2017FLEX Europe – Be Flexible
Date: 15–16 November 2017
Time: 10:00–17:00 / 10:00–17:00
Location: Messe Munich, 14c
By co-locating with Europe’s largest semiconductor manufacturing event and held in cooperation with the Fraunhofer EMFT’s forum BE-FLEXIBLE 2017, the FLEX Europe Conference takes advantage of the intersection of PE and thin silicon (Si) devices.
Key technical topics are expected to be covered such as: Thin Silicon, Flexible Sensors, Heterointegration on Flex, Bendable Electronics, Reliability of Flexible Electronics, and Robotics.
We can leverage the assets of the global semiconductor industry to build a new class of flexible hybrid electronics (FHE). Markets being impacted by FHE include structural health monitoring,
the Internet of Things (IOT), and medical devices, among others.
Specific applications include wearable electronics, smart packaging, smart sensor systems, and physiological monitoring devices.
Call For Papers: Deadline Extended!
Is still open. > Call for papers
Please submit your abstracts, biography and a photo via internet until 24 May 2017.
Abstracts submitted via fax, e-mail, post, or other methods will generally not be accepted.
Register for the Materials, MedTech, and/or Automotive ticket – a package deal including several conferences and sessions related to Materials, MedTech, and/or Automotive.