Gerhard Lammel is Senior Manager MEMS at Bosch Sensortec, responsible for advanced development. Since 2005 he managed several sensor development projects and is part of the founding team of Bosch Sensortec. Before, he was responsible for the process development for an integrated pressure sensor in the business unit Automotive Electronics of Robert Bosch GmbH. He obtained his PhD in 2001 from the Swiss Federal Institute of Technology in Lausanne, Switzerland. Gerhard Lammel studied physics and economics at the University of Munich. He founded two small high-tech companies for computer networks and computer graphics in 1991 and 1995. He is inventor and co-inventor of over 40 patents.

With 30 years working of expertise in management and technical experience in the MEMS industry, InvenSense CEO Steve Nasiri infuses leadership, innovation and passion across the company’s core business, structure, and culture.
Steve founded InvenSense, the pioneer and global market leader in intelligent motion processing solutions that enable a motion-based user interface for consumer electronics, and has served as President, Chief Executive Officer and Chairman since its inception in 2003. Based on the patented Nasiri-Fabrication platform developed by Mr. Nasiri, InvenSense supplies consumer electronic OEMs worldwide with the smallest, most robust and competitively priced MEMS gyroscopes, the enabling technology in motion processing.
Prior to founding InvenSense, Steve held various positions as a co-founder and executive of several MEMS companies, including SenSym (acquired by Honeywell), NovaSensor (acquired by General Electric), Integrated Sensor Solutions (acquired by Texas Instruments) and ISS-Nagano GmbH. He also held key management and operations positions at several semiconductor companies, including National Semiconductor, Fairchild Semiconductor and Maxim Integrated Products. Steve is an inventor in over 50 patents and patent applications, and has authored many published papers and articles on MEMS technology. Steve earned an M.B.A. from Santa Clara University, a M.S. in Mechanical Engineering from San Jose State University and a B.S. in Mechanical Engineering from the University of California, Berkeley.

Motion interface is rapidly becoming ubiquitous in many leading consumer electronic devices, such as, smartphones, tablets, smart TVs, gaming and many others, and it is expected to exceed an annual shipment of 2 billion units by 2016. Today, motion interface is offered only in high-end and more costly devices due to their overall complexity, cost, size, and lack of available complete plug and play solutions.  Only a limited number of more sophisticated OEM vendors have been able to incorporate motion interface into their devices by using a number of discrete motion sensors and developing their own proprietary motion fusion algorithms. What the market really needs is a fully integrated motion track device that is plug and play and capable of enabling all motion interface applications. MEMS is emerging as the leading technology for addressing this market need and ability to deliver on small size, high performance, and lowest cost.

There is a growing demand for a fully integrated MotionTracking device that can quickly and easily deliver full motion interface capability for all consumer electronic products.  Incorporating a motion interface is a very complex science requiring integration of a number of discrete motion sensor components, such as, 3-axis accelerometer, 3-axis gyroscope, 3-axis compass and pressure sensor, and a complex algorithmic integration of these sensor output for tracking the motion. Today you can already find fully integrated 6-axis solutions with integrated 3-axis accelerometers and gyroscopes including integrated sensor fusion functionality. It is expected that fully integrated 9- or 10- axis integrated MotionTracking devices packaged in small 4x4x0.9mm packages will become available in the not to distance future. Advances in MotionTracking technology has created all new motion interface functionalities that can enable many new user interfaces such as, performing one-to-one motion control, recognizing motion gesture commands, controlling content and function by pointing the device in any direction and or controlling menus on a Smart TV by simple point and click, and finally assisting to track your location indoors. MotionTracking function integration in new generation of consumer electronics are expected to become as simple and as easy as all other recent transformational technologies, such as camera modules, Bluetooth, and Wi-Fi.

This talk will present the key principals technologies used for Motion Tracking technology; how it can improve the user experience through a variety of intuitive motion interface applications; key design considerations and vision for future technology and market trends. 

 

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Evgeni Gusev received the M.S. degree in applied physics/molecular physics and the Ph.D. degree in solid-state physics from Moscow Engineering Physics Institute-Technical University in 1988 and 1991, respectively.  In 1993, he joined the Laboratory for Surface Modifications, Rutgers University, NJ, first as a Postdoctoral Fellow and then as a Research Assistant Professor, where he performed research on fundamental aspects of gate dielectrics. In 1997, he was a Visiting Professor with the Center for Nanodevices and Systems, Hiroshima University, Japan. Shortly after that, he joined IBM, where he was responsible for several projects in the field of advanced silicon technologies at both Semiconductor Research and Development Center in East Fishkill, NY, and T.J. Watson Research Center in Yorktown Heights, NY. Since July 2005, he has been with the MEMS Research and Innovation Center, Qualcomm MEMS Technologies, San Jose, CA, where he is currently a Senior Director in charge of Technology R&D. He has co-edited 17 books and published more than 150 papers. He is a holder of more than 40 issued and filed patents. Dr. Gusev is a member of several professional committees, panels, and societies.

Coloration in nature is generally realized in two ways, through pigmentation or by means of controlling the flow of photons in thin optical films or/and 3D structures. Recent developments in micro- and nano-fabrication allow one to fabricate structures that can mimic iridescence in nature by manipulating light in a controlled manner in MEMS/NEMS architectures, thus opening up a window for a variety of novel devices and applications.  The Qualcomm mirasol® reflective display is a high speed, electrostatically actuated, bistable MEMS device built on a transparent (e.g. glass) substrate.  Based on principles of interferometric (IMOD) light and color modulation and microelectromechanical device operation and fabrication, this emerging technology demonstrates unique attributes of low power consumption and consistent image quality in various ambient lighting conditions, including bright sunlight, which makes it particularly attractive for direct view mobile display applications.   Additionally, the intrinsic fast switching of the MEMS pixel elements enables video operation of mirasol displays at various refresh rates.
In the presentation, we will give an overview of basic electromechanical physics of the device, materials, processing and reliability aspects.  Status of technology development and product commercialization in the past several years will also be addressed as well as current focus on color e-reader/tablet and mobile phone applications. Finally, fabrication principles of the devices and business for large scale manufacturing will also be discussed.  

Hillcrest Labs 

Ultimately, the success of any technology is dependent upon the satisfaction of the end-users of products that incorporate or utilize the technology.  MEMS Inertial and Magnetic sensors are no different.
Whether being used in medical devices, robotics, or consumer electronics devices such as smartphones, game controllers, or Smart TV remote controls, the success of motion sensing devices is dependent on the quality of the entire system.  This includes the sensor devices and the software stack that integrates those sensors into a product to deliver a holistic, engaging overall user experience.
This presentation focuses on the key software elements that provide the linkage from the raw sensor output to the end-user product and how these elements fit together to create the optimum result by addressing specific aspects of system functionality.  The presentation will cover sensor fusion, calibration and compensation for temperature and aging variations to improving user control.  It will also address the value of matching quality sensor technology with high quality, high performance software to ensure OEM success in using motion sensors.

Stéphane Gervais-Ducouret has 19 years of experience in the semiconductor industry as global marketing, business development, project management, and product designer.
He has worked for multi-national companies in Europe and in Asia in the consumer and mobile phone segments. Stéphane also has experience in emerging technologies and markets. His current position is global marketing for sensors at Freescale semiconductor and he is focusing on consumer and mobile phone market development.
Stéphane holds a Doctorate degree (Ph. D) in Electronics from the University of Bordeaux (France) and is pursuing an MBA degree from Newcastle University, Australia.
He holds a European and US patent in MEMS application.

MEMS high growth rate is driven by mobile phones and by adding more sensor technologies within the same device: Si microphone, accelerometer, magnetometer, pressure sensor… Such breath of technologies featured with low-power, small size and low-cost constraints, can only grow robustly if they are combined efficiently and effectively. The depth of MEMS and sensors is therefore the next key enabler for further growth and adoption. It can be achieved through merging sensors or in more generic way through intelligent sensor hubs.

The breadth of MEMS and sensors technology will be reviewed with some more challenges for innovation. A solution for sensor data fusion to address the depth will also be presented with the MMA955x family.

Anssi Blomqvist is currently working as Senior Manager of Product Development at VTI Technologies Oy. In his role he is in charge of MEMS design and testing development activities and project lead engineer organization.
Anssi joined VTI after graduating in physics from the University of Helsinki in 1997. Work for his master's thesis on optical MEMS was conducted in a joint R&D project between VTT and Vaisala Oyj. At VTI he worked as MEMS design engineer specialising in gyroscopes before taking management role with team responsibility in 2002. Since 2005 Anssi has been responsible for VTI's MEMS element design development. He is the author or co-author of 9 patents in the field of MEMS sensors.

For VTI the investment in developing its own state of the art 3D MEMS technology has really paid off. By combining novel Cavity-SOI structure wafer with VTI's proprietary glass / silicon feed-through cap wafer and hermetic anodic bonding in controlled atmosphere VTI created a robust process platform for high performance gyros and accelerometers. Today VTI has a total of 7 different product designs on the platform, so in that sense the famous MEMS law - "One product, one process" has been broken.
The first of those designs is the gyroscope of the SCC1300 product family. This component, with a MEMS die of only 7.75 mm2, has proven to outperform even some of the high-end instruments on the market. This kind of totally new price-performance ratio enables a multitude of new applications and market segments.

 

Biography

Mr. Stephenson has over 19 years of experience in the semiconductor industry. He has held various engineering and management positions with Texas Instruments, WaferTech (a subsidiary of TSMC), Ebara Technologies, Inc., Novellus, Inc. and STMicroelectronics.  Brian holds a Bachelors Degree in Engineering Physics from Southwestern Oklahoma State University.

As more and more applications are imagined for MEMS technologies and manufacturing techniques, there is a growing push (and need) for MEMS manufacturers to provide standardized MEMS processes and test protocols.  The idea behind this standardization is that it will help foster more widespread growth of MEMS into different application areas, reduce the time to market and overall development costs by offering standardized processing platforms that designers can leverage to build their devices on.  However, MEMS standardization can be a double edged sword, providing shorter time to market and lower development costs but at the expense of reducing the value add of the MEMS designer, placing them into a much smaller physical box within which to design their devices and making product differentiation more difficult.  In this talk we will look at some of the misconceptions regarding what standardization means, contrasting that with the semiconductor model, which many strive to have the MEMS industry move toward, and why a different view of standardization may be more appropriate to help improve the MEMS industrialization cycle.

 

 

Dr. Peter Merz was born in Switzerland in 1972. He received the M.Eng. (Dipl.-Ing.) in materials science from the University of Kiel in October 1997. He awarded his PhD in 2003 on the development and replication of microstructures in different materials. From 1998 on he has been working for Fraunhofer ISIT within the project management on the development and industrialization of MEMS products like sensors, through-silicon vias or micro optical components. He was technical leader for the ISIT / SensorDynamics joint development of the MEMS process platform PSM-X2 (Polysilicon Surface Micromachining process platform for vacuum-packaged sensors) which succeeded to bring the first inertial MEMS combi sensor on the market. He holds broad experience within complex process industrialization and transfer from prototype phase to volume production according to VDA 6.3 and ISO/TS 16949 as well as management of the production part approval process (PPAP). In 2009 he founded the MEMS Foundry Itzehoe as a spin-off enterprise from Fraunhofer.

In this contribution the peculiarities of MEMS manufacturing is depicted and an overview of present business approaches is given. Especially the modell of combining MEMS R&D services and production within the same clean room manufacturing environment is presented. This dual-use concept seems to be a chance to handle the tremendous cost pressure which advanced 8 inch MEMS production processes imply. Major assets and drawbacks of such a shared cleanroom facility are discussed. We finally present the successful implementation of such a dual-use concept between Fraunhofer ISIT and the MEMS Foundry Itzehoe GmbH.

 

Dipl. Ing. Andreas Nagy is Business Unit Manager at Multitest, Germany. Since 2003, he has been responsible for MEMS and Striptest bussiness at Multitest.
He got his degree at the Technical University of Munich in Mechanical Engineering. After university he spent 2 years in the Semiconductor Industry as a design engineer before he moved for 6 years in the printing industrie working for Agfa, Kodak and Heidelberg Printing Press. There he spent 3 years in Rochester, NY, USA at a development project for a digital printing press. Changing back into the Semiconductor business he got into the management responsibility he is currently in.

While MEMS manufacturing becoming more and more mature even at 8 inch wafer technology for the most of the suppliers, the integration of various MEMS sensor applications within one package is creating a bottle neck at final MEMS test and calibration. Due to the unique stimulus requirements for the sensors the stimulus architecture often does not allow to easily combine them into one and the same test handling machine. In addition the temperature sensitivity of the MEMS often requires temperature test. Therefore the cost of test and calibration of the packages or MEMS modules is significantly increasing. Other trends like constant package size reduction and increasing specification requirements are negatively influencing the test cost as well. The initial invest into final test equipment could become a barrier especial for smaller companies and start ups.

Solution:
Within the presentation different approaches and concepts will be brought into mind, how to support multiple MEMS stimuli and even reduce the cost of test for multiple MEMS packages. The joice of the right test strategy and process is now becoming key. For example wafer level electrical or physical stimulus offers one opportunity to shift some of the requirements from final test to front end. But final calibration often requires to also consider the packaging.

 

 

Mr. Robert has been involved in the Semiconductor industry for more than 30 years. He joined Teledyne DALSA Semiconductor's Bromont foundry in 1981. From 1987 to 1997 he held  various management positions in Process and Manufacturing Engineering and at the Bromont foundry . In 1998 and 1999, he was head of Mitel Semiconductor  waferfab operations in Jarfalla Sweden. He came back to the Bromont Foundry in late 1999 as  Director of Sales  and Marketing with the mandate of developing the Teledyne DALSA Bromont Foundry as a key MEMS Foundry supplier. He has been promoted  Vice President Sales and Marketing in 2006. Mr. Robert has a degree in electronics from Sherbrooke College and a degree in Business Management from University of Sherbrooke.

Time to Market is known to be significantly longer for  MEMS products  than typical Semiconductor products. This has limited the growth of the MEMS industry and have cause the failure of many products, programs,  or startup Companies. This presentation will describe how Teledyne DALSA Semiconductor will use the newly built MEMS C2MI R&D center in order to reduce the development cost and  Time to Market of new, advanced, MEMS products.

Paul Lindner is executive technology director at EV Group headquarters in St. Florian, Austria. With 20 years experience in the semiconductor industry, Mr. Lindner's past work includes involvement in many aspects of Semiconductor and MEMS equipment manufacturing.
Based on mechanical engineering background he started working at EV Group in 1988 as mechanical design engineer. His responsibilities included the design of various different semiconductor processing systems and tooling for custom applications. Innovative system designs pioneered in first commercially available wafer bonders, SOI bonding systems or precision alignment systems for 3D Interconnect applications. Prior to his appointment as executive technology director, Lindner has established a product management department at EV Group. During that time he was involved in marketing, sales, manufacturing and on-site process support. Customer orientation throughout all steps of product development, innovation and implementation in a production environment are among the main goals of EV Group's technology groups headed by Mr. Lindner. His current responsibilities as executive technology director include new technology development by heading R&D, product, and quality management, business development and process technology departments.

 

Audun Roer, Senior Program Manager, Sensonor Technologies AS
Audun Roer has been with Sensonor since 2001 and currently leads the Thermal Imaging development activities at Sensonor focusing on high performance, low cost microbolometers based on SiGe quantum well thermistors. He is the former program manager for Tire Pressure Sensor products which is a high volume MEMS product in the automotive business segment.

A microbolometer with peak responsivity in the long wave infrared (LWIR) region of the electromagnetic radiation is developed at Sensonor Technologies. It is a 384 x 288 focal plane array with a pixel pitch of 25µm, based on monocrystalline Si/SiGe quantum wells as IR sensitive material.
The quantum well thermistor material is transferred to the read-out integrated circuit (ROIC) by wafer bonding. The ROIC wafer containing the released pixels is bonded in vacuum with a silicon cap wafer, providing hermetic encapsulation at low cost. The resulting wafer stack is assembled in a standard ceramic package.
The architecture of the pixels and the ROIC, the wafer packaging and the electro-optical measurement results are presented.

 

 

Masayoshi Esashi received the B.E. degree in electronic engineering in 1971 and the Doctor of Engineering degree in 1976 at Tohoku University.
He served as a research associate from 1976 and an associate professor from 1981 at the Department of Electronic Engineering, Tohoku University. Since 1990 he has been a professor and he is now in The World Premier International Research Center Advanced Institute for Materials Research (WPI-AIMR) and concurrently in Micro System Integration Center (μSIC) (director) in Tohoku University. He served as a general co-chairman of the 4th IEEE MEMS in 1991, as a general chairman of the 10th Transducers in 1999.
He has been studying microsensors and micromachined integrated systems.

MEMS (Micro Electro Mechanical Systems) which are heterogeneous integration on chips have been used as key components in various systems. Various MEMS have been developed in Tohoku University since 40 years ago collaborating with industry. MEMS switch for LSI tester, optical scanner for ranging imager, MEMS microphone for TV, accelerometer and gyro for automobile, catheter for oH and PCO2 monitoring and capacitive vacuum sensor have been commercialized by making prototypes using versatile facility in which small 20 mm square wafers are processed. Packaging and integration have been developed for the application oriented MEMS.
 Integrated capacitive pressure sensor was developed 20 years ago and commercialized in Toyota Machine Work. Wafer level packaging was applied for the fabrication.

 

Mike is currently serving as MEMS Global Product Manager within the 200mm Equipment Products Group (EPG) at Applied Materials, Inc.  He has over 15 years of technology focused product and business development experience. 

Mike brings to his role significant MEMS domain knowledge and device level expertise having developed MEMS based solutions for xerography and ink-jet printing, photonics and optical switching, and Laser/VCSEL integration and packaging, to name only a few application areas.
Prior to joining Applied Materials Mike held various contributor level and senior leadership positions within the United States and Australia, working for technology focused companies that include Xerox Corporation, Australian Microelectronics Centre (AMC) and National ICT Australia (NICTA). 
His technical qualifications include B.Eng (Hons) and Ph.D. degrees in Microelectronics Engineering and MEMS, respectively.  In addition to his technical qualifications, Mike has an MBA with specializations in Marketing, Business Strategy and Entrepreneurship.
He has authored a 15 journal and conference publications and holds over 25 U.S. patents concerning various applications of MEMS and Microsystems technology.

The 2006 debut of the Nintendo Wii game controller marked the first major use of a MEMS based inertial measurement unit (IMU) in the consumer electronics world.  Since then, MEMS have undergone a steady commoditization as their adoption into the consumer market has grown. Accompanying that growth are the short cycle generational pressures of the consumer market that place considerable pressure on device designers to produce ever smaller, higher performing and less costly MEMS devices.  
This presentation shows one approach to reliably creating the next generation of smaller and higher performing MEMS devices – ‘Submicron MEMS’.
The operation of currently commercialized accelerometers and gyroscopes, arguably the volume drivers behind consumer electronics’ adoption of MEMS, is for the most part governed by the fundamental rules of capacitance ~ εΑ/g. 
The gap or spacing of the comb-finger pairs can determine device sensitivity or depending on the mode of operation, the driving voltage of the device.  Formed using a Deep Reactive Ion Etch (DRIE) process, control of the gap width and quality of the spacing through the device thickness are critical to the performance of todays’ electrostatically operated MEMS devices.  Based on a newly developed DRIE reactor from Applied Materials, the concept of ‘Submicron MEMS’ is explored, demonstrating the challenges to delivering submicron gaps for electrostatically operated MEMS and discussing the benefits to the design of the next generation of MEMS based IMUs. 
While current MEMS devices typically employ DRIE to depths of 30µm or 40µm, it is the goal of this presentation to demonstrate submicron gaps that extend beyond these depths while maintaining sidewall scallops, profile and tilt within the specifications currently required by designers of MEMS devices.  In delivering such a fabrication capability to the market place, device designers will be able to reliably design smaller, more sensitive MEMS devices with ultimately lower per unit volume costs.   In achieving this level of precision and process control in DRIE, Applied Materials is working to deliver the next generation of MEMS design and fabrication capability through the advancements made in the development of new and improved DRIE production equipment.

 

Fabrizio Siviero graduated in Physics in 2000 at the Università Degli Studi Di Milano (Italy), were he also obtained a PhD in Physics in 2003 with a thesis on the in-situ characterization of carbon nanostructures. After spending four years as a researcher at the Institute of Photonics and Nanotechnology of the Italian National Council of Research (CNR) and at the Polytechnic University of Milano, mainly focusing on nanostructures for sensors and catalysis, he joined SAES Getters S.p.A. Corporate R&D Laboratories in 2008, where he is head of the Vacuum Technology lab. He is co-author of more than 15 papers on international journals.

Antonio Bonucci, after graduating in 1998 in Aerospace Engineering at the University of Pisa, joined SAES getters in 2000, where he is responsible of Application Engineering and System Analysis, a staff function of SAES Getters R&D Director. His activity is mainly focused on the conceptual design of encapsulation and atmosphere control in a wide range of applications (solar cells, displays, vacuum technology, MEMS). He is co-author of 14 patent families, 26 scientific papers and contributions to handbooks about OLED and MEMS technology.

Andrea Conte graduated in Physics in 1990 at the Università Degli Studi Di Milano (Italy). After 2 years in the Institute of Plasma Physics (IFP) of the Italian National Council of Research (CNR), joined SAES Getters S.p.A. Corporate R&D Laboratories in 1993. Since 2008 SAES R&D Deputy Manager. Author or co-author of more than 10 international publications in the field of vacuum technology and getter technology. Co-author of more than 10 patents in the field of getter technology.

Marco Moraja,  after graduating in Electronics in 1994 at the Polytechnic University of Milano, he joined SAES getters as project engineer in R&D corporate laboratories, focusing mainly on MEMS getter film basic research activities. From 2004, as Business Development Manager of the getter for MEMS Business Unit, he took the responsibility of SAES getters MEMS products line. He currently covers the position of Business Manager of Sensors and Detectors area inside the Business Unit Industrial Applications. He authored and co-authored more than 20 technical and scientific papers, being inventor or co-inventor of more than 10 international patents, most of them directly related to MEMS applications.

Olivier Gigan is a senior engineer in the Grenoble facility of Tronics, an international full service MEMS manufacturer. Dr Gigan has more than 10 years of experience in MEMS. He joined  Tronics in 2000 and has been since involved in several  MEMS transducer and sensor development and industrialization projects. Dr Gigan obtained his PhD in Microelectronics and Microsystems from Paris university after graduating in Electronics from ESIEE in Paris.

Isabelle Thomas has received her degree in Physics from Polytechnic National Institute of Grenoble and joined Thales. Since 1988, she has been involved in MEMS technologies development with deep experience in silicon etching, silicon wafer bonding and assembly. She has filed several patents on MEMS technology and devices. From 1997 to 2003, she has been the lithography and wafer bonding workshop manager in the MEMS production line. During the year 2004, she was at the head of the MEMS production line. Since 2005, she is the leader of the process integration team and is involved in the planar inertial MEMS development project.

The evolution of Micro Electro Mechanical Systems (MEMS) is posing new technical challenges for the packaging of these devices. The integration of thin film getters is recognized to be a reliable and enabling technology whenever stringent vacuum requirements must be satisfied to achieve the desired performances and lifetime (for example in gyroscopes and IR microbolometers).
While the relation between the device performances and the internal atmosphere (pressure and composition) has been object of several theoretical and experimental studies, the question about lifetime prediction is still very difficult to answer in a reliable way.
Once that the MEMS design and getter characteristics are fixed (material, thickness, area), three main factors contribute in determining the preservation of the required vacuum conditions: the gas load of the production process, outgassing and leaks. The first one determines the residual capacity of the getter after sealing, while the other two sources of gas have to be managed all along the required device lifetime.
An experimental approach to the evaluation of these three contributions is followed, including specific leak testing techniques and residual gas analysis (RGA). Accelerated life tests are performed according to a scheme in which both the storage conditions and the original getter area are varied. This allows evaluating the gas load during the process and the characteristics of the outgassing evolution. These pieces of information are collected in the context of a suitable model of the getter interaction with the gas sources, allowing to extrapolate a reliable estimation of the device lifetime.

 

 

Eric Pabo is the business development manager for MEMS for EVGroup, prior to accepting this position he was the bonding applications engineer for North America for EV Group.  Before joining EVG he spent 5 years working on wafer level packaging and assembly processes for Agilent Technologies.  He has over 20 years experience in electronics manufacturing, is a professional engineer registered in the State of Colorado, is finishing his Six Sigma Black Belt Certification and earned a Bachelor’s Degree in Mechanical Engineer from Colorado State University.

 

Wafer level bonding for capping or zero level packaging continues to be a key technology for most MEMS (Micro Electro Mechanical Systems) devices because it allows the micro scale mechanical device to survive downstream processing and the operating environment.  Historically this wafer to wafer bonding was performed using anodic for glass to silicon bonding and glass frit bonding for silicon to silicon.  Anodic bonding has had limited application because of it being normally limited to bonding glass to wafer and the sodium that is present in this process.  In glass frit bonding the glass frit material is applied in a specific pattern by screen printing and the minimum line width of the frit material is constrained by the resolution limitations of the screen printing process.  When the MEMS die were larger and the cost pressures were lower the wafer area that was consumed by the bond line and its impact on the die cost was acceptable.  However, as the die sizes shrink thus increasing the die per wafer and reducing the cost per die, the percent of the usable wafer area consumed by the bond line increases.  This negates a significant portion of the savings from the die shrink which not acceptable due to ever increasing cost pressure.  Metal based wafer to wafer bonding can be used to substantially decrease the percentage of the wafer area consumed by the bond lines.  This presentation will review the metal bonding technologies available, the possible reduction in required bond line area as well as the related design rules.

 

Thorsten Heuser, received the M.Sc. degree in micro- and nanotechnology from the University of Applied Sciences in Munich, Germany, in 2005. He worked one year for Schott Electronic Packaging GmbH before joining EPCOS in 2006. He works in the process development team of the backend department at EPCOS. Over the last years he was engaged in wet chemical and planarization processes. Currently, he is working on wafer bonding technologies for new SAW packaging strategies.

Christian Bauer joined EPCOS AG, Systems Acoustics Waves Business Group 1998. Throughout his career with the company he has worked in the process and technology department among others on lithography, wet chemical, singulation, grinding and bonding processes. Over the last years he was responsible for the development of packages for SAW devices, and currently he is the project leader for Wafer-Level-Packaging. He was awarded as a "Six Sigma Black Belt" within the NOKIA certification program. Mr. Christian Bauer received his “Diplom-Ingenieur” in material science from Friedrich-Alexander University Erlangen-Nuernberg.

Viorel Dragoi is currently Chief Scientist for wafer bonding at EVG. He graduated Faculty of Physics – University of Bucharest in 1995. Between 1988 and 1998 he occupied various positions in the National Institute of Materials Physics Bucharest (assistant, junior researcher). In 1998 he joined the wafer bonding group from Max Planck Institute of Microstructures Physics (MPI) – Halle, Germany. His main research interest was focused on direct wafer bonding of dissimilar materials (Si and GaAs) but also worked on wafer bonding applications in the fields of MEMS, photonics and LEDs. He received his Ph.D. in August 2000 from Institute of Atomic Physics – Bucharest, Romania. He is co-author of more than 80 contributions to international conferences and papers in international journals, as well as three book chapters. His research interest is focused on wafer bonding technology development.

Gerald Mittendorfer is the head of process technology for EV Group (St. Florian/Inn, Austria), a global supplier of wafer processing equipment for semiconductor, MEMS and emerging nanotechnology markets.  In his current role, Mittendorfer is responsible for overseeing process development and support specifically for nanoimprint, lithography and wafer bonding activities at EV Group’s headquarters in Austria.  He joined EV Group in 2001 as a process engineer where he was involved in supporting pre-sales activities through customer sample processing and demonstration of processes on EV Group equipment.  Prior to joining EV Group, Mittendorfer was working in different areas of the chemical industry including analytical chemistry and polymer engineering. 
Mittendorfer graduated from Höhere Technische Bundeslehranstalt Wels in chemical engineering, and received a masters of business administration degree, with an emphasis in general management, from the University of Krems, Austria.

 

Markus Gabriel, is product specialist for new wafer bonding business like the temporary bonding and debonding for 3D integration. He has been working for more than 10 years with SUSS MicroTec in Germany and USA on various positions. He is member of the SEMI Europe committee on MEMS.
Ulrike Schoembs, Ulrike Schoembs is responsible for product management of the manual mask aligners at SUSS MicroTec. Having set off a practical career in mechanical engineering Ulrike joined SUSS MicroTec in 2003 and started off in various positions in Applications and Product Engineering. In 2006 she received an academic degree in precision and micro engineering. Since 2006 she is also holding a teaching position in microsystems engineering at the Fachhochschule Munch.

Thomas Dietrich: Academic education: Study of Chemistry at Johann-Wolfgang-Goethe-University, Frankfurt, Germany, PhD: "Thin Film Deposition of Amorphous Silicon for Solar Cells" 1991, Head of the "Photolithography and Etching Processes" group at the Institute of Microtechnology, Mainz (IMM), 1991-1996, Founder and CEO of mikroglas (since June 1996).

MEMS devices can nowadays be found almost everywhere. Only a few examples are automobiles, the growing market of consumer electronics as well as microfluidic devices for BioMEMS and medical applications. As for the next few years the largest growth within MEMS is forecasted for microfluidic devices several companies focus in this field where liquids need to be handled and treated in a microsystem. 
Wafer processing contributes a big portion of the overall device costs and is a relevant cost portion of the whole manufacturing process. Therefore MEMS manufacturers try to streamline their processes by reducing process steps and at the same time grow the complexity of the manufactured devices. Today typical microfluidic devices for chemical and biochemical applications often require special surface treatment or the implementation of catalysts. With a new equipment setup and technology for selective plasma activation developed by SUSS MicroTec and Fraunhofer IST it is possible to replace or even reduce commonly used process steps and therefore simplify the standard manufacturing of MEMS devices. Recently such a Y- shaped  microseparator was built at mikroglas chemtech GmbH using selective plasma treatment to change the surface properties in one of the channels of the device. Even closed microchannels can be treated which can for example avoid contamination and which further simplifies the process steps.
The selective plasma treatment is based on a dielectric barrier discharge in atmospheric pressure. The setup is implemented into a standard mask and bond aligner so that the exact alignment of electrode and wafer will be ensured and an exact gap setting can be used.
The selective treatment can be either done on structured wafers where the top or bottom surface will be treated by controlling the gap or it can be done by a structured electrode on a plane or structured wafer.
This development is a major step to further streamline the MEMS manufacturing process. The technology itself but also experimental data will be presented.

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Christian Schaefer, VP and Head of the Plasma Systems Business Unit of PVA TePla AG since 2006; with offices in both Munich-Kirchheim, Germany and Corona, CA, US. Christian has over 25 years of capital equipment experience and holds a MS degree in Metallurgical Engineering (1980) and a Ph.D. in Material Science (1984) from the Technical University of Aachen in Germany.
Previously he has worked at LEYBOLD SYSTEMS, Germany, for 14 year as General Manager for their PVD/PECVD systems. Later he served EV GROUP, in Austria, as global Senior VP Sales and Board Member for 7 years in support of their Photolithography and Wafer Bonding systems.
PVA TePla Plasma Systems specializes in unique low pressure Plasma Processing equipment, offering advanced RF and Microwave plasma technologies which are utilized across a broad spectrum of customers, applications and markets which include Semiconductor incl. MEMS & HBLED/OLED, Industrial, Electronics & Life Sciences:
Front-End Semiconductor plasma applications include photo resist ashing and descum, as well as polymer, SU8 and sacrificial layer removal for MEMS devices. Pre-Assembly solutions include stress relief, Chip Side Healing (CSH) and passivation for ultra-thin wafer technologies below 25µm thickness.
Back-End Semiconductor plasma applications include pre-wire bonding/pre-encapsulation cleaning and surface activation for Flip Chip, stacked dies, MCM and advanced Cu lead frames as well as for descum processes for Wafer Bumping.
Industrial & Life Science plasma applications include cleaning and surface activation, decontamination, deposition and chemical functionalization for polymers, metals used in printed circuit boards, micro-fluid devices and a broad range of medical devices including orthopaedic implantables, contact lenses, intraocular implants, catheters and stents

 

Mr. Bouchaud is head of marketresearch for MEMS and sensors at IHS iSuppli.  His breadth of knowledge of MEMSapplications and individual markets, such as MEMS sensors for automotive,consumer markets and RF MEMS, is unique to the industry.
Jérémie is a graduate of the MunichUniversity of Applied Sciences and of Ecole Supérieur de Commerce of Grenoble. He was in chargeof technology transfer for sensors and MEMS at the German office of CEA-LETI (leading French R&D center in semiconductor and MEMS) between 1998 and 2000when he joined WTC as co-founder.

 

Eric Mounier is Senior Analyst at Yole Development, a market research company based in France. Eric Mounier is Responsible for MEMS Equipment & Materials analysis. He has performed more than 100 market & technical analysis related to the micro & nanotechnologies. He is author of numerous reports on MEMS Markets trends. He is also Editor-in-Chief for Yole Media activity. He received his PhD degree in Semiconductor from National Polytechnic Institute of Grenoble.

After 3 relatively flat years, MEMS sales jumped 25% in 2010. This market growth is accompanied by changes in the supply chain as well. These changes are driven by the maturing of the MEMS industry (e.g. MEMS microphones) and because of the emergence of combo sensors (we estimate inertial modules will account for >1/3 of the consumer inertial market in 2016 and will find acceptance in automotive as well). New opportunities (back-end, test, processing…) go together with technical and commercial challenges. We will review our updated 2010-2016 MEMS market forecasts, the different business models of the MEMS industry and how they currently evolve. We will show combo sensors challenges & opportunities as an example.

Michelle M. Bourke received a B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University, Edinburgh, Scotland, U.K., in 1993. Subsequently she joined the Defence Evaluation and Research Agency (DERA), where she worked on advanced processing methods for GaAs/AlGaAs optoelectronic devices. Joining Trikon Technologies in 1997 as an etch engineer she developed technologies for <0.25µm processes for advanced silicon technologies and a variety of different compound semiconductor processes. In 1999 she moved into Product Marketing and after 2 years transferred to Ottawa as North American Product Marketing and Sales Support Manager. Joining STS plc in 2003 as a Product Marketing Engineer she was promoted to Product Marketing Manager in 2004 and then to Business Development Manager in 2006. In 2010 Michelle joined Oxford Instrument Plasma Technology as a Senior Product Manager.

As Micro Electro Mechanical Structures (MEMS) are adopted in more and more commercial and industrial applications some areas look to the nano world for developing technologies.  In this paper the two leading techniques for deep etching of silicon, namely the “Bosch” process and a cryogenically cooled process will be discussed.   We will update the latest results for these techniques and also look at the growing importance of nano-scale etching of silicon, which can be achieved consistently using the cryogenically cooled process.  The paper will also discuss atomic layer deposition (ALD) and demonstrate the role it can play in advanced micro and nano devices.

 

 

Fraunhofer Institute for Photonic Microsystems IPMS  

Michael Müller studied physics at the Technical University Dresden,
Germany, and received his diploma in 1985.
From 1985 to 1990, he was a research fellow at the Technical University Dresden,
where he worked in the field of solid state physics at low temperatures.
Between 1991 to 2003 he headed projects for the development of infrared
sensors and optical MEMS at Fraunhofer IMS Dresden and ZMD, Zentrum für
Mikroelektronik Dresden.
Since 2003 he has been with the Fraunhofer IPMS Dresden, where he was the
head of department Engineering from 2005 to 2011 and responsible for the
development of MEMS technologies. Since 2011 he has been responsible for the
business development for MEMS fabrication at IPMS.

 

Based on the expert knowledge gained in 20 years Fraunhofer IPMS provides services from
early R&D stage to marketable products. Beside our know-how in the field of micro scanning
mirrors and spatial light modulators we provide broad expertise in developing and
manufacturing of MEMS such as pressure sensors and photo diodes.
In the field of MEMS the Fraunhofer IPMS provides foundry services for single process steps,
process modules and also processes for complete MEMS products. It covers the entire value
chain from technology and product development to pilot-fabrication. IPMS is focused but not
limited to MOEMS.

Fraunhofer IPMS has the technological experience for Bulk MEMS micromachining as well
as for Surface MEMS technology including the monolithic integration with CMOS.

In Bulk MEMS technologies three dimensional structures are created out of the single
crystalline silicon wafer. Typical structures are trenches, bars, membranes etc.
Micro Scanning Mirrors for deflection of light have been developed at Fraunhofer IPMS
using Bulk MEMS technology. Scanning mirrors can be used for pico projectors, endoscopic
systems and compact infrared spectrometers.

Surface micromachining allows the monolithic integration of MEMS devices on top of a
CMOS wafer. The fabrication of the MEMS devices – sensors or actuators – is done in a back
end process following the CMOS process. The moveable parts are created with a so called
sacrificial layer technology. Spatial light modulators with very complex structures are the
main application for surface micromachining at Fraunhofer IPMS. Spatial light modulators
with up to 1 Million individual addressable micro mirrors on top of a CMOS backplane can
be applied in micro lithography, structured illumination and Adaptive Optics.

Fraunhofer IPMS uses a 1500m2 state-of–the-art class 10 clean room for R&D and pilot
fabrication. 

Besides research and development, Fraunhofer IPMS provides pilot fabrication in order to
close the gap between first prototypes and volume manufacturing. IPMS offers the fabrication
of customer specific MEMS based on IPMS technologies as well as processes developed on
customers demand. A large number of customer specific MEMS designs have already entered
pilot fabrication stage and are delivered to industrial customers in small and medium
quantities.

 

Rolf Schmidt is Sales Manager Frontier Account of Dainippon Screen Deutschland GmbH,  
responsible for the promotion of Dainippon Screen new product lines, i.e. Frontier Project.
Prior to accepting this position he was Key Account Manager of Entegris GmbH, providing
Microcontamination-Control and Wafer-Management Solutions to the Semiconductor-Industry
and in charge of New Business Development. He holds an engineering degree in Measurement
and Control and serves the IC-Industry for 28 years.

The Screen Group supports the continued development of products that are environment-friendly.
Screen achieved 2008 a 67% reduction in CO2 emission for its Single Wafer Cleaning Equipment
compared with year 2000 levels. To further enhance environment-friendly IC-Manufacturing Screen
launched its Frontier Project, resulting in the release of 2 new “Green Device”-Products for R&D and
high-variety small-lot production.
• CW-1500 – compact batchtype Auto Wetcleaning System suited for 2”-8” Wafersize;                                     
the tool provides 2/3 smaller footprint compared to typical linear systems.
• ZI-2000 – Wafer Pattern Inspection System for 5”-8” Wafersize; the tool provides high
inspection performance combined with high throughput and easy operation.

 

 

Roth&Rau Microsystems 

Andrea Kunz studied Technical Physics between 2001 and 2005 in Zwickau. After her graduation she joined the service department of Roth & Rau and was later promoted to Sales Director. At present she is responsible for the sales in all German-speaking countries and the Americas.

 During the past decade Micro-Electro-Mechanical Systems (MEMS) have significantly penetrated the sensor market in the automotive industry, in mobile communication and in wireless sensor applications. This tendency is mainly caused by the outstanding advantages of MEMS components due to their small size and weight, their modest power consumption and low cost, their high reliability and the possibility of combining mechanical and electronic components on one chip.
Most magnetic sensors are nowadays based on MEMS devices like Giant Magneto Resistance (GMR) and Tunnel Magneto Resistance (TMR) sensors. In electric signal processing MEMS components are also of large importance for passive filtering processes that are used in wireless communication and which are based on Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) devices. Different device principles are utilized to convert the input signal (piezoelectric, magneto-resistive, and optical) into the mainly electrical output signal.

Using these components leads to higher demands on the processing techniques. With Ion Beam techniques like Ion Beam Etching or Ion Beam Trimming it is possible to etch almost every material, including special metals such as Au, Cr, Fe, Ni, Pd, Pt Ru, Ta, etc. During Ion Beam Etching processes a certain anisotropy or selectivity of the etch process is often required. Different strategies for the processing will be presented for the use of MEMS.