SEGMENTS

Advances in microelectronics design are accompanied by new requirements and challenges for packaging. Smaller, more complex devices, as well as devices built for mobile electronics have increasingly unique needs for interconnect, reliability, durability, and thermal management, among others. Additionally, as front-end and final manufacturing processes become more integrated, packaging has become integral to the design, manufacture, and function of microelectronic devices.
Packaging issues are pervasive across SEMICON Europa, with sessions focused on packaging for ICs (including 3D IC), LEDs, and MEMS..

Exhibitors offering services for Advanced Packaging
>Exhibitor list

Conference related to Packaging
>Advanced Packaging Manufacturing Conference
>International MEMS/MST Industry Forum

TechArena Packaging Presentations
> TechArena Agenda

Test, MEMS and Advanced Packaging Pavilion
Visit our MEMS, Test and Packaging Pavilion in Hall 2.

Are you a supplier of Test equipment or services? And not yet exhibiting?
Check out how you can easily join the Test Exhibitor community at SEMICON Europa.
>details for exhibitors