International MEMS/MST Industry Forum Date: 18-19 October, Messe Dresden Room: t.b.d. MEMS Goes Everywhere!

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Micro systems technologies play a very major role in today's and future electronics market development. The 'consumerization' of electronics products makes pressure on components cost relentless; the 'cost of solution' must be rigorously driven down to match market requirements of low-cost / high-tech commodity electronics.

How to successfully manage in an environment with distributed operations, while best system know-how and ever shorter time-to-revenue cycles are essential? Which control systems and methodologies for low cost testing, steep learn curves and quality assurance need to be in place? How to develop, manufacture and cost/efficiently integrate complex heterogeneous systems? What are the most recent developments in MEMS enabled products: where lay the challenges and opportunities? What are most interesting new applications and use-cases, driving new technologies and providing for technology line utilization?

Monday 18 October 2010
13:00	Welcome Gerhard Lammel, Bosch Sensortec Co-chair of the SEMI MEMS/MST Industry Forum Committee
SESSION 1: MEMS Applications Session-chairs: Jérémie Bouchaud, iSuppli and Christian Schaefer, PVA Tepla
13:15	KEYNOTE: “Trends for Automotive Micromechanical Sensors” Jiri Marek, Senior Vice President Engineering Sensors, Bosch
13:45	KEYNOTE: “Revolution and Evolution of Consumer MEMS Applications” Leopold Beer, Director Marketing, Bosch Sensortec
14:15	KEYNOTE: “Title to be confirmed” Benedetto Vigna, General Manager MEMS Business Unit, STMicroelectronics
14:40	“How to Make and Use MEMS for all Applications” Christian Block, Executive VP & CTO SAW, EPCOS
15:05	“Micro- and Nanotechnologies in Mobile Digital Solutions” Tapani Ryhänen, Laboratory Director, Nokia
15:30	Coffee Break
16:15	“Leveraging Microfluidics from inkjet printheads ICs into portable DNA testing” Anton Hofmeister, General Manager Microfluidic Division, STMicroelectronics
16:40	MEMS Accelerometers Replace High-End Electro-Mechanical Devices Jean-Michel Stauffer, VP Sales and Marketing, Colibrys
17:05	“Smart Sensor Hub” Stéphane Gervais-Ducouret, Global Marketing Director, Freescale
17:30	End day 1
Tuesday 19 October 2010
08:30	Welcome Felix Rudolph, Colibrys Co-chair of the SEMI MEMS/MST Industry Forum Committee
SESSION 2: Manufacturing Strategies and Challenges Session-chair: Gerhard Lammel, Bosch Sensortec
08:45	KEYNOTE: “Monolithic to Multi Chip: Smart Partitioning Adds Customer Value” Rob OReilly, Senior Technical Staff, MEMS Sensor and Technology Group, Analog Devices
09:15	“Business and Technical Challenges for High-Volume MEMS Foundries” Iain Rutherford, Product Line Manager MEMS, X-Fab
09:40	“Test in Carrier for Cost Effective Final Test of MEMS” Andreas Nagy, Business Unit Manager Engineering Driven Business, Multitest
10:05	Coffee Break
SESSION 3: MEMS Technologies Process Session-chair: Uwe Schwarz, X-Fab
10:45	Introduction of a Vertical Pressure Sensing Cell Array Thoralf Kautzsch, Staff Engineer Process Integration and Device Development, Infineon
11:10	Process Separation for Enhanced Throughput and Reduced Cost Wafer to Wafer Bonding Eric Pabo, Business Development Manager for MEMS, EV Group
11:35	“Integration of MEMS Sensors with Complex CMOS Circuitry on 200mm Si Wafers”
	Norbert Arnold, Manager MST group, Fraunhofer IMS Institute for Microelectronic Circuits and Systems
SESSION 4: MEMS Market Review Session-chair: Felix Rudolph, Colibrys
11:50	“Emerging MEMS Applications Driving Growth for the Next 5 Years” Jean-Christophe Eloy, President and CEO, Yole Développement
12:15	“MEMS Back to Double Digit Growth” Jérémie Bouchaud, Director & Principal Analyst, MEMS & Sensors, iSuppli
12:40	End day 2

Price Information (in EUR, without 19% VAT)	Until October 1	After October 1	Onsite
SEMI Members	€ 225	€ 275	€ 325
Non-Members	€ 275	€ 325	€ 325

Sponsorship – Industry Sponsors Wanted!
SEMICON Europa offers corporate sponsorship packages for the International MEMS/MST Industry Forum. If your company is interested, please review the Sponsorship Package or contact Beat Mueller, Director Member Relations at bmueller@semi.org Tel: +41 794656588.

SEMI Europe MEMS Committee members

P. Willemse, ASML G. Lammel, Bosch F. Rudolf, Colibrys

E. Jung, FhG IMZ J. Bouchaud, iSuppli M. Montonen, Okmetic

C. Schaefer, PVA Tepla M. Gabriel, Suss MicroTec U. Behringer, UBC Microelectronics

U. Schwarz, X-Fab J-C. Eloy, Yole Développement P. Lindner, EVG