International MEMS/MST Industry Forum

Taking MEMS to the next level

Date: 7-8 October, 2013
Time: 13:00 - 18:00 / 09:00 - 12:30

Location: Garden Hall, Messe Dresden

 

Micro-electromechanical systems — MEMS — continue to be a bright spot among semiconductors. The MEMS market is not immune to the current economic slowdown, but resists macroeconomic effects better than the rest of the semiconductor industry. MEMS revenue grew 6% in 2012, an enviable rate compared to the -2.3% decline in 2012 for the total semiconductor component industry according to IHS. Looking forward, the MEMS market will rapidly resume its double digit growth – expanding more than twice as fast as the rest of the former. How can MEMS sensors sustain their exceptional development? When will this industry exceed the $10 billion mark? How can MEMS help fulfill trillion sensor market prophesy, as is currently envisioned by MEMS evangelists? The International MEMS/MST Industry Forum will examine how to take MEMS sensors to the next level.  
 
The MEMS forum is an exceptional platform for exhibitors and visitors to explore the MEMS industry supply chain. For a unique look at manufacturing challenges and new technologies in MEMS, don’t miss this event.

 

Media Partner:

 

 

 

AGENDA

 Monday, 7 October

 
13:00Opening Remarks:
 Heinz Kundert, President, SEMI Europe
 Gerhard Lammel, Senior Manager MEMS, Bosch Sensortec 

Session 1:

MEMS Innovative Applications 1

Chairman: Gerhard Lammel, Senior Manager MEMS, Bosch Sensortec
  
13:15KEYNOTE:
 MEMS and Sensors for a New World
 Benedetto Vigna, Executive Vice President, STMicroelectronics
 
13:45KEYNOTE:
 The Infineon Silicon MEMS Microphone
 Ulrich Krumbein, Senior Principle Device Physics Discretes, Infineon Technologies
 
14:15Evolution of Wafer-Level Optics to a Packaging Technology for Miniature Sensor Modules
Markus Rossi, Chief Innovation Officer, Heptagon Advanced MicroOptics
 

14:35

 

Optical CO2 module with chip-on-board MEMS components and injection-

molded plastic optics

Mikko Aronniemi, Research Scientist, Vaisala Oyj
 
14:55Micro Optical Bench on a Chip
Bassam Saadany, Division Manager, Si-Ware Systems
 
15:15Coffee Break
  

Session 1:

MEMS Innovative Applications 2

Chairman: Jérémie Bouchaud, Senior Principal Analyst, IHS
  
15:45KEYNOTE:
MEMS Innovative Applications: The Future of MEMS Sensors - System  on Chip
 

Peter Cornelius, Director of Product Marketing, InvenSense

 
16:15MEMS sensor packaging for automotive harsh media applications
 Torsten Eggers, Engineer, Hella Fahrzeugkomponenten GmbH
 

Session 2:

Business Models: Foundry, Fabless, IDM

Chairman: Anna-Riikka Vuorikari-Antikainen, Senior VP, Products, Okmetic
  
16:35KEYNOTE:

The inflection point: Macro forces & emerging trends that will reshape

the semiconductor industry through 2016

 Barnett Silver, Senior Vice President, ATREG
  
16:55Developing integrated MEMS sensor products for medical and industrial markets
 Tapani Koivukangas, Specialist Medical devices, Lewel Group
  
17:15The Tronics Microsystems Business model; full service MEMS manufacturing
Stephan Louwers, Business Unit Manager Contract Manufacturing, Tronics
 
17:35Integrating MEMS for High-Volume Foundry Solutions
Iain Rutherford, Business Line Manager – MEMS, X-FAB
 
17:55Networking Reception
 

 Tuesday, 8 October

  

Session 3:

Manufacturing technology and quality

Chairman: Uwe Schwarz, MEMS Process Development, X-FAB
  
09:00KEYNOTE:
 

Advances in profile uniformity, CD uniformity and TILT control for high 

aspect ratio DRIE processes

Dave Thomas, Marketing Director, Etch Products, SPTS
 
09:303D TSV wafers with thick via insulation for ambitious MEMS applications
 Thomas Hoeftmann, RnD Manager, Plan Optik
  

09:50

 

Deposition and Etch Technologies for High Volume Manufacturing of

Magnetic  Sensors

Frank Cerio, Director of Process Technology, Veeco
 
10:10High frequency MEMS vibration testing
Philippe Garrè, Product Engineer, Freescale
 
10:30Coffee Break
 
11:00New concepts for processing MEMS resonators
 Andre Röth, PhD student, Infineon Technologies
 
11:20Wafer Bonding Technology for Vacuum Encapsulation of MEMS Devices
Eric Pabo, Business Development Manager, EV Group
 

Session 4:

MEMS Market

Chairman: Martina Vogel, Fraunhofer ENAS
 
11:50Consumer MEMS Outlook Strong Thanks to New Usage
 Jérémie Bouchaud, Director and Senior Principal Analyst MEMS & Sensors, IHS
  
12:10MEMS for bio-medical applications. Market overview and challenges
 Frederic Breussin, Business Unit Manager, Yole Développement
  
12:30Closing remark
 
 

Who should attend?

European FAB management, related executives, and professionals from the semiconductor industry.

 

 

Price* Information and Registration

 
 Before 30. SeptemberAfter 01. OctoberOnsite
SEMI Members315.-365.-415.-
Non-Members365.-415.-415.-
* all Price information in EUR, VAT not included

 

Organizing Committee:

• Karl-Friedrich Becker, Fraunhofer IMZ
• Jérémie Bouchaud (co-chair), iSuppli
• Frederic Breussin , Yole Développement
• Thomas Gessner, Fraunhofer ENAS
• Gerhard Lammel (co-chair), Bosch
• Paul Lindner, EVG

• Marc Osajda, Freescale

• Christian Schaefer, PVA Tepla
• Ulrike Schoembs, Suss MicroTec
• Uwe Schwarz, X-Fab
• Ignas van Dommelen, Sencio
• Martina Vogel, Fraunhofer ENAS
• Anna-Riikka Vuorikari-Antikainen, Okmetic