increase their satisfaction in Europe and CIS. To strengthen the European-based semiconductor industry by providing a valuable platform to enhance innovation and manufacturing capabilities is one of the prime goals.
Kundert has been within the semiconductor industry for 23 years when he joined Balzers in Liechtenstein, a global supplier of thin film equipment for semiconductor manufacturing and related applications. He began as a sales manager for Asia and expanded his role of responsibility through several positions within the company. In total he lived more than five years in Asia before he became COO of the newly formed company Unaxis that was a merger between Balzers and Leybold. From 2002 Kundert was named CEO of Unaxis.
During his tenure Kundert expanded business in semiconductors, optics, optical discs, hard coatings, space and vacuum with a major focus on the Asian market where he generated 50 percent of the revenue.
Kundert has a degree in mechanical engineering and business administration with a federal diploma from the FAH/University of St. Gallen, Switzerland
The Crystal Ball 2.0– 2012 and Beyond . . . What Changed from 2003
Michael Campbell, Senior VP, Engineering
Qualcomm CDMA Technologies
Biography
Michael Campbell is Senior Vice President of Engineering for QUALCOMM CDMA Technologies, responsible for QCT Product and Test Engineering, Test Automation and Failure Analysis. Mike joined QCT in 1996 as a Staff Engineer/Manager and during the last 13 years, Mike has led a diverse set of responsibility at Qualcomm. At Qualcomm, Mike has been responsible Design Automation, Yield optimization, Product Engineering, Test Engineering, and Foundry semiconductor analysis.
Mike was one of the key drivers to develop and expand the Qualcomm design center in India, helped drive the establishment of a foundry independent process for wireless chips in Qualcomm and started a test development center in Singapore. In his current role, he is working with the design to production infrastructure to optimize test and yield to bring Qualcomm's leading edge products to market by developing partnerships / processes to optimize design stability, yield and test time early in the product cycle.
Prior to joining QUALCOMM, Mike was an engineer and manager at several semiconductor companies, including Mostek, INMOS and Honeywell.
He holds a BSEE & CE from Clarkson University.
Abstract
A discussion on trends and drivers in the marketplace that will fill the semiconductor fabs over the next few years.This talk is designed to look at some of the historical high volume products/ trends and how semiconductor technology, markets and products are likely to change. In my view the semiconductor industry is poised for another round of change. Major changes have occurred and are continuing in computing, mobile electronics, data gathering, and delivery. The growth challenges and recent trends across the industry indicate that in advanced digital technologies, fewer players can afford to compete given challenges in process technology (e.g., EUV, double patterning. The same trends indicate that the rising costs (e.g., 450mm fabs, validation) and growth appears to be concentrating digital in select segments, such as mobile communications and computing. In analog technology realm the growth industry drivers are similar, however, the challenges to volume and value are different. Looking forward there are multiple product / market trends that will drive the growth and value add of the semiconductor industry. This talk will explore the product trends (and speculation), the change in markets and ways of doing business that impact growth and value.
Power Semiconductors, Key Enablers for Energy Efficiency
Martin Hierholzer, VP & GM
Infineon Technologies
Biography
- 1962: Born in Karlsruhe, Germany
- 1982: Studies of Electronics at Technical University of Darmstadt
- 1989: Project Manager for Intelligent Power Modules at ABB-IXYS
- 1994: Head of R&D at eupec (European power electronic company)
- 2005: Vice President & General Manager of Industrial Power at Infineon Technologies
Abstract
1/3rd of worldwide consumed Energy is Electricity and this portion is growing over proportional. This offers a huge potential for energy savings by use of Power Electronics. This presentation will show how to save energy along the whole electrical supply chain from generation, distribution and consumption by smart use of power semiconductors and will indicate the challenges of a technology leader in this segment.
Ulrich Schulz, PE Manager FFAB,
Texas Instruments
Biography
Ulrich Schulz started as Process Engineer with Texas Instruments Freising in August 1988 as in Photolithography and Process Integration. B/0 2001 He overtook the rule as Photo Section Manager. During this time he was also responsible for the Process Yield in Freising. In 2007 he spent half a year in Ti Japan. Coming back Ulrich Schulz overtook also Epi/Implant was integrated in his responsibility. Since e/o 2009 he is in charge of the Process Engineering Organization in Freising.
Clustering : a Path for Improving Productivity and Business Efficiency of SC Manufacturing
Alain Astier, Group VP Front-End Technologies
STMicroelectronics
Biography
Alain Astier is working within the Front-End Technology and Manufacturing organization of
STMicroelectronics as Director of Strategic Planning and Programs, and has held this
position since January 2008.
Alain ASTIER joined Thomson Semiconducteurs, a predecessor company to
STMicroelectronics, in 1977. He occupied several operational functions in Grenoble area,
including Front-End Operations Director and Site Manager; then in 1987, he moved to
Central Manufacturing Organization of the Company, in charge of the standardization of
Manufacturing practices and tools across the world-wide Front-End Operations. In 2004, he
was appointed Director of Strategic Planning of the Front-End Technology and
Manufacturing organization, driving the 5 year plan process and the Front-End industrial
strategies. In 2008, he extended his scope to Strategic Programs of the two organizations:
Technology R&D and Front-End Manufacturing, where he managed several strategic
programs of cooperation and business with external Partners.
Alain Astier is Member of the SEMI Europe Advisory Board and is the Grenoble coordinator
of the cooperation between the two European Microelectronics Clusters of Grenoble (France)
and Dresden (Germany).
Alain Astier was born in France, in 1954, and graduated with a degree in Physics from the
University of Grenoble and from two French Engineering High Schools (ECAM, Lyon, and
Sup’Elec ESE, Paris).
Abstract
The presentation will analyze the benefits of Clustering for Manufacturing by exploring several
areas:
• definition of Clustering,
• example of clustering at ST,
• situation of Clustering in Europe,
• cooperation between Clusters;
Then will be explored the direct or indirect benefits to get organized in Clusters either within a
Semiconductor Company, either within a Region or within Europe.
Advanced Semiconductor Production through 200/300mm Manufacturing Capabilities
Otto Graf, Vice President Production Front-End Villach
Infineon
Biography
Qualification:
- Degree in Electrical Engineering (HTL, 1985)
- Career:
- 1980: Start as engineer at Siemens Bauelemente OHG in Villach
- 1993-1995: Director Module Management Production Villach
- 1995-2004: Head of Production Villach and Wafertest
- 2004-2008: Head of Production Frontend Villach and Regensburg
- 2004: Chair ASMC – Int. Manufacturing Conference (Boston)
- 2005: Support for Start-up of the Infineon Powerfab Kulim in Malaysia and training of 300 future Malaysian employees over a period of 6 months in the EU
- Since 2008: Vice President Production Frontend Villach and Manufacturing Innovation Fab Villach
- Since 2009: Board member of a regional business cluster (micro electronic cluster)
Abstract
Around 1,400 products are manufactured in the microchip production facility in Villach with about 1,500 employees (production only). In the last fiscal year, nearly 17 billion chips left the facility. Production area spans over three manufacturing halls and one wafer-testing hall representing cleanroom area of 10,000m² and a accumulated investment of about 1 billion Euro.
Innovation
The focus of Manufacturing Innovation contains the areas Zero Defect, Automation and Digitalisation. These competencies promote the success worldwide and secure the economic future of Austria as a business location.
Development and Implementation of:
- Automation concept to develop the next level of zero defect (iRobotic)
- Paperless production and advanced digital production data acquisition and control
- New materials (SiC, GaN for power semiconductor)
- Development of the innovation project for the worldwide first 300mm powerchip pilot line
- Manufacturing concepts for new materials (SiC, GaN for power semiconductor
Paradigm Shifts in Semiconductor Technology Development
Dirk Wristers, VP Process Technology R&D
GLOBALFOUNDRIES
Biography
Dirk Wristers is Vice President of Technology Research & Development for
GLOBALFOUNDRIES in Dresden, Germany, where he is responsible for driving
an industry-leading roadmap in support of the next generation of advanced
silicon technologies.
Dirk has more than 20 years experience in the semiconductor industry and has
held several key leadership positions within the Technology Research &
Development organizations of both Advanced Micro Devices and
Motorola/Freescale Semiconductor during this period. Dirk has been responsible
for the introduction of several innovative technology solutions associated with
some significant products/product families in the semiconductor industry, such as
AMD’s “Athlon/Opteron” microprocessors, Motorola’s “Power PC”
microprocessors, and several key products in the embedded microcontroller
market space.
During the past 5 years Dirk has been a member of the board of directors of
several technology start-up companies in the medical software industry and has
been an executive member of the SOI Consortium Board of Directors. Dirk has
authored/co-authored 20+ technical publications and has been awarded >60 US
patents. Topics include advanced transistor architecture, ultra-thin dielectrics for
device applications, strain engineering, advanced well engineering, and bulk
materials processing.
Dirk received both his Bachelors and Masters Degree in Physics from Baylor
University, and a Ph.D. in Materials Science & Engineering from the University of
Texas in Austin.
Abstract
As we enter the second decade of the 21st century, the world continues to undergo a
technological transformation as significant as the Industrial Revolution. Industry leaders
are struggling to understand the impacts of social networking, to harness the power of
cloud computing, and to determine how to best deliver on the promise of unlimited
connectivity. In a competitive landscape dominated by form factors, app stores, and
operating systems, the glory days of the processor wars—when silicon innovation drove
each wave of new technology—would appear to be ancient history. But nothing could
be further from the truth. Semiconductor technology is very much at the heart of today’s
revolution. Mobile device makers, for example, are increasingly turning to advanced
process technology to squeeze greater performance and power-efficiency from their
designs. This trend is being driven by the fabless industry, which relies on close
collaboration with foundry partners to drive continued innovation. This presentation will
explore the role of semiconductor technology in accelerating time-to-market and
delivering a superior experience to consumers, as well as the larger challenges facing
the entire semiconductor ecosystem in overcoming the barriers to continued technology
scaling.
Optimum Use of a Given 200mm FAB: Analog Technologies at Texas Instruments
Klaus Schimpf, Product Engineering and Development Manager, Freising Waferfab
Texas Instruments
Biography
- 1993: Diploma in Physics (Uni Cologne)
- 1997: PhD in Physics Research Centre Juelich: InP-HEMT's
- 1997: joined TI-Freising as process development engineer
- 1997-2009: various positions in product engineering and developent
- 2009: Product engineering and Development MGR
Abstract
Keeping an attractive technology roadmap is a challenge today for many 200mm Fabs since huge investments or the availability of high end tools prevent them from running the most advanced technologies. Nevertheless, the analog market can still be attractive without highend equipment.
We present an overview about Texas Instruments' Analog process portfolio and show some examples for key components in these technologies that can be realized even without most advanced processing capability.
200 mm Semiconductor Production at Bosch in Reutlingen- Ramp up with BOSCH Production System (BPS) -
Thorsten Widmer, Vice President Wafer Production
BOSCH
Biography
Dr. Thorsten Widmer was born and educated in Germany. His graduated in physics at TU Braunschweig in 1992. After PhD graduation in Paderborn in 1995 he worked for tree years as post doc at TU Braunschweig. In 1998 he started at Robert Bosch Reutlingen in diode manufacturing area. As section manager he was responsible for the process engineering and international customer support. Between 2003 and 2006 he worked as departmental Manager for Robert Bosch sensor manufacturing in Hatvan Hungary. From Septemer 2006 until 2010 he was the responsible Project Manager for the set up of the new 200 mm semiconductor production at Robert Bosch in Reutlingen. Since October 2010 he is Vice President Wafer Production in Reutlingen
Abstract
The introduction of the BOSCH Production System (BPS) was started in 2001. The aim of BPS is to streamline the value stream in all process steps and to avoid waste.
The new 200 mm semiconductor fab is planned and build up in agreement with the BPS principles from the beginning.
The presentation will highlight in detail the BPS approach for the 200 mm semiconductor production at Bosch in Reutlingen. The speaker will show how BPS is used during the ramp up phase of the 200 mm semiconductor production.
Panelists
Philippe Campion, Manufacturing Operation Manager Deputy
STMicroelectronics
Biography
1979 Doctor Engineer in Organic Chemistry - Montpellier / France
1980 Process Engineer at IBM - Corbeil-Essonnes / France
1984 He joigned STMicroelectronics in Photo & Etching Process Department - Rousset / France
1988 –1990 He transfered 4" technologies in Singapore (Ang-Mo-Kio) and was responsible for MOS 4" fab
1991–1995 5” Fab Manager + in charge of 6” conversion - Rousset / France
1996 –2002 6” Operation Manager (10Kwafer/week) - Rousset / France
Since 2003 Technical Director, Deputy of operation of 8” Fab - Rousset / France
Ramp up from 2Kwafer/week to 8Kwafer/week
