Programs Overview

Click to enlarge programs overview

Monday 18 October 2010

• 14^th Fab Managers Forum
• International MEMS/MST Industry Forum
• Electro-mobility – An Opportunity for the Semiconductor Industry (organized by GFWW, Silicon Saxony, OptoNet)

Tuesday 19 October 2010

• 14^th Fab Managers Forum
• International MEMS/MST Industry Forum
• Advanced Packaging Conference
• 4^th Executive Summit and Award Presentation
• TechARENA - R&D exhibitor presentations (free)
• TechARENA - New Materials Session and exhibitor presentations (free)
• TechARENA - MEMS exhibitor presentations (free)
• TechARENA - Automation and Process Control Session and exhibitor presentations (free)

Wednesday 20 October 2010

• 2^nd Cluster Breakfast (organized by Silicon Saxony)
• Advanced Packaging Conference
• 12^th European Manufacturing Test Conference (EMTC)
• 450mm Progress Review
• TechARENA - Packaging exhibitor presentations (free)
• TechARENA - Test exhibitor presentations (free)
• TechARENA - Lithography Session and exhibitor presentations (free)
• TechARENA - Metrology Session and exhibitor presentations (free)

Thursday 21 October 2010

• TechARENA - New Materials Session and exhibitor presentations (free)
• 12^th European Manufacturing Test Conference (EMTC)
• CAST (Collaborative Alliance for Semiconductor Test) Docking & Mounting Workshop
• Market Briefing
• Secondary Equipment, Services and Technology Session and exhibitor presentations
• SEMI Members & Exhibitors Breakfast

Plastic Electronics Conference (18-22 October)

• Plastic Electronics Conference and Exhibition

CEI courses - Continuation Education Institute (18-22 October)

• CMOS/BICMOS Process Integration and Engineering
• Silicon Device Technology: Materials and Processing Overview
• Advanced Lithography Technologies – Fundamentals and Applications
• Micro Fabrication Technology. For MEMS and NEMS
• Plasma-Assisted Etching and Reactive Ion Etching. Using High And Low Density Plasmas
• Plasma Etching for CMOS Technology and ULSI Applications
• Chip Interconnection Technology And Process Integration
• Copper Low-k Interconnect Technology. Processing and Reliability of Cu Low-k Interconnect Metallization
• Megafunction Electronics and Photonics Based on 3D Integration. Applications for 3D Si-Based ICs, Flexible Polymer Electronics, Thin Film Solar Cells, and OLEDS
• Advanced Photovoltaics and Electronics. Device Reliability and Lifetime Performance Applications for Thin Film Electronics and Photovoltaics
• Yield and Reliability in VLSI Development and Manufacturing
• IC Debug and Fault Isolation

Standards Meeting (18-21 October)

• Compound Materials related meetings (free)
• Silicon Wafer related meetings (free)
• Gases and Liquid Chemicals related meetings (free)
• Equipment Automation related meetings (free)
• Environment, Health and Safety related meetings (free)