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International MEMS/MST Industry Forum
October 6, 2008 / 09:30 – 18:30
Moevenpick Hotel Airport, Stuttgart, Germany
Europe leads the world in innovation in MEMS/MST design and manufacturing. With MEMS/MST growth—particularly in automotive applications, of which Europe generate more than 40 percent of the market—come new challenges and opportunities in design, materials, and manufacturing.
SEMICON Europa features a strong focus on MEMS/MST, with exhibits from leading technology companies and the International MEMS/MST Industry Forum providing insight to the latest advances in MEMS/MST.
Preliminary Agenda – subject to change
“Challenges and Opportunities in MEMS Manufacturing”
09.30-09.35
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Opening Remarks Heinz Kundert, President, SEMI Europe
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09.35-09.40
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Welcome by Conference Committee Chairman
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Felix Rudolf, CTO, Colibrys
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Session I: MEMS Manufacturing Industry
09.40-10:10
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Keynote: (TBC)
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10.10-10:.40
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MEMS on 200 mm
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Andreas Wild, Freescale
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10.40-11.00
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Topic to be confirmed
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Appo van der Wiel, Melexis
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11.00-11.20
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Coffee break
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11:20-11:40
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QPatch – A commercial BIOMEMS application
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Simon Pedersen, Sophion Bioscience
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11:40-12:00
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MEMS accelerometers for Seismic applications
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Felix Rudolf, CTO, Colibrys
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12.00-12.20
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Standardized and robust MEMS foundry processes revolutionize commercialization of MEMS
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Tomas Bauer, Silex Microsystems
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12.20-13.20
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Lunch break
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Session II: MEMS Wafers Processes
13.20-13.40
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Bonding with Al metallurgies for 20mm MEMS devices
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Shari Farrens, Suss MicroTec
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13.40-14.00
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MEMS Process & materials developments
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Thomas Hoeftmann, Plan Optik AG
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14.00-14.20
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CMP - An enabling technology for MEMS fabrication
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Gerd Zwicker, Fraunhofer Institute for Silicon Technology ISIT
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14.20-14.40
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Aspects of PVD metal film stress control for MEMS device metallization
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Paul Wembaneth, Tegal Corporation
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14.40-15.00
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The challenge of dicing MEMS devices
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Dr. Peter Lange, Gerd Zwicker, Fraunhofer Institute for Silicon Technology ISIT
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15.00-15.20
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New developments in high throughput scanning acoustic microscopy for automated inspection of bonded wafers
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Dr. Peter Czurratis, SAM TEC
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15.20-15.40
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Coffee break
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Session III: MEMS, Packaging and Testing
15.40-16.00
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New strategies for functional final test of multiple MEMS sensor types within one package
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Andreas Nagy, Multitest Elektronische Système GmbH
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16:00-16.20
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TLS - Wafer-Dicing - Don't saw away Your Profit!
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Hans-Ulrich Zuehlke, Jenoptik Automatisierungstechnik
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16.20-16.40
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Digital Holography Microscopy (DHM) for static and dynamical 3D characterization MEMS and Moems
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Yves Emery, Lyncée Tec
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16.40-17.00
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Hermetic Packaging Technique featuring through wafer interconnects and low temperature direct bond
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James Lee, Harwell International Business Centre
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17.00-17.20
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Proven High Capacity Parallel MEMS/Sensor Test Cell Solutions
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Frank Grossmann from SPEA
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Session IV: The MEMS market
17.20-17.30
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“MEMS market and industry 2007 – 2012”
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Jérémie Bouchaud, iSupply
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17.30-17.40
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“MEMS Market Overview”
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Eric Mounier, Yole Developpement
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17.40-18.25
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Q&A
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18:25-18.30
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Closing Remarks
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18.30-19.30
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Reception in the Hotel Moevenpick Airport
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For more information on the call for papers submission requirements please contact europrograms@semi.org or call SEMI Europe at +32.2.289.64.99
Find out more about what SEMI is doing for MEMS/MST members at www.semigrows.org and www.semi.org/mems.
SEMICON Europa media partners include:
Find out more about how SEMI can help you at www.semigrows.org www.semi.org/mems
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