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Advanced Packaging Conference (APC)

Advanced Packaging Conference (APC)

Advanced Packaging Conference (APC) 
Technology trends – what´s new, what´s missing, what´s next
 

Date   13 – 14 November 2018
12:30 – 18:05 / 09:00 – 14:00
    
     
Location   ICM Munich - Room 13b
     
Foreword 
 
Advanced Packaging and Test is now an indispensable part of the final electronic product and as systems develop, the challenges to achieve higher performance, smaller form-factor, higher reliability levels and lower cost continue to drive the industry.
There are increasing numbers of new applications emerging which question the ability of existing 
packaging technologies to meet the requirements. It is evident that new packaging technologies are needed and this next generation of advanced packaging and test requirements may be done by IDMs and Foundries instead by OSATs.

This year’s Advanced Packaging and Test Conference will bring together the experts of Semiconductor Wafer FABs and IDMs (Frontends) and Packaging, Assembly and Test in OSATs, Test Houses and IDMs (Backends) to review and consider developments in functional materials, system robustness, inspection methods and flexible test concepts.
A wide range of emerging Packaging and Test technologies, processes, equipment 

and
materials will be presented enabling conference delegates to discover new solutions for their systems and products as well as keeping pace with the market demands created with new applications.
     
    Have a look of this year
"APC Conference flyer" 
     
   
Sponsored by:     

             

 

 


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Pricing*:

  Date Members Non-members Onsite Students
CONFERENCE 13 - 14 Nov. 2018 395 € 495€ 590€ 80€
             
PACKAGE: Test 
Advanced Packaging Conference,
Power Electronics Session
13 - 15 Nov. 2018 395€ 495€ 590€ 80€
             
DAY TICKET            
Tuesday, 13 Nov. 2018 13 Nov. 2018 450 € 585 € 650 € 80 €
Wednesday, 14 Nov. 2018 14 Nov. 2018 450 € 585 € 650 € 80 €

*The prices include catering and conference proceedings.  
Day tickets grant access to the conference center (ICM) and the TechARENA / TechLOUNGE sessions on the selected day. 

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