Advanced Packaging Conference Date: 19-20 October, Messe Dresden Room: t.b.d. Enabling Packaging Technologies for System Integration The conference will give the opportunity to learn more about most important microelectronics applications developments which enable novel, advanced packaging solutions to be the key drivers in system integration of electronic devices. The presentations will shed light on recent application specific packaging technologies, processing and manufacturing related technologies which can be leveraged as key enablers for cost efficient electronic devices and systems.

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Sponsored by: Organized by:

Tuesday 19 October 2010
13:30	Welcome Andy Longford, PandA Europe Co-chair of the SEMI Advanced Packaging Conference Committee
SESSION 1: Packaging for Systems
13:45	KEYNOTE: “System Design, Drives Package Design, Drives Silicon Design” Peter Robinson, Package Design and Development Director, CSR
14:30	“Modeling and Design of Electronic Packaging Structures for High-Density Integration and High-Speed Applications” Ivan Ndip, Group Manager of RF & High-speed System Design, Fraunhofer IZM Berlin
15:00	“Successful Package Development and Manufacturing of an Automotive Oil Level Sensor System” Ignas van Dommelen, Director of Development, Marketing & Sales, Elmos Advanced Packaging
15:30	“Rapid Design for Manufacturability and Reliability by Virtual Prototyping” Sven Rzepka, Deputy Department Chair, Group Manager Micro Materials Center (MMC)
16:00	Coffee Break
SESSION 2: Alternative Device Packaging Session-chair: Andreas Dill, Oerlikon
16:45	KEYNOTE: “High Brightness Phosphor Converted White LEDs – Challenges and Solutions” Raimund Schwarz, Senior Director, Osram Opto Semiconductors
17:30	“Micro-Fabrication Enabled High-Bandwidth Packaging to 80GHz” Sean Cahill, VP Technology, BridgeWave Communications
18:00	“Trends in Sensor and MEMS Packaging” Caroline Beelen-Hendrikx, Director Strategy for Package Innovation, NXP Semiconductors
18:30	End day 1
Wednesday 20 October 2010
SESSION 3: Embedded Wafer Level Packaging Session-chair: Klaus Pressel, Infineon
09:00	“eWLB Reconstitution - From Idea to Volume Production” Edward Fürgut, Technology and Innovation, Infineon
09:30	“Mechanical Deformation Effects in 300mm Reconstructed eWLB Wafers” Eoin Otoole, Staff Integration Engineer, Nanium
10:00	“The Evolution and Convergence of Advanced Fan Out Packaging in 2D and 3D Structures with Dissimilar Technologies for High Performance, Highly Integrated Systems” Navjot Chhabra, Redistributed Chip Packaging Manager, Packaging Solutions Development, Technology Solutions Organization, Freescale
10:30	Coffee Break
SESSION 4: Packaging & Materials Session-chair: Graham Jones, Henkel
11:00	KEYNOTE: Substitute Material(s) for High-Lead Solders Andreas Fischer, Automotive Electronics, Development ASIC & Power Packages, Robert Bosch GmbH
11:30	“Polymeric Alternatives to Solder Die Attach for Power Assemblies” Günther Dreezen, Henkel Electronic Adhesives
12:00	“Advanced PVD Solutions for Emerging 3D Wafer Packaging Applications” Patrick Carazzetti, Business Unit Systems, Oerlikon
12:30	“A New Process for Building Coreless Substrates” Bernd Appelt, Director Worldwide Business Development, ASE – Advanced Semiconductor Engineering Group
13:00	End day 2

Price Information (19% VAT not included)	Until October 1	After October 1	Onsite
SEMI ir IMAPS Members	€ 225	€ 275	€ 325
Non-Members	€ 275	€ 325	€ 325

Sponsorship – Industry Sponsors Wanted!
SEMICON Europa offers corporate sponsorship packages for the Advanced Packaging Conference. If your company is interested, please review the Sponsorship Package or contact Beat Mueller, Director Member Relations at bmueller@semi.org Tel: +41 794656588.

SEMI Europe Packaging Committee members

R. Aschenbrenner, FhG IZM E. Bagerman, NXP E. Beyne, IMEC A. Dill, Oerlikon

A. Fischer, Bosch P. Homami, F+K Delvotec A. Longford, PandA J. Mueller, IMAPS

G. Jones, Henkel S. Kroehnert, Nanium T. Oppert, PAC TECH

K. Pressel, Infineon M. Shaw, STMicroelectronics I. van Dommelen, Elmos