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International MEMS/MST Industry Forum
Date: 18-19 October, Messe Dresden
Room: t.b.d.
MEMS Goes Everywhere!
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Micro systems technologies play a very major role in today's and future electronics market development. The 'consumerization' of electronics products makes pressure on components cost relentless; the 'cost of solution' must be rigorously driven down to match market requirements of low-cost / high-tech commodity electronics.
How to successfully manage in an environment with distributed operations, while best system know-how and ever shorter time-to-revenue cycles are essential? Which control systems and methodologies for low cost testing, steep learn curves and quality assurance need to be in place? How to develop, manufacture and cost/efficiently integrate complex heterogeneous systems? What are the most recent developments in MEMS enabled products: where lay the challenges and opportunities? What are most interesting new applications and use-cases, driving new technologies and providing for technology line utilization?
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Monday 18 October 2010
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13:00
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Welcome
Gerhard Lammel, Bosch Sensortec
Co-chair of the SEMI MEMS/MST Industry Forum Committee
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SESSION 1: MEMS Applications
Session-chairs: Jérémie Bouchaud, iSuppli and Christian Schaefer, PVA Tepla
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13:15
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KEYNOTE: “Trends for Automotive Micromechanical Sensors”
Jiri Marek, Senior Vice President Engineering Sensors, Bosch
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13:45
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KEYNOTE: “Revolution and Evolution of Consumer MEMS Applications”
Leopold Beer, Director Marketing, Bosch Sensortec
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14:15
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KEYNOTE: “Title to be confirmed”
Benedetto Vigna, General Manager MEMS Business Unit, STMicroelectronics
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14:40
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“How to Make and Use MEMS for all Applications”
Christian Block, Executive VP & CTO SAW, EPCOS
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15:05
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“Micro- and Nanotechnologies in Mobile Digital Solutions”
Tapani Ryhänen, Laboratory Director, Nokia
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15:30
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Coffee Break
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16:15
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“Leveraging Microfluidics from inkjet printheads ICs into portable DNA testing”
Anton Hofmeister, General Manager Microfluidic Division, STMicroelectronics
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16:40
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MEMS Accelerometers Replace High-End Electro-Mechanical Devices
Jean-Michel Stauffer, VP Sales and Marketing, Colibrys
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17:05
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“Smart Sensor Hub”
Stéphane Gervais-Ducouret, Global Marketing Director, Freescale
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17:30
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End day 1
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Tuesday 19 October 2010
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08:30
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Welcome
Felix Rudolph, Colibrys
Co-chair of the SEMI MEMS/MST Industry Forum Committee
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SESSION 2: Manufacturing Strategies and Challenges
Session-chair: Gerhard Lammel, Bosch Sensortec
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08:45
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KEYNOTE: “Monolithic to Multi Chip: Smart Partitioning Adds Customer Value”
Rob OReilly, Senior Technical Staff, MEMS Sensor and Technology Group, Analog Devices
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09:15
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“Business and Technical Challenges for High-Volume MEMS Foundries”
Iain Rutherford, Product Line Manager MEMS, X-Fab
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09:40
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“Test in Carrier for Cost Effective Final Test of MEMS”
Andreas Nagy, Business Unit Manager Engineering Driven Business, Multitest
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10:05
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Coffee Break
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SESSION 3: MEMS Technologies Process
Session-chair: Uwe Schwarz, X-Fab
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10:45
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Introduction of a Vertical Pressure Sensing Cell Array
Thoralf Kautzsch, Staff Engineer Process Integration and Device Development, Infineon
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11:10
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Process Separation for Enhanced Throughput and Reduced Cost Wafer to Wafer Bonding
Eric Pabo, Business Development Manager for MEMS, EV Group
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11:35
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“Integration of MEMS Sensors with Complex CMOS Circuitry on 200mm Si Wafers”
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Norbert Arnold, Manager MST group, Fraunhofer IMS Institute for Microelectronic Circuits and Systems
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SESSION 4: MEMS Market Review
Session-chair: Felix Rudolph, Colibrys
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11:50
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“Emerging MEMS Applications Driving Growth for the Next 5 Years”
Jean-Christophe Eloy, President and CEO, Yole Développement
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12:15
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“MEMS Back to Double Digit Growth”
Jérémie Bouchaud, Director & Principal Analyst, MEMS & Sensors, iSuppli
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12:40
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End day 2
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Price Information
(19% VAT not included)
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Until
October 1
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After
October 1
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Onsite
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SEMI Members
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€ 225
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€ 275
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€ 325
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Non-Members
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€ 275
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€ 325
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€ 325
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Sponsorship – Industry Sponsors Wanted!
SEMICON Europa offers corporate sponsorship packages for the International MEMS/MST Industry Forum. If your company is interested, please review the Sponsorship Package or contact Beat Mueller, Director Member Relations at bmueller@semi.org Tel: +41 794656588.
SEMI Europe MEMS Committee members
P. Willemse, ASML
G. Lammel, Bosch
F. Rudolf, Colibrys
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E. Jung, FhG IMZ
J. Bouchaud, iSuppli
M. Montonen, Okmetic
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C. Schaefer, PVA Tepla
M. Gabriel, Suss MicroTec
U. Behringer, UBC Microelectronics
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U. Schwarz, X-Fab
J-C. Eloy, Yole Développement
P. Lindner, EVG
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