Connected World: New material Challenges and Solutions
Date: 15–16 November 2017
Time: 12:30 –18:00 / 09:45–13:00
Location: Room 13a
The Material conference brings together key players from the semiconductor industry ecosystem to share insights on the latest developments in advanced materials. The conference will delve into what’s driving demand for new materials and packaging and discuss how suppliers and chip manufacturer are responding to problems driven by application requirements. This year’s edition will focus on emerging materials, such as FD-SOI and ferroelectric memories, as well integration trends across the entire microelectronics supply chain to meet application requirements particular in the area of automotive and mobile communication. The presentations will show latest innovations and provide an insider’s outlook.
The automotive segment represents the most stringent industry when it comes to reliability of semiconductor products. With the recent development of power train control and safety control, electronic control unit (ECU) is required to work in highly intelligent operation (state monitor, power management, etc.) with high stability and reliability, even under high temperature environment like engine compartment. Advanced process technology is imperative to achieve high densities that are necessary for semiconductors to meet these conditions. Ferroelectric hafnium oxide and the derived FeFET memory as well latest FD-SOI technology have already been demonstrated to show high temperature stability.
In the world of mobile communication and the internet of things (IoT) more and more end products will require the use of silicon chips like microcontrollers. In next-generation of communication devices, further advances in speed to ultra-high-speed data transmission using ultra high frequencies will become possible, and linking with other digital devices and the offering of never-before-available high quality new services are expected, too. For ultra-high frequencies, the occurrence of parasitic capacitance plays a major challenge. Further, the chips have to fulfill stringent manufacturing cost requirements since they must not significantly affect the overall Average Selling Price (ASP) of the end product. Moreover, due to the fact that a certain spectrum of IoT products, in particular for narrow band IoT applications, often have limited access to power supply, memory and processing unit - these products have to be very energy efficient. All of these requirements are perfectly matching with FDSOI and FeFET technology and accordingly it represents ideal components for the age of IoT. More technical details and discussion opportunities will be given during this year’s conference.
Call for Papers:
Is now open! > Call for papers
Please submit your abstracts, biography and a photo via internet until 28 April 2017.
Abstracts submitted via fax, e-mail, post, or other methods will generally not be accepted.
> Materials Conference Committee