Test, Assembly, and Advanced Packaging

In less than a decade, the mobilization of electronics has enabled revolutions in computing, communications, entertainment, and social networking among others. Key to the growth of this mobility have been advances in manufacturing and materials technologies in the areas of advanced packaging, assembly, and test. These technologies have in turn mobilized the power of Moore's Law to bring more powerful, more complex, and more affordable devices to more people around the world.

• Advanced Packaging
• European Manufacturing Test

We encourage operational case studies and application related presentations, i.e. on joint projects (reference cases) between users and suppliers. Papers should be non-commercial and focus on the technical/economical merits of a process rather than on individual company’s products. Papers will be solicited for the following programs:

Click below to view complete Call for Papers Instructions

• 10th European Manufacturing Test Conference (EMTC) will be celebrating its 10th anniversary and continuing its tradition of focusing on practical solutions in the production test environment
• Advanced Packaging Conference is organized in cooperation with IMAPS Europe and focuses on solutions in advanced device packaging manufacturing operations.

For more information on the call for papers submission requirements please contact europrograms@semi.org or call SEMI Europe at +32.2.289.64.99