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SEMICON Europa – Committee Members

@SEMIEurope

SEMI Europe Technical Programs Committees 

Experts and influential leaders from the industry guide and support SEMI Europe through the committees. For the SEMICON Europa programs, in particular the following committees:

 

Semiconductor Technology Programs Committee (STC)


Michael Arnold,
PEER Group

 

Pascal Louis,
X-Fab

Prof. J.W. Bartha


Johann Bartha,
TU Dresden


Laurent Pain,
CEA-Leti


Pietro Canto,
STMicroelectronics


Thomas Passler,
Applied Material


Bernie Capraro,
Intel Ireland Ltd


Joachim Pelka,
Fraunhofer


Johan Dekoster,
imec


Markus Pfeffer,
Fraunhofer IISB


Guy Dubois,
GDCL Management

Oliver_Pyper_Infineon

Oliver Pyper,
Infineon


 

Mart Graef,
TU Delft (co-chair)

Ionut_Radu

Ionut Radu,
Soitec (co-chair)


 

Winfried Kaiser,
Zeiss


Stephan Raithel,
DAS


 

Wilfried Lerch,
Centrotherm

Sprey

Fred Roozeboom,
Eindhoven University of Technology


Didier Louis,
CEA-Leti


Hessel Sprey,
ASM Belgium N.V.

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Advanced Packaging Conference Committee (APC)

Mehmet Akcit, Hesse GmbH


Mehmet Akcit,
Hesse GmbH

 

Frank Kuechenmeister,
GLOBALFOUNDRIES


Rolf Aschenbrenner,
Frauenhofer IZM

 
 
Andy Longford

Andy Longford, 
PandA Europe (co-chair)

 

Hans Auer,
Evatec
 
 
Jens Mueller, 
IMAPS Europe Chapter

 

Eric Beyne,
imec

 
 

Pascal Oberndorff,
NXP

 

Peter Cockburn,
Xcerra

 
 
Thomas Oppert,
Pac Tech

Ivan Galesic OSRAM

Ivan Galesic,
OSRAM

 
 

Amandine Pizzagalli,
Yole Développement

 

 

Michel Garnier,
STMicroelectronics

 
  Poupon, Gilles

Gilles Poupon,
CEA-Leti

 

 

Matthias Grossman,
Momentive

 
 

Klaus Pressel,
Infineon

 

 

Ingo Henkel,
Bosch

 
  Hugo_Pristauz

Hugo Pristauz,
BESI

 
Graham Jones
 

Graham Jones,
CMT Semiconductor Services

 
 

Reinhart Richter,
Ebara

 

Steffen Kröhnert,
NANIUM (co-chair)

 
  Mario_Saliba_Henkel_Ltd

Mario Saliba,
Henkel Ltd

 

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Fab Management Forum Committee (FMF)


Carsten Deuper,
NXP

  Joerg Recklies, Infineon

Joerg Recklies,
Infineon


Manfred Kraxenberger,
ABB Switzerland

 
  Thomas Richter, Robert Bosch GmbH

Thomas Richter,
Robert Bosch GmbH
 
Riccardo Martorelli,  LFoundry

Riccardo Martorelli,
LFoundry

 
  Bruno MOUREY TI

Bernhard Riester,
Texas Instruments Deutschland
 

Serge Nicoleau,
STMicroelectronics

 
  Mario Podewils
Mario von Podewils,
X-Fab Erfurt (chairman)

 

> top

 

 

Power Electronics Conference Committee


Dirk Brinkmann,
Bosch

 

Cassandra Melvin,
Atotech

Léa  Di Cioccio CEA-Leti
Léa  Di Cioccio,
CEA-Leti

 

  Thomas Neyer, VP R&D, Fairchild Semiconductor

Thomas Neyer,
VP R&D, Fairchild Semiconductor

 
Prof_Gueldner_TU_Dresden

Henry Güldner,
TU Dresden
 
 
Herbert Pairitsch,
Infineon (chairman)

 

Arnost Kopta,
ABB
 
 
Milan Rosina,
Yole Developpement

 

Joe Mai,
Jem Europe
 

 
     

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Innovation Village Committee

Jacques Berg


Jacques Berg,
TEL Venture Capital

 

Hyunchul Jeong,
Samsung Ventures 


Dr. Georg Bodammer, 
Siemens Technology Accelerator GmbH

 

Dr. Dieter Kraft,
Robert Bosch Venture Capital GmbH

Jong Sang Choi, Samsung Ventures

Jong Sang Choi,
Samsung Ventures 

 
 

Sebastien Paillat, 
ALIAD – Air Liquide Corporate Venture Capital

 
Christophe Desrumaux, CEA Investissement

Christophe Desrumaux,
CEA Investissement

 
 

Michael Steward,
AMAT

 

Vic Genco, 
3M New Ventures

 
 
Pascal Vanluchene, Capital-E

Pascal Vanluchene,
Capital-E

 

Rodolphe Heliot,
Aster

 
     

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FLEXEurope Committee

Karl-Heinz-Bock_Fraunhofer-EMFT


Karl-Heinz Bock,
Technische Universität Dresden

 

Christoph Kutter,
Fraunhofer EMFT (chairman)

Michael Ciesinski

Michael Ciesinski,
FlexTech Alliance
 
 
 

Christof Landesberger,
Fraunhofer EMFT

 

Istvan Denes,
Bosch
 
  Claus-Lichtenberg_Roth_Rau

Claus Lichtenberg,
Roth & Rau BV

jerome_gavillet_cttee

Jerome Gavillet,
CEA-LITEN
 
  Luigi Occhipinti

Luigi Occhipinti,
Uni of Cambridge

 
Mike Hack

Mike Hack,
Universal Display Corp. (UDC)
 
  Andreas Toennis

Frank Schulte,
AIXTRON SE
 
Ryoichi Ishihara

Ryoichi Ishihara,
TU Delft
 
  Andre-Zimmermann_Robert-Bosch
Andre Zimmermann,
Universität Stuttgart,
Hahn-Schickard-Gesellschaft

 
Antti Kemppainen

Antti Kemppainen,
VTT
 
     

> top

 

 

Materials Committee


Christoph Adelmann,
imec

 

Ionut Radu,
Soitec


Johan Bartha,
TU Dresden

 
 
 

Carlo Reita,
CEA-Leti

 

Markus Keil,
HSEB Dresden

 
 

Thomas Skotnicki,
STMicroelectronics

 

 

Cassandra Melvin,
Atotech

 
 

Thomas Weiss,
Nexperia

 

Thomas Mikolajick,
Namlab

 
 

Marcel Wieland,
GLOBALFOUNDRIES (chairman)

 

For more information on these dynamic committees and to find out how you can participate, contact the SEMI Europe office at semieurope@semi.org.

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