450mm Session

450mm Status and Overview

Date: 12-13 October

Time: 13:30-17:30 / 08:30-12:30

Location: Garden Hall, Messe Dresden

 

During the past 4 to 5 years, the 450mm wafer size has been first evoked, then  discussed as a dream or a nightmare, but apart from work on setting the standards and some activities on very early prototype equipment, little has actually emerged. The picture has changed during the last year, and the question is no more "will it happen" but rather "when will it start!" …..and "who will be the actors".
Some of the IC manufacturers have already expressed their willingness, and a remarkable percentage of the equipment manufacturers and materials providers are already working actively to be ready on time for the first proto line.
This session will cover the introduction planning and the R&D status including ISMI and European projects on 450mm; the materials status and forecast; the metrology related to 450mm; the equipment development status and the technology and device issues. In addition, the question “will the future technology nodes be developed only in 450mm or still made available in 300mm”  as well as synergies and benefits for smaller diameters will be raised.

 

Related Article:

>G450C Consortium Gears Up for Global Control of 450 Development Efforts

 

Sponsored by:

 

 

Organized by:

 

 

 

Agenda

Wednesday, 12 October

Session 1: R & D + Planning Phase

 Session-chair:

 Lothar Pfitzner, Fraunhofer IISB

 

 

13:30

Welcome

 

 
13:40450mm Wafer Transition – Europe as Part of the Global Endeavour
 Georg Kelm, Head of Sector Nanotechnology, European Commission
  
14:00College of Nanoscale Science and Engineering Program on 450mm
 Michael Liehr, VP for Research, University of Albany
  
14:20450mm; From Plan to Reality?
 Hans Lebon, VP Fab & Process Step Development R&D&M, IMEC
  
14:40The 450mm Transition: Consortium Status, Strategy, and Plan
 Thomas Jefferson, 450mm Program Manager, ISMI Sematech
  
15:00450mm: Promising & Challenging Future
 Laurent Bosson, Founder, LB Consulting
  
15:20450mm: Why, When and How?
 Michel Brillouet, Senior Advisor, CEA-LETI
  
15:40 Coffee Break (Hall 2)
  

Session 2 : Facilities, Silicon & Metrology

Session-chair:Bernie Capraro, EU Research Programme Manager, Intel 
  
16:00SEMI Europe Perspectives and Activities Related to 450mm
 Heinz Kundert, President, SEMI Europe
  
16:15Key Factors for a Successful Industry Transition to 450mm Wafers
 Kirk Hasserjian, Corporate VP, Silicon Systems Group, Applied Materials
  
16:35450mm Wafer Fab Design Considerations
 Peter Csatáry, Head of Group Technologies, Global Technology Group, M+W Group
  
16:55Development of Electrical and Optical Characterization Techniques for 450mm
 Miklos Tallian, Semilab 
  
17:15450mm FOSB / Essential for High Volume Manufacturing
 Akira Kashimoto, Manager, Technology General Group, FI Division, Shin-Etsu Polymer
  
17:35450mm SOI Wafer Technology
 Fabrice Letertre, VP Corporate R&D, Soitec
  
18:00Networking Reception (Hall 2)
  

Thursday, 13 October

Session 3: FEOL  Equipment and Automation

Session-chair:Richard Oechsner, Deputy Head of Department, Fraunhofer IISB
  
08:30450mm Lithography Requirements from an Equipment Maker's Point of View
 Ines Stolberg, Manager Strategic Marketing Litho, Vistec
  
08:50Progress of Development Related to Wafer Handling Challenges, Within EU Collaborative Programs
 Guilhem Delpu, Product Marketing and Collaborative Programs Coordinator, Recif
  
09:10Automation Challenges for 450mm Production
 Geert van der Zalm, Business Development Manager, Bosch Rexroth
  
09:30Learning From the Etch Module in EEMI450 Project
 Mike Cooke, Oxford Instruments
  
09:50450mm Wafer Handling: Challenges and Opportunities Using Ultrasound for Non-Contact Handling
 Michael Schilp, Managing Director, Zimmermann & Schilp Handhabungstechnik
  
10:10Coffee Break (Hall 2)
  

Session 4: Technology & Device Issues

 Session-chair:Guy Dubois, Consultant, GDCL Management
  
10:40Investing in the Future by Accelerating Innovation
 Maria Marced, President, TSMC Europe BV
  
11:00450mm Technology - Benefit and Synergies for Smaller Diameters 
 Lothar Pfitzner, Fraunhofer IISB
  
11:20Collaborative Projects on 450mm within the ENIAC Joint Undertaking
 Andreas Wild, Executive Director, ENIAC, Joint Undertaking
  
11:40First Results From EEMI450
 Richard Oechsner, Deputy Head of Department, Fraunhofer IISB
  
12:00Closing Remarks
 Lothar Pfitzner, Fraunhofer IISB

 

 

Price* Information and Registration

 
 Until OctoberAfter OctoberOnsite
SEMI Members275.-325.-375.-
Non-Members325.-375.-375.-
* all Price information in EUR, VAT not included