Semiconductor Technology Programs Committee (STC) Michael Arnold, PEER Group Johann Bartha, TU Dresden Tom Beens, Umicore - Jacques Berg, Tokyo Electron
- Livio Baldi, Micron
Guy Dubois - Ernst Feistle, Applied Materials
Mart Graef, TU Delft (chairman) Martin Heerschop, GE Capital Didier Louis, CEA-Leti Martin McCallum, Nikon Richard Oechsner, Fraunhofer IISB Lothar Pfitzner, Fraunhofer IISB Ivo Raaijmakers, ASM International Peter Schaeffler, Texas Instruments Karsten Schneider, Applied Materials - Lutz Labs, Infineon
- Fabrice Letertre, Soitec
- Joachim Pelka, Fraunhofer
- Matty Caymax, IMEC
- Philippe Campion, STMicroelectronics
| International MEMS/MST Industry Forum Committee
Jérémie Bouchaud, iSuppli - Markus Gabriel, Suss MicroTec
Erik Jung, Fraunhofer IMZ Gerhard Lammel, Bosch (chairman) Paul Lindner, EVG Christian Schaefer, PVA Tepla Uwe Schwarz, X-Fab - Thomas Gessner, Fraunhofer
- Laurent Robin, Yole Developpement
- Martina Vogel, Fraunhofer ENAS
- Anna-Riikka Vuorikari-Antikainen, Okmetic
- Stephane Gervais-Ducouret, Freescale
- Ignas van Dommelen, Sencio
SEMICON Europa conference
Networking
|
Advanced Packaging Conference Committee Rolf Aschenbrenner, Fraunhofer IZM Eef Bagerman, NXP Eric Beyne, IMEC -
Andreas Fischer, Bosch Andy Longford, PandA Europe (chairman) Jens Mueller, IMAPS Europe Chapter Graham Jones, Henkel Steffen Kroehnert, Nanium Thomas Oppert, PAC TECH Klaus Pressel, Infineon- Klaus Schrimper, Hesse-Knipps
- Christophe Zinck, Yole
- Michel Garnier, STMicroelectronics
- Albert Koller, Oerlikon
| European Manufacturing Test Conference (EMTC) Committee - Davide Appello, STMicroelectronics
Stefan Eichenberger, NXP Stefan Gasteiger, Advantest Klaus-Detlef Paesch, GlobalFoundries Chris Portelli-Hale, STMicroelectronics (co-chair) - Matthias Stahl, Verigy
Martin Stadler, Teradyne (co-chair) René Segers, ReSeCo- Conceicao Caldeira, Nanium
- Peter Cockburn, Itxc
- Piergiorgio Galletta, Micron
- Paul Vanulsen, Salland
SEMICON Europa Executive Summit
|