Advanced Packaging ConferenceLeading Edge Packaging Technologies Targeting ManufacturabilityDate: 11-12 October Time: 13:00-17:50 / 08:30-13:00 Location: Room Hamburg 1, Messe Dresden
The conference will give the opportunity to learn more about most important |
| Sponsored by **:
Media Partner: |
Tuesday, 11 October
Welcome | |
| 13:00 | Andy Longford, Senior Consultant, PandA Europe |
SESSION 1: Technologies | |
| Session-chair: | Andy Longford, Senior Consultant, PandA Europe |
| 13:10 | KEYNOTE: Challenges and Opportunities in Advanced Packaging |
| Jan Vardaman, President, TechSearch International | |
| 13:40 | 3D Wafer Level Packaging - Requirements & Technical Approaches |
| Juergen Wolf, Head of Division HDIWLP / ASSID, Fraunhofer IZM | |
| 14:05 | Fine Cu Wire Bonding in High Volume Manufacturing |
| Kay Essig, Technical Program Manager, ASE | |
| 14:30 | New Trends in Power Electronics Packaging |
| Karsten Guth, Packaging Technology Team, Infineon | |
| 14:55 | Industrialisation of Power Inverters and Converters for Hybrid Electrical Vehicles |
| Roberto Tiziani, Power Train Technologies and Materials Manager, Magnetti Marelli | |
| 15:20 | Coffee Break (Hall 2) |
SESSION 2: Materials | |
| Session-chair: | Graham Jones, Sales Director, Henkel |
| 15:50 | Sinter Glue – New Horizons for Semiconductor Packaging |
| Thomas Krebs, Application Engineer, W.C. Heraeus | |
| 16:15 | Low Temperature Glass-Thin-Films for Use in Power and Sensor Applications |
| Jürgen Leib, Business Development, MSG Lithoglas | |
| 16:40 | Using Wafer Applied Underfill for 3D Packaging |
| Kenneth June Rebibis, Thinning Stacking and Package Integration, IMEC | |
| 17:05 | Low Rth Chip Interconnect for High-Brightness LED |
| Klaus Mueller, Development Engineer, OSRAM Opto Semiconductors | |
| 17:30 | The Building Flavors of the “Mid-End" |
| Eric Mounier, Senior Analyst, Yole Développement | |
| 17:50 | Networking Reception (Hall 2) |
Wednesday, 12 October 2011 | |
SESSION 3: Processes | |
| Session-chair: | Jens Müller, Professor, Ilmenau University of Technology |
| 08:30 | Welcome Coffee (Hall 2) |
| 09:00 | Welcome |
| 09:10 | KEYNOTE: ECP® – Embedded Component Packaging Technology |
| Arno Kriechbaum, Project Leader Application Projects, Austria Technologie und Systemtechnik | |
| 09:40 | High-Speed Multi-Die DRAM Packages Fabricated Using Wire-Bond Infrastructure |
| Simon McElrea , President, Invensas | |
| 10:05 | Flip Chip Copper Pillar for Advanced CMOS: How to Anticipate a New Package Platform? |
| Jérôme Lopez, PTM Corporate Packaging and Automation, STMicroelectronics | |
| 10:30 | Key Technical Challenges for Silicon Interposer |
| Gilles Simon, Head of 3D Packaging Lab, CEA-LETI | |
| 10:55 | Coffee Break (Hall 2) |
SESSION 4: Equipment | |
| Session-chair: | Andreas Dill, CEO, Oerlikon Advanced Technologies |
| 11:25 | Challenges to Integrating Organic Materials into Advanced Packaging Applications – A PVD Tool Perspective |
| Simon McClatchie, Process Engineering Manager, Oerlikon Systems | |
| 11:50 | Estimation and Localization of Bonding Defects in 3D-integrated Devices Using Scanning Acoustic Microscopy |
| Sebastian Brand, Department of Microelectronics and Microsystems, Fraunhofer IWM | |
| 12:15 | Thin die Stacking for Wide I/O Interface Memory-on-Logic |
| Thorsten Matthias, Director of Business Development, EV Group | |
| 12:45 | Closing Remarks |
| 13:00 | Networking Lunch (Hall 2) |
Who should attend?
The conference will review the Technologies, Materials, Processes and Equipment that are being developed in Europe and elsewhere, to spearhead the take up of these advanced packaging needs. Attendance at this exciting conference should be a high on the list of priorities for anyone involved in the needs of future device packaging, including design, development and production. SEMI welcomes the interest of managers, engineers and technicians from the whole spectrum of the semiconductor industry.
Price* Information and Registration |  | ||
| Before 30 September | After 1 October | Onsite | |
| SEMI Members | 275.- | 325.- | 375.- |
| Non-Members | 325.- | 375.- | 375.- |
| * all Price information in EUR, VAT not included | |||
SEMICON Europa Packaging Committee Members
| R. Aschenbrenner, FhG IZM | C. Zinck, Yole | T. Oppert, PAC TECH |
| E. Bagerman, NXP | A. Longford, PandA | K. Pressel, Infineon |
| E. Beyne, IMEC | J. Mueller, IMAPS | M. Garnier, STMicroelectronics |
| A. Dill, Oerlikon | G. Jones, Henkel | I. van Dommelen, Elmos |
| A. Fischer, Bosch | S. Kroehnert, NANIUM | R. Beckert, Hesse-Knipps |
** About our Sponsors
Henkel:
Henkel Electronics is the world’s leading supplier of material sets for semiconductor packaging and printed circuit board assembly. Headquartered in Irvine, California, Henkel Electronics is the only materials developer with vast technical expertise for materials required for both package production and electronics assembly. Henkel’s comprehensive, innovative and sustainable portfolio includes renowned industry brands such as Ablestik®, Acheson®, Hysol®, Loctite® and Multicore®. With a global network of research facilities, manufacturing sites and strategic partnerships, Henkel brings customers the local support and global resources they need to ensure quick time-to-market introductions and long-term success.
EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for the semiconductor, MEMS and nanotechnology industry. The broad range of lithography and wafer bonding equipment and inspection systems is developed and manufactured exclusively at EVG’s headquarters in St. Florian am Inn, Austria. Notable industry and production companies are producing innovative micro- and nano components with our certified process solutions. Based on technological leadership and high investment in research and development, EVG has not only gained its market leadership, but also sets worldwide industry standards. Founded in 1980,
EVG operates via a global customer support network with subsidiaries in the USA, Japan, Korea and Taiwan as well as representatives located all over the world. EV Group employs a staff of approximately 500 around the world.
