Test and Packaging Exhibitor Presentations

 
Date: 20 October, Messe Dresden
Room: TechARENA, Hall 1 (free for all visitors)

Session on the SEMI TechARENA are free and do not require pre-registration. Seating is limited, please arrive early.

TEST EXHIBITOR PRESENTATIONS

11:30

"ATEip - Unique, Ultra Compact and Scalable ATE for Wafer and Final Test"
Frank Grossmann, Sales Manager, ATEip

11:45

“T2000 Flexible Solutions for SoC Test”
Toni Dirscher, Product Manager, Advantest

12:00

"Efficient Use of Wafer Level Handler in Motion Sensor Testing"
Vesa Henttonen, CEO, Afore

PACKAGING EXHIBITOR PRESENTATIONS

16:00

"A New Authentication Solution for ICs Packaging"
Roland Meylan, Corporate Communications Manager, Alpvision

16:15

“Latest on Tape Lamination Processes”
Adriano Cairella, Sales Manager, Microcontrol Electronic
Michael Töpper, Head of Group Thin Film Polymers and Photolithography at Fraunhofer IZM

16:30

“Wafer Level Packaging for High Brightness LEDs”
Thomas Uhrmann, Business Development, EV Group

16:45

"NANIUM - The Package Design, Assembly & Test Engineering and Manufacturing Center in Europe"
Steffen Kroehnert, Director BE Technology, NANIUM