2017FLEX Europe – Be Flexible
Date: 15–16 November 2017
Time: 10:00–17:00 / 10:00–17:00
Location: ICM, 14c
By co-locating with Europe’s largest semiconductor manufacturing event and held in cooperation with the Fraunhofer EMFT’s forum BE-FLEXIBLE 2017, the FLEX Europe Conference takes advantage of the intersection of PE and thin silicon (Si) devices.
Key technical topics are expected to be covered such as: Thin Silicon, Flexible Sensors, Heterointegration on Flex, Bendable Electronics, Reliability of Flexible Electronics, and Robotics.
We can leverage the assets of the global semiconductor industry to build a new class of flexible hybrid electronics (FHE). Markets being impacted by FHE include structural health monitoring,
the Internet of Things (IOT), and medical devices, among others.
Specific applications include wearable electronics, smart packaging, smart sensor systems, and physiological monitoring devices.