Advanced Packaging Conference

The Power of Packaging

Date: 8 - 9 October, 2013

Time: 13:30 - 17:30 / 09:00 - 13:00

Location: Ballroom, Messe Dresden

 

The SEMI 2013 Advanced Packaging Conference provides a unique opportunity to learn more about new developments, package technologies, applications and package solutions for various products used in power applications and system integration. 
New Advanced Packaging technologies and processes for Power Electronics, LEDs, MEMS and Embedded devices are being initiated by European companies together with international OEMs, IDMs and Fabless organisations. Many challenges need to be addressed, in order to package new devices at low cost. For System Integration, the package is now an integral part of the system functionality, be it System-in-Package, More-than-Moore or Heterogeneous Integration at wafer level and on organic substrates. R&D and manufacturing here in Europe are providing the leading Packaging solutions.
The presentations will include Keynote papers from ASE and from Qualcomm. The conference is supported by SPIL and will cover aspects of Power Handling, Size, Interconnection Interfaces, Thermal Management and Heat Dissipation. The programme will shed light on recent application specific packaging technologies, processing and manufacturing related technologies which can be leveraged as key enablers for cost efficient electronic devices and systems.

 

 

Sponsored by:

 

EVG, Logo

 

SPIL, Logo

 

 
Media Partner:

 

 

AGENDA

Tuesday, 8 October

Session 1: 

Chairman: xxx
  
00:00Introduction: xxx
  
00:00TBD
 Keynote: Speaker
  
00:00Coffee Break
  

Session 2: 

Chairman: xxx
  
00:00TBD
 Speaker
  
00:00TBD
 Speaker
  
00:00Networking Reception
  

Wednesday, 9 October

Session 3: 

Chairman: xxx
  
00:00Introduction: xxx
  
00:00TBD
 Keynote: Speaker
  
00:00Coffee Break
  

Session 4: 

Chairman: xxx
  
00:00TBD
 Speaker
  
00:00TBD
 Speaker
  
00:00Closing Remarks
  

Who should attend?

The conference will review the Technologies, Materials, Processes and Equipment that are being developed in Europe and elsewhere, to spearhead the take up of these advanced packaging needs. Attendance at this exciting conference should be a high on the list of priorities for anyone involved in the needs of future device packaging, including design, development and production. SEMI welcomes the interest of managers, engineers and technicians from the whole spectrum of the semiconductor industry.

 

Price* Information and Registration

 
 Before 30 SeptemberAfter 1 OctoberOnsite
SEMI Members295.-345.-395.-
Non-Members345.-395.-395.-
* all Price information in EUR, VAT not included

 

Organizing Committee:

• Rolf Aschenbrenner, Fraunhofer IZM

• Eef Bagerman, NXP

• Eric Beyne, IMEC

• Andreas Fischer, Bosch

• Michel Garnier, STMicroelectronics

• Albert Koller, Oerlikon

• Steffen Kroehnert (co-chair), NANIUM

• Andy Longford (co-chair), PandA Europe

• Jens Mueller, IMAPS Europe Chapter

• Thomas Oppert, PAC Tech

• Amandine Pizzagalli, Yole

• Klaus Pressel, Infineon

• Klaus Schrimper, Hesse-Knipps