The SEMI Technology Arena is located in Hall 1 with a seating capacity of 80. Exhibitors will make presentations on their latest products and innovations. Attendance is free.
Exhibitors: Make a company presentation at SEMICON Europa and be exposed to 15.000 pre-registrants!
The Technology Arena presentations are seminar-style presentations, designed to provide exhibitors with an additional platform to engage and share product developments with an international audience.
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10:30
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SEMI Membership Video
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10:45
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SEMI market statistics presentation on MEMS
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11:00
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MEMS exhibitor presentation
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11:15
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Xactix presentation on MEMS
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11:30
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Multitest presentation on MEMS
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11:45
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"Temporary Bonding Enables TSV and 3D-Technology with Ultra-Thin Substrates" by Stefan Pargfrieder, EVG
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12:00
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"Recent Advances in Silicon DRIE for MEMS Manufacturing" by David Haynes, STS
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12:15
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"Anhydrous HF Vapor Technology for Stiction Free MEMS Release" by Paul Hammond, Primaxx
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13:15-14:00
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Lithography/Inspection exhibitor presentation
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14:15
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SEMI statistics presentation on Photovoltaic
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14:30-15:15
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Photovoltaic exhibitor presentation
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15:15
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"FFEM Contribution to the PV Industry" by Geert Duchesne, FUJIFILM Electronic Materials
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15:30
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"Power Supplies for PV Applications" by Dirk Ochs, Huettinger Elektronik
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15:45
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"MES in the Photovoltaic - A System for the Whole Supply Chain from Silicium to Module" by Ricco Walter, AIS Automation Dresden
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16:00
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"Multi-Level Large Scale Photovoltaic Production Facilities" by Philipp Neff, MW-Zanders
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16:15-17:00
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Photovoltaic exhibitor presentation
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10:30
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SEMI Membership Video
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10:45
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SEMI market statistics presentation on final manufacturing
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11:00-11:15
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Packaging exhibitor presentation
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11:15
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"High Resolution DRIE and Ultra-High Aspect Ratio Resist for TSV and 3D Packaging" by Michael Stan, MicroChem Corp.
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11:30
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"Advanced Bonding and Lithography Technologies for Wafer-Level 3D Integration and CIS Packaging" by Paul Lindner, EVG
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11:45
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"Advances in DRIE Technology for 200mm and 300mm Wafer Through Silicon Via (TSU) Applications" by David Hayes, STS
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12:00
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"ECD Technology for Advanced Packaging, Passive Components and MEMS" by Stefan Knipper, Technotrans
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12:15
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Multitest presentation on MEMS
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12:30-13:00
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Test exhibitor presentation
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13:30-14:30
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Automation exhibitor presentation
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13:45
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Automation presentation by Markus Thamm, Ricmar Sales & Services
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15:00-16:30
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Refurbished Equipment exhibitor presentation
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10:30
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SEMI Membership Video
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10:45-11:15
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R&D Science Park institute presentation
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11:15
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Fraunhofer IZM (Institute for Reliability and Microintegration) presentation
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11:30
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IMEC presentation
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11:45
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CEA-LETI presentation by Didier Louis
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12:00
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EFDS (Europäische Forschungsgesellschaft Dünne Schichten) presentation
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12:15
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“Hybrid Chipscale Integration for Inertial Sensor Clusters” by Stephan Warnat, Fraunhofer ISIT (Institute for Silicon Technology)
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12:30-13:00
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R&D Science Park institute presentation
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13:30
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Industry Association presentation - VDMA Productronic
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13:45
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Industry Association presentation - JEMI France
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14:00
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"Cool Silicon solutions from Saxony - Silicon Saxony - The Leading European Network and its Visions" by Heinz Martin Esser
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14:15
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Industry Association presentation - NMI
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14:30
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Industry Association presentation - JEMI UK
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