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Test & Packaging Exhibitor Presentations
Tuesday, 6 October, 11:30 – 12:45
Messe Dresden, Dresden, Germany
Technology Arena, Hall 1
Company Presentations
11:30 – 11:45
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Thin Wafer Handling and Processing - Results Achieved and Upcoming Tasks in the Field of 3D and TSV
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Markus Wimplinger, EV Group
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11:45 – 12:00
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Chip to Wafer Bonding solutions for 3D-IC with high density TSV
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Guénael Ribette, SET Smart Equipment Technology
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12:00 – 12:15
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Ensuring Wafer Traceability in LED Mass Production
Marco Padrun, Evatec LTD
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12:15 – 12:30
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High Quality Ultrasonic Bonding Technology
Rolf Beckert, Hesse & Knipps GmbH
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12:30-12:45
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cmNavigo - Unleash the Power of Manufacturing
Rui Melo Biscaia, Critical Manufacturing
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Price
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Valid through 19 September
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Beginning 20 September
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SEMI Members
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free
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free
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Non-Members
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free
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free
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