SEGMENTS

Increasing device complexity born of continued device scaling, three-dimensional device architecture (3D IC, TSV), system-in-package (SiP) and system-on-chip (SoC) devices, and new packaging and interconnect designs, as well as differing requirements for different device types (logic, RF, analog, power, mixed signal, memory, etc.) create ongoing challenges for semiconductor test.
SEMICON Europe will address test topics in exhibits from the world's leading test companies and in technical sessions focused on the evolving challenges and changes in semiconductor test. Test topics to be addressed at SEMICON Europa include:

Exhibitors offering services for Test
>Test Exhibitor list

Conference related to Test
>13^th European Manufacturing Test Conference (EMTC)
>CAST Workshop
>International MEMS/MST Industry Forum

TechArena Test Presentations
>TechArena Agenda

Test, MEMS and Advanced Packaging Pavilion
Visit our MEMS, Test and Packaging Pavilion in Hall 2.

Are you a supplier of test equipment or services? And not yet exhibiting?
Check out how you can easily join the Test Exhibitor community at SEMICON Europa.
>details for exhibitors