International MEMS/MST Forum

MEMS – Entering a New Growth Cycle!

Date: 10-11 October
Time: 13:00-18:00 / 08:30-13:30

Location: Room Hamburg 2, Messe Dresden

The MEMS market is back on track following an impressive double-digit annual
growth in 2010. This is the beginning of a new cycle for the MEMS and sensors
market that will extend all the way through 2014. The reasons for this new growth cycle are:a) MEMS markets for consumer electronics and mobile phones will grow at an accelerated rate over the next 4 years. In particular revenue for handsets and slate tablets.b) The soaring demand for MEMS sensors from BRIC countries in all sectors from cars to infrastructure e.g. for smart meters and optical telecom is driving demand.c) Sales of DLP chips were again up in 2010.d) Increasing use of sensors in addressing critical areas like energy and aging populations.

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Monday, 10 October 2011

13:00	Welcome
	Gerhard Lammel, Senior Manager MEMS, Bosch Sensortec

SESSION 1: MEMS Applications
Session-chair:	Gerhard Lammel, Senior Manager MEMS, Bosch Sensortec

13:15	Keynote: MotionProcessors™ Driving Hi-Impact Motion-Based Applications in the Digital World
	Steve Nasiri, CEO, InvenSense

13:45	MEMS Display
	Evgeni Gusev, Senior Director, Technology R&D, Qualcomm

14:15	Leveraging MEMS Applications in CE Devices for Interactive, Next-Gen Content Discovery and Navigation
	Charles W.K. Gritton, Chief Technology Officer, Hillcrest Labs

14:40	MEMS Growth Challenged by Breadth and Depth
	Stephane Gervais-Ducouret, Director, Freescale

15:05	Coffee Break (Hall 2)

SESSION 2: Manufacturing Strategies and Challenges
Session-chair:	Jérémie Bouchaud, Director, iSuppli

15:30	3D MEMS Platform For High Performance Gyros
	Anssi Blomqvist, Senior Manager of Product Development, VTI Technologies

16:10	MEMS Standardization: Fact or Folly?
	Brian Stephenson, President & COO, Tronics MEMS

16:35	Tweaking MEMS Foundry Business Models
	Peter Merz, CEO, MFI

17:00	New Strategies for Functional Final Test of Multiple MEMS Sensor Types Within One Package
	Andy Nagy, Business Unit Manager, Multitest

17:25	A New Option to Reduce Time to Market of Advanced MEMS Product
	Donald Robert, VP Sales and Marketing, DALSA

17:50	Closing Remarks

18:00	Networking Reception (Hall 2)
Tuesday, 11 October 2011
08:00	Welcome Coffee (Hall 2)

08:30	Welcome
	Gerhard Lammel, Senior Manager MEMS, Bosch Sensortec
SESSION 3: MEMS Technologies Process
Session-chair:	Paul Lindner, Executive Technology Director, EV Group

08:45	Uncooled Microbolometer with Monocrystalline Thermistor and Wafer Level Packaging
	Audun Roer, Senior Program Manager, Sensonor Technologies

09:15	MEMS Activities in Tohoku University
	Masayoshi Esashi, Professor,Tohoku University

09:40	Submicron MEMS - Enabling the Next Generation of MEMS Devices
	Mike Rosa, Global Product Manager, Applied Materials

10:05	An Experimental Approach to the Lifetime Assessment of MEMS with Integrated Getter Film Solution
	Fabrizio Siviero, Senior Researcher- Head of Vacuum Technology lab., R&D - Saes Getters

10:30	Coffee Break (Hall 2)

11:00	Metal Based Wafer Bonding – A Potential Cost Reducer?
	Eric Pabo, Business Development Manager, EV Group

11:25	Adhesive Wafer Bonding Applied for Fabrication of True-Chip-Size Packages for SAW Devices
	Thorsten Heuser, Development Engineer, Epcos

11:50	New Selective Plasma Treatment Solution for Streamlining MEMS Manufacturing Processes
	Markus Gabriel, Product Specialist, Suss MicroTec Lithography

SESSION 4: MEMS Market Review
Session-chair:	Christian Schaefer, Division Manager, VP, PVA Tepla

12:10	A Global Analysis of the Current MEMS Market
	Jérémie Bouchaud, Director, iSuppli

12:35	Business Model Evolution in the MEMS Industry
	Eric Mounier, Project Manager & Micronews Chief Editor, Yole Développement

13:00	Closing Remarks
	Gerhard Lammel, Senior Manager MEMS, Bosch Sensortec

13:30	Networking lunch (Hall 2)

Who should attend?

European FAB management, related executives, and professionals from the semiconductor industry.

Price* Information and Registration
	Before 30 September	After 1 October	Onsite
SEMI Members	275.-	325.-	375.-
Non-Members	325.-	375.-	375.-
* all Price information in EUR, VAT not included

SEMICON Europa MEMS Committee Members

G. Lammel, Bosch	M.Gabriel, suss
F. Rudolf, Colibrys	U. Schwarz, xfab
E. Jung, IZM Fraunhofer	E. Mounier, Yole
J. Bouchaud, isuppli	P. Lindner, evgroup
M. Montonen, Okmetic	T.Gessner, ENAS Fraunhofer
C. Schaefer, PVA Tepla	M. Vogel, ENAS Fraunhofer

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