Advanced Packaging ConferencePackaging Solutions for the New TechnologiesDate: 9-10 October, 2012 Time: 14:00-17:30 / 08:00-12:30 Location: Messe Dresden
Semiconductor Equipment and Materials International (SEMI) invites Advanced Packaging professionals to submit abstracts for the conference, which will be held in conjunction with SEMICON Europa 09-11 October 2012 in Dresden, Germany. |
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Who should attend?
The conference will review the Technologies, Materials, Processes and Equipment that are being developed in Europe and elsewhere, to spearhead the take up of these advanced packaging needs. Attendance at this exciting conference should be a high on the list of priorities for anyone involved in the needs of future device packaging, including design, development and production. SEMI welcomes the interest of managers, engineers and technicians from the whole spectrum of the semiconductor industry.
Price* Information and Registration | |||
| Before 30 September | After 1 October | Onsite | |
| SEMI Members | 275.- | 325.- | 375.- |
| Non-Members | 325.- | 375.- | 375.- |
| * all Price information in EUR, VAT not included | |||
SEMICON Europa Packaging Committee Members
| R. Aschenbrenner, FhG IZM | A. Longford, PandA | K. Pressel, Infineon |
| E. Bagerman, NXP | J. Mueller, IMAPS | M. Garnier, STMicroelectronics |
| E. Beyne, IMEC | G. Jones, Henkel | K. Schrimper, Hesse-Knipps |
| A. Koller, Oerlikon | S. Kroehnert, NANIUM | |
| A. Fischer, Bosch | T. Oppert, PAC TECH |




