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Advanced Packaging Conference
Date: 19-20 October, Messe Dresden
Room: t.b.d.
Enabling Packaging Technologies for System Integration
The conference will give the opportunity to learn more about most important microelectronics applications developments which enable novel, advanced packaging solutions to be the key drivers in system integration of electronic devices. The presentations will shed light on recent application specific packaging technologies, processing and manufacturing related technologies which can be leveraged as key enablers for cost efficient electronic devices and systems.
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Sponsored by:

Organized by:


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Tuesday 19 October 2010
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13:30
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Welcome
Andy Longford, PandA Europe
Co-chair of the SEMI Advanced Packaging Conference Committee
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SESSION 1: Packaging for Systems
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13:45
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KEYNOTE: “System Design, Drives Package Design, Drives Silicon Design”
Peter Robinson, Package Design and Development Director, CSR
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14:30
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“Modeling and Design of Electronic Packaging Structures for High-Density Integration and High-Speed Applications”
Ivan Ndip, Group Manager of RF & High-speed System Design, Fraunhofer IZM Berlin
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15:00
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“Successful Package Development and Manufacturing of an Automotive Oil Level Sensor System”
Ignas van Dommelen, Director of Development, Marketing & Sales, Elmos Advanced Packaging
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15:30
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“Rapid Design for Manufacturability and Reliability by Virtual Prototyping”
Sven Rzepka, Deputy Department Chair, Group Manager Micro Materials Center (MMC)
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16:00
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Coffee Break
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SESSION 2: Alternative Device Packaging
Session-chair: Andreas Dill, Oerlikon
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16:45
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KEYNOTE: “High Brightness Phosphor Converted White LEDs – Challenges and Solutions”
Raimund Schwarz, Senior Director, Osram Opto Semiconductors
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17:30
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“Micro-Fabrication Enabled High-Bandwidth Packaging to 80GHz”
Sean Cahill, VP Technology, BridgeWave Communications
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18:00
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“Trends in Sensor and MEMS Packaging”
Caroline Beelen-Hendrikx, Director Strategy for Package Innovation, NXP Semiconductors
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18:30
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End day 1
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Wednesday 20 October 2010
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SESSION 3: Embedded Wafer Level Packaging
Session-chair: Klaus Pressel, Infineon
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09:00
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“eWLB Reconstitution - From Idea to Volume Production”
Edward Fürgut, Technology and Innovation, Infineon
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09:30
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“Mechanical Deformation Effects in 300mm Reconstructed eWLB Wafers”
Eoin Otoole, Staff Integration Engineer, Nanium
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10:00
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“The Evolution and Convergence of Advanced Fan Out Packaging in 2D and 3D Structures with Dissimilar Technologies for High Performance, Highly Integrated Systems”
Navjot Chhabra, Redistributed Chip Packaging Manager, Packaging Solutions Development, Technology Solutions Organization, Freescale
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10:30
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Coffee Break
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SESSION 4: Packaging & Materials
Session-chair: Graham Jones, Henkel
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11:00
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KEYNOTE: Substitute Material(s) for High-Lead Solders
Andreas Fischer, Automotive Electronics, Development ASIC & Power Packages, Robert Bosch GmbH
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11:30
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“Polymeric Alternatives to Solder Die Attach for Power Assemblies”
Günther Dreezen, Henkel Electronic Adhesives
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12:00
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“Advanced PVD Solutions for Emerging 3D Wafer Packaging Applications”
Patrick Carazzetti, Business Unit Systems, Oerlikon
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12:30
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“A New Process for Building Coreless Substrates”
Bernd Appelt, Director Worldwide Business Development, ASE – Advanced Semiconductor Engineering Group
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13:00
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End day 2
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Price Information
(19% VAT not included)
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Until
October 1
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After
October 1
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Onsite
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SEMI ir IMAPS Members
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€ 225
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€ 275
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€ 325
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Non-Members
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€ 275
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€ 325
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€ 325
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Sponsorship – Industry Sponsors Wanted!
SEMICON Europa offers corporate sponsorship packages for the Advanced Packaging Conference. If your company is interested, please review the Sponsorship Package or contact Beat Mueller, Director Member Relations at bmueller@semi.org Tel: +41 794656588.
SEMI Europe Packaging Committee members
R. Aschenbrenner, FhG IZM
E. Bagerman, NXP
E. Beyne, IMEC
A. Dill, Oerlikon
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A. Fischer, Bosch
P. Homami, F+K Delvotec
A. Longford, PandA
J. Mueller, IMAPS
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G. Jones, Henkel
S. Kroehnert, Nanium
T. Oppert, PAC TECH
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K. Pressel, Infineon
M. Shaw, STMicroelectronics
I. van Dommelen, Elmos
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