Test & Packaging Exhibitor Presentations

Tuesday, 6 October, 11:30 – 12:45
Messe Dresden, Dresden, Germany
Technology Arena, Hall 1

Company Presentations

11:30 – 11:45	Thin Wafer Handling and Processing - Results Achieved and Upcoming Tasks in the Field of 3D and TSV
	Markus Wimplinger, EV Group
11:45 – 12:00	Chip to Wafer Bonding solutions for 3D-IC with high density TSV
	Guénael Ribette, SET Smart Equipment Technology
12:00 – 12:15	Ensuring Wafer Traceability in LED Mass Production Marco Padrun, Evatec LTD
12:15 – 12:30	High Quality Ultrasonic Bonding Technology Rolf Beckert, Hesse & Knipps GmbH
12:30-12:45	cmNavigo - Unleash the Power of Manufacturing Rui Melo Biscaia, Critical Manufacturing

Price	Valid through 19 September	Beginning 20 September
SEMI Members	free	free
Non-Members	free	free