Lithography Session

Lithography: The Fight on the Wavelength is Still Going On

 

Date: 12 October

Time: 10:30 - 14:00

Location: TechARENA 1, Messe Dresden

 

 

 

Perhaps for the first time in the history of Moore’s Law technology scaling seems to be outpacing the lithography evolution. While 20nm NAND memories are announced and sub-20nm are being investigated, no clear winner still exists among competing lithography technologies.
While EUV is just moving the first steps towards introduction, with the first pre-production equipment being delivered and tested, 2nd and 3rd generations of 193nm immersion printing with higher NA, smart illuminators and advanced mask technology still support the bulk of initial production, and e-beam lithography is reappearing on the field with new multi-beam concepts that promise to break the productivity barrier.
The fight is still going on and will probably last for a few years more: in this session you will hear about the present status of these competing technologies, but a choice could be difficult also because there could be no “one size fits all” solution.

 

Session Agenda

Session-chair:Rolf Seltmann, Lithography Fellow, GLOBALFOUNDRIES 
  
10:30 Beyond Immersion - Patterning Enablers for the Next Decade
Keynote: Colin Brodsky, Senior Engineering Manager, Patterning Process Development, IBM 
  
11:00Design and Process Challenges with Double Patterning for 20nm Logic
 Pierre-Jérôme Goirand, Lithography R&D Manager, STMicroelectronics
  
11:20Multi E-Beams (ML2) Opportunities in Advanced Lithography
 Serge Tedesco, Program Manager, CEA-LETI
  
11:40Pushing 193i Lithography by Joint Optimization of Layout and Lithography
 Peter De Bisschop, Principle Scientist, Lithography Department, IMEC
  
12:00Evaluation of Technology Options by Lithography Simulation
 Andreas Erdmann, Head of Lithography Simulation, Fraunhofer IISB 
  
12:20Directed Self-Assembly of Block-Copolymer for CMOS Technology
 Raluca Tiron, MINATEC
  

Exhibitor Presentation

13:00Wafer Chucks for Immersions - and EUV - Lithography
 Sven Götze, Project Manager, Product Engineering Semicon, Berliner Glas KGaA Herbert Kubatz
  
13:15Over-Actuation for a 450mm Wafer Chuck
 Dick Laro, dr.ir. / System Architect, MI-Partners
  
13:30Improving Immersion Lithography Cells OEE: Deploying An Effective Process
 Michael Romanenko, MAX I.E.G
  
13:45 
  

 

Who should attend?

The session will investigate different alternative technologies that are being considered for pushing lithography limits in the tens of nanometer range, waiting for the commercial availability of EUV. Both the end-users’ experience with advanced lithography process and an overview  of new materials and equipment will be provided by representatives of leading industries and research centers.