Advanced Packaging Conference

Packaging Solutions for the New Technologies

Date: 9-10 October, 2012

Time: 14:00-17:30 / 08:00-12:30

Location: Messe Dresden

Semiconductor Equipment and Materials International (SEMI) invites Advanced Packaging professionals to submit abstracts for the conference, which will be held in conjunction with SEMICON Europa 09-11 October 2012 in Dresden, Germany.
The conference will give the opportunity to learn more about most important microelectronics applications developments which enable novel, advanced packaging solutions to be the key drivers in system integration of electronic devices.
The presentations will shed light on recent application specific packaging technologies, processing and manufacturing related technologies which can be leveraged as key enablers for cost efficient electronic devices and systems.
Presentations on original, non-commercial works describing recent developments
are welcomed.

Who should attend?

The conference will review the Technologies, Materials, Processes and Equipment that are being developed in Europe and elsewhere, to spearhead the take up of these advanced packaging needs. Attendance at this exciting conference should be a high on the list of priorities for anyone involved in the needs of future device packaging, including design, development and production. SEMI welcomes the interest of managers, engineers and technicians from the whole spectrum of the semiconductor industry.

Price* Information and Registration
	Before 30 September	After 1 October	Onsite
SEMI Members	275.-	325.-	375.-
Non-Members	325.-	375.-	375.-
* all Price information in EUR, VAT not included

SEMICON Europa Packaging Committee Members

R. Aschenbrenner, FhG IZM	A. Longford, PandA	K. Pressel, Infineon
E. Bagerman, NXP	J. Mueller, IMAPS	M. Garnier, STMicroelectronics
E. Beyne, IMEC	G. Jones, Henkel	K. Schrimper, Hesse-Knipps
A. Koller, Oerlikon	S. Kroehnert, NANIUM
A. Fischer, Bosch	T. Oppert, PAC TECH

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