Emerging Research Materials - Session 1

Graphene and 2D

 

Date: 8 October, 2013

Time: 10:30 - 12:45

Location: TechARENA 2, Messe Dresden

 

 

 

Media Partner:

 

Graphene and other 2D materials feature a number of unique properties that make them particularly interesting for the microelectronics industry. Graphene is extremely strong and flexible, it is optically transparent, has an excellent thermal conductivity and exhibits a very high carrier mobility (~100k cm2/Vs). Worldwide, an enormous research effort has been allocated on the fabrication and characterization of graphene. However, the integration of graphene into semiconductor devices for the creation of new products and their subsequent industrialization is still a major challenge. Various consortia, spanning the supply chain from basic research at universities and institutes to production at IDMs, have been set up to explore the application possibilities of a combined Si-graphene device technology.

 

AGENDA

Chairman: Mart Graef, Strategic Program Manager, TU Delft
 

 

10:30

Welcome

Mart Graef, Strategic Program Manager, TU Delft

 
10:40Wafer-scale fabrication of graphene
Sten Vollebregt, Delft University of Technology
 
11:05Graphene- Opportunities and challenges
Richard van Rijn, CTO, Applied Nanolayers
 
11:30

The Graphene Flagship – Working together to transform scientific

excellence to societal impacts

Jari Kinaret, Professor, Chalmers University of Technology
 
11:55Graphene in Flexible Electronics
Tapani Ryhänan, Director, Head of Sensor and Material Technologies Laboratory, Nokia
 
12:20Integrated Graphene Devices
 Max Lemme, Professor, KTH Royal Institute of Technology
 
12:45End
 

 

Who should attend?

The session’s focus will be on the end-users implementing the new materials in the fab, but a comprehensive picture of the whole materials value chain will be provided by including selected contributions from other participants in the value chain as well.

Organizing Committee:

• Mart Graef (Chairman), TU Delft

• Michael Arnold, PEER Group
• Livio Baldi, Micron
• Johann Bartha, Technical University Dresden
• Tom Beens, Umicore
• Jacques Berg, Tokyo Electron
• Philippe Campion, STMicroelectronics
• Bernie D. Capraro, Intel
• Johan Dekoster, imec
• Guy Dubois, GDCL
• Ernst Feistle, Applied Materials

 

• Martin Heerschop, Solutions on Silicon BV

• Lutz Laps, Infineon
• Carlso Mazure, Soitec
• Didier Louis, CEA-Leti
• Martin McCallum, Nikon Precision Europe
• Richard Oechsner, Fraunhofer IISB
• Joachim Pelka, Fraunhofer
• Lothar Pfitzner, Fraunhofer IISB
• Ivo Raaijmakers, ASM International
• Peter Schaeffler, Texas Instruments
• Karsten Schneider, Applied Materials