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450mm Session450mm: towards a global cooperation
Date: 9 - 10 October, 2013 Time: 14:00 - 18:00 / 08:30 - 12:30 Location: Ballroom, Messe Dresden
As the semiconductor industry continues to make progress in preparing for the next wafer size transition, Europe has been proactive in engaging its Semiconductor Equipment and Materials Companies through the formation and efforts of the European Equipment and Materials Initiative for 450mm (EEMI450). However, in order to ensure this latest wafer size transition is facilitated in both an effective and efficient way, the need to collaborate and cooperate with other Consortia on a global scale is paramount, as the activities push closer towards production worthy toolsets and IDM pilot line activities. This 450mm conference will focus on European and Worldwide 450mm achievements, and how Consortia, OEMs and IDMs, with the help of Governments and funding agencies, are working together to achieve this challenging wafer size transition for the industry
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AGENDA |
Wednesday, 9 October |
Keynotes | |
| Conference Chairmann: xxx | |
| Welcome - xxx Opening - xxx | |
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Session 1: Worldwide Consortia update
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| Session Chair: xxx | |
| 00:00 | TBD |
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Session 2: European Commission and Public Authority funding opportunities
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| Session Chair: xxx | |
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Thursday, 10 October | |
Session 3: The role of the Research Institutes
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| 00:00 | Welcome Coffee |
| Session Chair: xxx | |
| 00:00 | TBD |
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| 00:00 | Coffee Break |
Session 4: Status of 450mm Equipment and Materials | |
| Session Chair: xxx | |
| 00:00 | TBD |
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| 00:00 | Conference Lunch |
* Become a Sponsor, view Sponsorship Opportunities online
Price* Information and Registration |  | ||
| Until October | After October | Onsite | |
| SEMI Members | 295.- | 345.- | 395.- |
| Non-Members | 345.- | 395.- | 395.- |
| * all Price information in EUR, VAT not included | |||
Organizing Committee: | |
• Mart Graef (Chairman), TU Delft • Michael Arnold, PEER Group
| • Martin Heerschop, Solutions on Silicon BV • Lutz Laps, Infineon
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