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Advanced Packaging Conference (APC)
Interconnects in Miniaturized Systems
Date: 6 - 7 October 2015
Time: 13:30 - 17:30 / 09:00 - 13:00
Location: Ballroom, Messe Dresden
In a wide range of applications from consumer to automotive and power products, lighting, sensors and photonics, system integration in the “More-than-Moore” domain is driving advanced packaging towards further miniaturization and performance enhancement. The package with its electrical, thermal and mechanical properties becomes important part of the system functionality. What did not change by this development is the utmost importance of interconnects as the main feature of semiconductor packages. Systems have different levels of interconnects, often impacting each other. Functionality and reliability requirements of different markets and applications, but also the heterogeneous integration of different interconnect technologies in the same package and system, determine the selection of the right interconnects and the need for further developments. The advanced packaging community is continually presented with a number of challenges that need to be addressed, in order to cost effectively realize interconnects required by miniaturized systems.
Who should attend?
The conference will review the Technologies, Materials, Processes and Equipment that are being developed in Europe and elsewhere, to spearhead the take up of these advanced packaging needs. Attendance at this exciting conference should be a high on the list of priorities for anyone involved in the needs of future device packaging, including design, development and production. SEMI welcomes the interest of managers, engineers and technicians from the whole spectrum of the semiconductor industry.
The 2015 agenda will be posted as soon as possible.