Advances in microelectronics design are accompanied by new requirements and challenges for packaging. Smaller, more complex devices, as well as devices built for mobile electronics have increasingly unique needs for interconnect, reliability, durability, and thermal management, among others. Additionally, as front-end and final manufacturing processes become more integrated, packaging has become integral to the design, manufacture, and function of microelectronic devices.
Packaging issues are pervasive across SEMICON Europa, with sessions focused on packaging for ICs (including 3D IC), LEDs, and MEMS..
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