In the pursuit of building more functionality into ever-shrinking silicon real estate, device designers and manufacturers have crossed into the third dimension. 3D IC technologies have jumped to the forefront of innovation in the microelectronics industry, touching every aspect of the supply chain from design to final test, with each step and process presenting unique challenges and opportunities.
3DIC technology is in the spotlight at SEMICON Europa, with technical sessions, keynote presentations, and exhibitors all dedicated to products, technologies, and solutions for 3DIC, including design, device fabrication, packaging, and test.
Exhibitors offering services for 3D IC/TSV
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