The SEMICON Europa programs are currently under development. If you would like to participate, please contact europrograms@semi.org to receive information on how to submit a paper. Programs are developed by the SEMI committees.

SEMICON Europa 2010 semiconductor technology related programs will include:

FAB MANAGERS FORUM (FMF)

• The direct engagement of fab managers and their teams in this conference has helped the pan-European communications and made the FMF a respected meeting venue for fab executives and professionals from the semiconductor industry to meet and discuss topics which are essential for the drive towards "Total Productivity".
• Extended use of assets strategies must succeed with manufacturing tooling utilized far beyond initial use cycle. Furthermore, fabs technology capabilities need to be kept "fit for purpose” in synch with new market developments.
  How can successful fab teams most efficiently enhance, retrofit, adopt & re-assign, or re-furbish and best re-use assets?
  Which professional services provide foundations for viable life-cycle management schemes?
• The push for most efficient manufacturing operations remains very strong.
  How can the manufacturing experts line up their control-automation concepts so they will match the future manufacturing lines "total productivity" needs?
  SEMI welcomes papers of exceptional high technical merit that help Fab management teams to share learning and stay on top of key developments in best-of-breed production and technology management techniques.

PREVIOUS EDITION 2009 SPEAKERS INCLUDED

13th Fab Managers Forum

Chairs: Andrea Preuss, X-FAB, FAB Dresden

• SEMI global SESTG, Secondary Equipment, Services & Technology Group” - Eduard Hoeberichts, (SEMI SESTG, Special Interest Group Chair) SIMAX
• “Managing EE in a fluctuating Business Environment” - Bernhard Riester, TI, FAB Freising
• “Technical Strategies for Equipment Repurposing” - Jeffrey Dietz, AMAT
• “200mm FAB / Strategic Equipment Needs” - Thorsten Widmer, BOSCH, FAB Reutlingen
• “How can Equipment Suppliers do more to help FABs thrive in the new Environment?” - Jerry Sowers, Novellus
• “Balance of In-House and Services Skills for the effective FAB development” - Mario von Podewils, X-FAB, FAB Erfurt
• “Competitive 300mm Manufacturing in Europe” - Philippe Campion, ST, Rousset
• “Leveraging FAB Automation for a most efficient 200 mm Mfg Operation” - Thomas Leitermann, Infineon, FAB Dresden
• Panel Session “Key factors in successfully managing your FAB”. Chairs: • Michael Hummel, TI, Freising. Panelists: • Philippe Campion, ST, Rousset • Thomas Leitermann, Infineon, Dresden, Mario von Podewils, X-FAB, Erfurt • Thorsten Widmer, BOSCH, Reutlingen

PREVIOUS EDITION 2009 SPEAKERS INCLUDED

Fab Agility and Productivity Session

Session Chairs: Guy Dubois, STM Crolles and Riccardo Martorelli, Micron Avezzano

• “Transforming a Leading Edge Microprocessor Wafer Fabricator into a World Class Silicon Foundry” - Thomas de Paly, Director Product Engineering, GLOBALFOUNDRIES
• “Managing High Mix for Success” - Guenther Ernst, Vice President - Operation, Lfoundry
• “Managing Efficiency and Productivity in a dynamic FAB Environment” - Peter Schaeffler, Manufacturing Manager, Texas Instruments, Fab Freising
• “Solutions for Agile Semiconductor Manufacturing” - Sanjiv Mittal, Managing Director, Global Services, Applied Materials

PREVIOUS EDITION 2009 SPEAKERS INCLUDED

Energy Efficiency Improvement Session

Session Chairs: Richard Oechsner, Deputy Head of Department, Fraunhofer IISB and Alfred Koenig, Technology Director, Applied Materials

• “Energy and Resources Reduction in a Semiconductor FAB” - Werner Freimann, Head of Facilities Management, GLOBALFOUNDRIES
• “Energy Reduction within a Mature Waferfab” - Joerg Recklies, Infineon Technologies
• “The Application Practice of Energy Performance Rating Method for Fab Energy Efficient Design” - Kuei-Peng Lee, Assistant Professor, National Taipei University of Technology, Taiwan
• “Cost Savings and Energy Efficiency Improvements by using best Eco-Efficiency -Engineering Practices in Semiconductor FABs” - Andreas Neuber, Managing Director, Environmental Services, Fab Operation Services Test, Applied Materials
• “A New Power Quality and Energy Monitoring Technology for Semiconductor Tools and FABs” - Andreas Eberhard, Vice President, Technical Services, Power Standards Lab

PREVIOUS EDITION 2009 SPEAKERS INCLUDED

Pushing Lithography to the Limits

Session Chairs: Michel Brillouët, Deputy Director, CEA Leti; Peter Kücher, Director CNT, Fraunhofer CNT

• KEYNOTE: “Technology Choices, Challenges and Timing Requirements for Nanolithography at the 32nm Node and Beyond” - Christof Krautschik, Strategic Technology Manager, Lithography & Microsystems, Intel Corporation
• “How to Effectively Leverage Mask Technologies for Lithography Extensions” - Jan Hendrik Peters, Senior Manager R&D, AMTC
• “Status of the FP7 Project MAGIC: Pushing European Multi E-Beam Research for the Semiconductor Industry” - Philipp Jaschinsky, Scientist E-Beam Direct Write, Fraunhofer CNT
• “Alternative double patterning processes : ready for (sub) 32nm hp?” - Patrick Wong, Project Leader - double patterning alternative process schemes sub program, IMEC
• “MD3 Material Developmentfor Double Pattering and Double Exposure” - Stéphanie Gaugiran, CEA Leti – Minatec

PREVIOUS EDITION 2009 SPEAKERS INCLUDED

New Materials Providing for New Technologies

Session Chair: Michel Brillouët, Deputy Director Leti, CEA Leti

• KEYNOTE: “Towards Green Electronics in Europe – Strategic Research Agenda Organic and Large Area Electronics” - Dr. Thomas Geelhaar, Chief Technology Officer, Chemicals, Merck
• “Printed Electronics Technology Development” - Luigi G. Occhipinti, Program Director IMS R&D -Printed Electronics, STMicroelectronics
• “Promising Thin Films Materials for Photovoltaics” - Emmanuelle Rouviére, Lab Manager, CEA/LITEN/DTNM/LCRE
• “Advanced Transistor Technologies for High Performance CMOS Applications” - Manfred Horstmann, Senior Manager Technology and Integration, GLOBALFOUNDRIES
• “New Materials: Opportunities for Innovation in Memories and Data Storage” - Giorgio de Santi, Vice President R&D R2, Operations & Manufacturing Technology Development, R&D Technology Development, Numonyx450mm in Europe – Quo Vadis?