PROGRAMS & EVENTS

Test and Packaging

Test

14th European Manufacturing Test Conference (EMTC)
Overcoming New Test Challenges through Cooperation and Innovation
> Agenda

 

Test
Exhibitor Presentations (TechArena)
> Agenda

 

 

Packaging

Advanced Packaging Conference
Packaging Solutions for the New Technologies
> Agenda

 

3D IC Session

> Agenda

 

Packaging
Exhibitor Presentations (TechArena)
> Agenda

 

 

Keynote speakers

- Bob Madge, Director Design Enabled Manufacturing, Globalfoundries

 

Keynote speakers

- David McCann, Senior Director Technical Business Operations, Globalfoundries

- Markus Brunnbauer, Wafer Level Packaging Platform Manager, Intel Mobile Communications