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Advanced Packaging Conference (APC)

Interconnects in Miniaturized Systems

 

Sponsored by:

 

EV-Group

 

SPIL logo

 

 

Date: 6 - 7 October 2015

Time: 13:30 - 18:00 / 09:00 - 13:00

Location: Ballroom, Messe Dresden

 

 

In a wide range of applications from consumer to automotive and power products, lighting, sensors and photonics, system integration in the “More-than-Moore” domain is driving advanced packaging towards further miniaturization and performance enhancement. The package with its electrical, thermal and mechanical properties becomes important part of the system functionality. What did not change by this development is the utmost importance of interconnects as the main feature of semiconductor packages. 

 

Media Partner:

 

 

Systems have different levels of interconnects, often impacting each other. Functionality and reliability requirements of different markets and applications, but also the heterogeneous integration of different interconnect technologies in the same package and system, determine the selection of the right interconnects and the need for further developments. The advanced packaging community is continually presented with a number of challenges that need to be addressed, in order to cost effectively realize interconnects required by miniaturized systems.
This conference will focus on the innovations and developments of the European and Global Semiconductor manufacturing industry that are aimed at developing and improving electrical, thermal and mechanical interconnects of all kinds in a packages and/ or systems for a wide range of applications. The aspects under review also cover interfaces, thermal management and heat dissipation. 
The presentations will shed light on latest interconnect technologies, design, materials, equipments and processes which can be leveraged as key enablers for cost efficient volume manufacturing.

 

Who should attend?

The conference will review the Technologies, Materials, Processes and Equipment that are being developed in Europe and elsewhere, to spearhead the take up of these advanced packaging needs. Attendance at this exciting conference should be a high on the list of priorities for anyone involved in the needs of future device packaging, including design, development and production. SEMI welcomes the interest of managers, engineers and technicians from the whole spectrum of the semiconductor industry.

 

Organizing Committee:

> Advanced Packaging Conference Committee (APC)

 

AGENDA

Price* Information and Registration

 Before 03. SeptemberAfter 04. SeptemberOnsite
SEMI Members315.-365.-415.-
Non-Members365.-415.-415.-
* all Price information in EUR, VAT not included

Book your Automotive package and have this conference included!
Register for the Automotive ticket - a package deal including several conferences and sessions related to Automotive!
  

Book two or more sessions and get a 50% discount!

Register for more than one session, you will get a 50% discount for the additional, lower priced programs you purchase.

> How does it work?