Advanced Packaging Conference (APC)
|Date||13 – 14 November 2018|
|12:30 – 17:45 / 08:30 – 13:30|
|Location||ICM Munich - Room 13b|
Advanced Packaging and Test is now an indispensable part of the final electronic product and as systems develop, the challenges to achieve higher performance, smaller form-factor, higher reliability levels and lower cost continue to drive the industry.
There are increasing numbers of new applications emerging which question the ability of existing packaging technologies to meet the requirements. It is evident that new packaging technologies are needed and this next generation of advanced packaging and test requirements may be done by IDMs and Foundries instead by OSATs.
This year’s Advanced Packaging and Test Conference will bring together the experts of Semiconductor Wafer FABs and IDMs (Frontends) and Packaging, Assembly and Test in OSATs, Test Houses and IDMs (Backends) to review and consider developments in functional materials, system robustness, inspection methods and flexible test concepts.