PROGRAMS & EVENTS

Test and Packaging

Test

13th European Manufacturing Test Conference (EMTC)
Mapping Digital Test and Diagnosis Approaches on the Emerging Integrated Analog Mixed Signal Arena
> Agenda
 

Test
Exhibitor Presentations (TechArena)
> Agenda

 

 

Packaging

Advanced Packaging Conference
Enabling Packaging Technologies for System Integration
> Agenda

 

3D IC Session

> Agenda

 

Packaging
Exhibitor Presentations (TechArena)
> Agenda

 

 

Keynote speaker

Michael Campbell, Senior Vice President of Engineering, Qualcomm

 

Keynote speakers

Jan Vardaman, President, TechSearch International

Arno Kriechbaum, Project Leader Application Projects